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1. 发明申请

US20050068737A1 Heatsink device and method 失效
标题翻译：散热装置及方法
公开(公告)号：US20050068737A1
公开(公告)日：2005-03-31
申请号：US10676230
申请日：2003-09-30
申请人： Javier Leija , Ioan Sauciuc , Gregory Chrysler
发明人： Javier Leija , Ioan Sauciuc , Gregory Chrysler
IPC分类号： H01L23/427 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
摘要： A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.
摘要翻译：提供了一种用于导热的方法和装置。显示的装置和方法包括由于使用活性热传递装置而耗散增加的热量的能力。示出了在被动热传递装置和主动传热装置之间共享必要的热传递的装置和方法，因此在保持各个部件的可靠性的同时增加散热量。示出了包括增加长度的散热器的装置和方法，其可以在传热结构和诸如空气的传热流体之间保持较大的温差。

2. 发明申请

US20090034197A1 HEATSINK, METHOD OF MANUFACTURING SAME, AND MICROELECTRONIC PACKAGE CONTAINING SAME 有权
标题翻译： HEATSINK，其制造方法和包含其的微电子封装
公开(公告)号：US20090034197A1
公开(公告)日：2009-02-05
申请号：US11772144
申请日：2007-06-30
申请人： Javier Leija , Ioan Sauciuc , Steve Frayne, JR.
发明人： Javier Leija , Ioan Sauciuc , Steve Frayne, JR.
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02
CPC分类号： H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.
摘要翻译：散热器包括基座（110,210,310），连接到基座的散热片（120,220,320）和连接到散热片的压电贴片（130,230,330）。压电贴片使翅片振荡，从而在翅片表面附近产生空气循环。即使对于相同的体积流速，这种气流干扰了翅片附近的边界层，并且与非振荡翅片相比，显着地增加了从翅片到空气的传热。

3. 发明授权

US07692922B2 Heatsink, method of manufacturing same, and microelectronic package containing same 有权
标题翻译：散热器，其制造方法以及含有其的微电子封装
公开(公告)号：US07692922B2
公开(公告)日：2010-04-06
申请号：US11772144
申请日：2007-06-30
申请人： Javier Leija , Ioan Sauciuc , Steve Frayne, Jr.
发明人： Javier Leija , Ioan Sauciuc , Steve Frayne, Jr.
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.
摘要翻译：散热器包括基座（110,210,310），连接到基座的散热片（120,220,320）和连接到散热片的压电贴片（130,230,330）。压电贴片使翅片振荡，从而在翅片表面附近产生空气循环。即使对于相同的体积流速，这种气流干扰了翅片附近的边界层，并且与非振荡翅片相比，显着地增加了从翅片到空气的传热。

4. 发明授权

US07642698B2 Dual direction rake piezo actuator 有权
标题翻译：双向耙式压电执行器
公开(公告)号：US07642698B2
公开(公告)日：2010-01-05
申请号：US11731749
申请日：2007-03-30
申请人： Javier Leija , Ioan Sauciuc
发明人： Javier Leija , Ioan Sauciuc
IPC分类号： H01L41/04 , H01L41/08
CPC分类号： F04D33/00
摘要： Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described.
摘要翻译：描述与使用和/或提供耙式压电致动器有关的方法和设备。在一个实施例中，压电贴片可以联接到多个叶片（例如，以使叶片摆动并在一个或多个散热器的翅片之间提供空气流）。还描述了其它实施例。

5. 发明申请

US20080218972A1 Cooling device, system containing same, and cooling method 审中-公开
标题翻译：冷却装置，含有其的系统和冷却方法
公开(公告)号：US20080218972A1
公开(公告)日：2008-09-11
申请号：US11714333
申请日：2007-03-06
申请人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
发明人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F04D33/00 , F04D29/582 , F28F3/02 , F28F13/10 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.
摘要翻译：冷却装置包括具有多个翅片（111）和具有致动器（121）的压电组件（120）和耦合到致动器的多个叶片（122）的散热器（110）。致动器包括多个金属电极（227）和多个压电层（228）。散热片的翅片与压电组件的叶片相互缠绕。

