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1. 发明授权

US07864541B2 Airflow control system 有权
标题翻译：气流控制系统
公开(公告)号：US07864541B2
公开(公告)日：2011-01-04
申请号：US12686255
申请日：2010-01-12
申请人： Christopher D. Lucero , Javier Leija , James C. Shipley , Christopher A. Gonzales
发明人： Christopher D. Lucero , Javier Leija , James C. Shipley , Christopher A. Gonzales
IPC分类号： H05K5/00
CPC分类号： G06F1/20
摘要： A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：根据一个实施例的方法可以包括提供包括具有气流阻力的至少一个气流控制区的挡板组件。该实施例的方法还可以包括将所述挡板组件定位在通过底盘的空气流中。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

2. 发明授权

US07259961B2 Reconfigurable airflow director for modular blade chassis 有权
标题翻译：用于模块化刀片机箱的可重构气流导向器
公开(公告)号：US07259961B2
公开(公告)日：2007-08-21
申请号：US10875968
申请日：2004-06-24
申请人： Christopher D. Lucero , Javier Leija
发明人： Christopher D. Lucero , Javier Leija
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： A reconfigurable airflow director for modular blade chassis. The airflow director includes multiple duct channels having adjustable inlets and/or outlets. The airflow director may be reconfigured to adjust the amount of airflow across selected blades and selected zones on an individual blade. In one embodiment, snap-in airflow blockers are employed to block all or a portion of selected inlets or outlets to adjust the airflow through corresponding duct channels. In one embodiment, adjustable inlet vanes are employed to increase or decrease the size of adjacent inlets. In one embodiment, the airflow director is formed from multiple airflow director modules, each including an outer shell having multiple ribs extending therefrom to form multiple airflow channels, wherein the airflow director modules are stacked together to form a plurality of duct channels. Modular fan assemblies including multiple hot-swappable fans are employed to push and/or draw airflow through the duct channels of the airflow director.
摘要翻译：用于模块化刀片机箱的可重构气流导管。气流导向器包括具有可调入口和/或出口的多个管道。可以重新配置气流导向器以调节跨选择的叶片和单个叶片上的选定区域的气流量。在一个实施例中，使用卡入气流阻挡器来阻挡所有或一部分所选择的入口或出口以通过相应的管道通道调节气流。在一个实施例中，采用可调节的入口叶片来增加或减小相邻入口的尺寸。在一个实施例中，气流导向器由多个气流导向器模块形成，每个气流导向器模块包括具有从其延伸的多个肋的外壳，以形成多个气流通道，其中气流导向器模块堆叠在一起以形成多个管道通道。使用包括多个热插拔风扇的模块化风扇组件来推动和/或抽取气流通过气流导向器的导管通道。

3. 发明授权

US07420804B2 Liquid cooling system including hot-swappable components 有权
标题翻译：液体冷却系统包括热插拔部件
公开(公告)号：US07420804B2
公开(公告)日：2008-09-02
申请号：US10881884
申请日：2004-06-30
申请人： Javier Leija , Christopher D. Lucero , Christopher A. Gonzales
发明人： Javier Leija , Christopher D. Lucero , Christopher A. Gonzales
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating. Other embodiments are described and claimed.
摘要翻译：本说明书公开了一种装置，包括具有入口和出口的冷板，冷板可附接到热源，具有入口和出口的热交换器，其中热交换器的出口连接到冷板和包括至少一个泵的热插拔泵模块，所述泵模块联接到所述冷板和所述热交换器。本说明书还公开了一种方法，其包括使用闭环冷却系统冷却热源，所述闭环冷却系统包括具有入口和出口的冷板，所述冷板可附接到所述热源，具有入口和出口的热交换器，其中所述热交换器的出口连接到所述冷板的入口，以及热交换泵模块，其包括至少一个泵，所述泵模块联接到所述冷板和所述热交换器，以及移除或安装所述泵模块，同时冷却系统正在运行。描述和要求保护其他实施例。

