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1. 发明授权

US06492194B1 Method for the packaging of electronic components 失效
标题翻译：电子元器件封装方法
公开(公告)号：US06492194B1
公开(公告)日：2002-12-10
申请号：US09688358
申请日：2000-10-12
申请人： Jean-Marc Bureau , Jacques Elziere , Daniel Le Bail , Christian Lelong , Ngoc-Tuan Nguyen
发明人： Jean-Marc Bureau , Jacques Elziere , Daniel Le Bail , Christian Lelong , Ngoc-Tuan Nguyen
IPC分类号： H01L2156
CPC分类号： H01L21/561 , H01L21/56 , H01L23/3135 , H01L23/3164 , H01L23/552 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/15151 , H01L2924/181 , H01L2924/3025 , H03H3/08 , H01L2224/81 , H01L2224/05599 , H01L2924/00012
摘要： A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.
摘要翻译：一种用于包装电子部件的方法，包括将至少一个电子部件在其主动面侧安装到基部，所述基部包括外表面上的电触点和与外表面相对的表面上的连接焊盘，并且包括连接电触头和连接垫的第一系列通孔和用于抽吸的第二系列孔。在与电子部件的主动面相对的面上沉积可变形膜。可变形膜通过第二系列孔从与基座的外表面相对的面吸出，以便包覆电子部件。该方法还可以包括在可变形膜的顶部上的矿物沉积物以提供组件的气密密封和导电沉积以提供屏蔽。这种应用可能会发现特定应用于表面波滤波器。

2. 发明授权

US06954024B2 Unidirectional acoustic probe and method for making same 有权
标题翻译：单向声探头及其制作方法
公开(公告)号：US06954024B2
公开(公告)日：2005-10-11
申请号：US10204432
申请日：2001-03-09
申请人： Ngoc-Tuan Nguyen , Jacques Elziere , René Meliga
发明人： Ngoc-Tuan Nguyen , Jacques Elziere , René Meliga
IPC分类号： H04R17/00 , B06B1/06 , H01L41/09 , H01L41/22 , H02N2/00 , H04R31/00 , H01L41/04
CPC分类号： B06B1/0622 , Y10T29/42 , Y10T29/49005 , Y10T29/49128
摘要： A unidirectional acoustic probe including a high-performance interconnection network, and a method of manufacturing such a probe. The unidirectional acoustic probe includes linear piezoelectric transducers on the surface of a dielectric film. The dielectric film includes a connection device to electrically connect the piezoelectric transducers to a control device. The connection device includes primary connection pads, facing the piezoelectric transducers, secondary connection pads, offset with respect to the piezoelectric transducers, so that the transducers can be connected to the control device, and conducting tracks connecting the primary connection pads to the secondary connection pads. The conducting tracks are in a direction perpendicular to the direction defined by a major axis of the piezoelectric transducers.
摘要翻译：包括高性能互连网络的单向声学探针以及制造这种探针的方法。单向声波探头包括介电膜表面上的线性压电换能器。电介质膜包括将压电换能器电连接到控制装置的连接装置。连接装置包括面向压电换能器的主连接焊盘，辅助连接焊盘相对于压电换能器偏移，使得换能器可以连接到控制装置，并且将导线将主连接焊盘连接到次连接焊盘。导电轨道在与由压电换能器的长轴限定的方向垂直的方向上。

3. 发明授权

US5027822A Echography probe with improved connection circuit 失效
标题翻译：回波探头具有改进的连接电路
公开(公告)号：US5027822A
公开(公告)日：1991-07-02
申请号：US368336
申请日：1989-07-17
申请人： Jean-Francois Gelly , Jacques Elziere , Patrick Dubut
发明人： Jean-Francois Gelly , Jacques Elziere , Patrick Dubut
IPC分类号： A61B8/00 , B06B1/06 , G10K11/34 , H04R17/00
CPC分类号： B06B1/0622 , Y10T29/42
摘要： When making curved bar probes it is necessary, particularly at high frequency, to provide circuits for the connection of piezoelectric elements of the bars which are compatible with the curvature imposed to the bar after it has been fabricated flat. The invention overcomes such difficulty by adjoining on both sides of the elements a generally parallelepipedic relay metallized on at least two (12,13) of its adjacent faces to transpose one connection face (7) situated in plane which must be curved into one connection face (13) which is perpendicular and of which the orientation remains unchanged and parallel to a same plane during the curvature operation. As a result, the connection is simplified.
摘要翻译： PCT No.PCT / FR87 / 00462 Sec。 371日期：1989年7月17日 102（e）日期1989年7月17日PCT提交1987年11月24日PCT公布。出版物WO88 / 04090 日期：1988年6月2日。当制造弯曲杆探头时，特别是在高频下，需要提供用于连接杆的压电元件的电路，这些电路在被制造成平坦之后与施加到杆的曲率兼容。本发明克服了这样的困难，即将元件的两侧邻接在其相邻面的至少两个（12,13）上金属化的大致平行六面体的继电器，以转置位于平面中的一个连接面（7），该连接面必须弯曲成一个连接面（13），其在弯曲操作期间保持不变并且平行于同一平面。因此，简化了连接。

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