6. 发明申请

US20080238256A1 Dual direction rake piezo actuator 有权
标题翻译：双向耙式压电执行器
公开(公告)号：US20080238256A1
公开(公告)日：2008-10-02
申请号：US11731749
申请日：2007-03-30
申请人： Javier Leija , Ioan Sauciuc
发明人： Javier Leija , Ioan Sauciuc
IPC分类号： H02N2/00
CPC分类号： F04D33/00
摘要： Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described.
摘要翻译：描述与使用和/或提供耙式压电致动器有关的方法和设备。在一个实施例中，压电贴片可以联接到多个叶片（例如，以使叶片摆动并在一个或多个散热器的翅片之间提供空气流）。还描述了其它实施例。

7. 发明授权

US07082031B2 Heatsink device and method 失效
标题翻译：散热装置及方法
公开(公告)号：US07082031B2
公开(公告)日：2006-07-25
申请号：US10676230
申请日：2003-09-30
申请人： Javier Leija , Ioan Sauciuc , Gregory M. Chrysler
发明人： Javier Leija , Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
摘要： A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.
摘要翻译：提供一种用于导热的方法和装置。显示的装置和方法包括由于使用活性热传递装置而耗散增加的热量的能力。示出了在被动热传递装置和主动传热装置之间共享所需的热传递的装置和方法，从而增加了散发的散热量，同时保持了各个部件的可靠性。示出了包括增加长度的散热器的装置和方法，其可以在传热结构和诸如空气的传热流体之间保持较大的温差。

8. 发明授权

US07259961B2 Reconfigurable airflow director for modular blade chassis 有权
标题翻译：用于模块化刀片机箱的可重构气流导向器
公开(公告)号：US07259961B2
公开(公告)日：2007-08-21
申请号：US10875968
申请日：2004-06-24
申请人： Christopher D. Lucero , Javier Leija
发明人： Christopher D. Lucero , Javier Leija
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： A reconfigurable airflow director for modular blade chassis. The airflow director includes multiple duct channels having adjustable inlets and/or outlets. The airflow director may be reconfigured to adjust the amount of airflow across selected blades and selected zones on an individual blade. In one embodiment, snap-in airflow blockers are employed to block all or a portion of selected inlets or outlets to adjust the airflow through corresponding duct channels. In one embodiment, adjustable inlet vanes are employed to increase or decrease the size of adjacent inlets. In one embodiment, the airflow director is formed from multiple airflow director modules, each including an outer shell having multiple ribs extending therefrom to form multiple airflow channels, wherein the airflow director modules are stacked together to form a plurality of duct channels. Modular fan assemblies including multiple hot-swappable fans are employed to push and/or draw airflow through the duct channels of the airflow director.
摘要翻译：用于模块化刀片机箱的可重构气流导管。气流导向器包括具有可调入口和/或出口的多个管道。可以重新配置气流导向器以调节跨选择的叶片和单个叶片上的选定区域的气流量。在一个实施例中，使用卡入气流阻挡器来阻挡所有或一部分所选择的入口或出口以通过相应的管道通道调节气流。在一个实施例中，采用可调节的入口叶片来增加或减小相邻入口的尺寸。在一个实施例中，气流导向器由多个气流导向器模块形成，每个气流导向器模块包括具有从其延伸的多个肋的外壳，以形成多个气流通道，其中气流导向器模块堆叠在一起以形成多个管道通道。使用包括多个热插拔风扇的模块化风扇组件来推动和/或抽取气流通过气流导向器的导管通道。

9. 发明申请

US20070096298A1 Thermal management device attachment 失效
标题翻译：热管理装置附件
公开(公告)号：US20070096298A1
公开(公告)日：2007-05-03
申请号：US11265859
申请日：2005-11-03
申请人： William Handley , Edoardo Campini , Javier Leija
发明人： William Handley , Edoardo Campini , Javier Leija
IPC分类号： H01L23/34
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：热管理装置附接装置可以用于将热管理装置热耦合到电路板上的发热部件。附接装置可以包括安装在电路板的与发热部件相同的一侧并且围绕部件的至少一部分延伸的支撑部件。支撑构件可以包括电路板安装部分，热管理安装部分和在电路板安装部分和热管理安装部分之间延伸的侧部分。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

10. 外观设计

USD534182S1 Media device 有权
公开(公告)号：USD534182S1
公开(公告)日：2006-12-26
申请号：US29242527
申请日：2005-11-10
申请人： Javier Leija , Steve D. Porter , Mario A. Esquer
设计人： Javier Leija , Steve D. Porter , Mario A. Esquer

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