4. 发明申请

US20100118490A1 AIRFLOW CONTROL SYSTEM 有权
标题翻译：气流控制系统
公开(公告)号：US20100118490A1
公开(公告)日：2010-05-13
申请号：US12686255
申请日：2010-01-12
申请人： Christopher D. Lucero , Javier Leija , James C. Shipley , Christopher A. Gonzales
发明人： Christopher D. Lucero , Javier Leija , James C. Shipley , Christopher A. Gonzales
IPC分类号： H05K7/20 , F28F13/12
CPC分类号： G06F1/20
摘要： A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：根据一个实施例的方法可以包括提供包括具有气流阻力的至少一个气流控制区的挡板组件。该实施例的方法还可以包括将所述挡板组件定位在通过底盘的空气流中。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

5. 发明授权

US07299639B2 Thermoelectric module 有权
标题翻译：热电模块
公开(公告)号：US07299639B2
公开(公告)日：2007-11-27
申请号：US10874525
申请日：2004-06-22
申请人： Javier Leija , Christopher D. Lucero
发明人： Javier Leija , Christopher D. Lucero
IPC分类号： F25B21/02
CPC分类号： H01L35/30 , H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.
摘要翻译：具有集成在基底层中的高导热性材料区域的热电模块。对于一个实施例，铜焊盘被集成到热电模块的热侧的基板的外表面中。铜焊盘允许将热去除装置直接连接到热电模块，从而降低热阻。可以通过衬底形成热通孔，以进一步降低热阻。

6. 发明授权

US07209364B2 Circuit board latch system 有权
标题翻译：电路板闩锁系统
公开(公告)号：US07209364B2
公开(公告)日：2007-04-24
申请号：US11024625
申请日：2004-12-29
申请人： James C. Shipley , Javier Leija , Christopher A. Gonzales , Christopher D. Lucero
发明人： James C. Shipley , Javier Leija , Christopher A. Gonzales , Christopher D. Lucero
IPC分类号： H05K7/14
CPC分类号： H05K7/1405 , E05B53/003 , E05B65/006 , E05C9/04
摘要： A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.
摘要翻译：根据一个实施例的方法可以包括提供包括电路板和可旋转旋钮的电路板组件和经由连杆与所述旋钮连接的至少一个闩锁。该实施例的方法还可以包括通过旋转旋钮将至少一个闩锁移动到缩回位置，并将电路板组件插入到底盘中。该方法可以包括将闩锁移动到延伸位置。当然，在不脱离本实施例的情况下，可以进行许多替代，变化和修改。

7. 外观设计

USD427592S Processor-based system 失效
公开(公告)号：USD427592S
公开(公告)日：2000-07-04
申请号：US114313
申请日：1999-11-22
申请人： Arthur L. Gaudette , Richard J. Takahashi , Christopher D. Lucero
设计人： Arthur L. Gaudette , Richard J. Takahashi , Christopher D. Lucero

8. 发明授权

US06880345B1 Cooling system for an electronic component 有权
标题翻译：电子元件冷却系统
公开(公告)号：US06880345B1
公开(公告)日：2005-04-19
申请号：US10701727
申请日：2003-11-04
申请人： Javier M. Leija , Christopher D. Lucero
发明人： Javier M. Leija , Christopher D. Lucero
IPC分类号： H01L23/34 , H01L23/38 , F25B21/02
CPC分类号： H01L23/34 , H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
摘要翻译：提供了一种用于电子部件的冷却系统。冷却系统包括多个用于放置在电子部件的多个不同区域上方的热电元件。冷却系统具有连接到热电元件的多个导体，用于向热电元件提供电流，使得热电元件将热量从各个区域抽出。冷却系统具有连接到导体的控制装置，用于基于在不同区域产生的热来相对于彼此控制提供给热电元件的电流。

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