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1. 发明申请

US20080218972A1 Cooling device, system containing same, and cooling method 审中-公开
标题翻译：冷却装置，含有其的系统和冷却方法
公开(公告)号：US20080218972A1
公开(公告)日：2008-09-11
申请号：US11714333
申请日：2007-03-06
申请人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
发明人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F04D33/00 , F04D29/582 , F28F3/02 , F28F13/10 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.
摘要翻译：冷却装置包括具有多个翅片（111）和具有致动器（121）的压电组件（120）和耦合到致动器的多个叶片（122）的散热器（110）。致动器包括多个金属电极（227）和多个压电层（228）。散热片的翅片与压电组件的叶片相互缠绕。

2. 发明授权

US07321184B2 Rake shaped fan 有权
标题翻译：耙式风扇
公开(公告)号：US07321184B2
公开(公告)日：2008-01-22
申请号：US11200675
申请日：2005-08-09
申请人： Seri Lee , Ioan Sauciuc
发明人： Seri Lee , Ioan Sauciuc
IPC分类号： H01L41/08
CPC分类号： F04D33/00 , H05K7/20172
摘要： In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.
摘要翻译：在一些实施例中，压电致动器联接到具有耙形的刀片。刀片可以包括具有从其延伸的两个或更多个插脚的基座。一个或多个插脚的至少一部分可以位于散热器的散热片之间。公开和要求保护其他实施例。

3. 发明申请

US20070037506A1 Rake shaped fan 有权
标题翻译：耙式风扇
公开(公告)号：US20070037506A1
公开(公告)日：2007-02-15
申请号：US11200675
申请日：2005-08-09
申请人： Seri Lee , Ioan Sauciuc
发明人： Seri Lee , Ioan Sauciuc
IPC分类号： H05K5/00
CPC分类号： F04D33/00 , H05K7/20172
摘要： In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.
摘要翻译：在一些实施例中，压电致动器联接到具有耙形的刀片。叶片可以包括具有从其延伸的两个或更多个插脚的基部。一个或多个插脚的至少一部分可以位于散热器的散热片之间。公开和要求保护其他实施例。

4. 发明授权

US07499274B2 Method, apparatus and system for enclosure enhancement 失效
标题翻译：用于外壳增强的方法，装置和系统
公开(公告)号：US07499274B2
公开(公告)日：2009-03-03
申请号：US11450215
申请日：2006-06-08
申请人： Scott Noble , Seri Lee
发明人： Scott Noble , Seri Lee
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20963
摘要： In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.
摘要翻译：在一些实施例中，描述了用于增强诸如计算设备的设备的外壳的方法，装置和系统。该系统可以包括框架和装置，其中该装置包括可以形成计算装置的盖的外壳和基座。在一些实施例中，当与基底相比时，外壳可以由具有不同热性质的材料构成。在一些实施例中，外壳可以包括各种配置的通风口或开口。在一些实施例中，基座可以是散热器或散热器。可以描述其他实施例。

5. 发明授权

US07495922B2 Spring loaded heat sink retention mechanism 有权
标题翻译：弹簧加载散热片固定机构
公开(公告)号：US07495922B2
公开(公告)日：2009-02-24
申请号：US11729539
申请日：2007-03-29
申请人： Johan F. Ploeg , Seri Lee
发明人： Johan F. Ploeg , Seri Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H01L23/40 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.
摘要翻译：描述了提供弹簧加载的散热装置保持机构的方法和装置。在一个实施例中，使用具有弹簧部分的一个或多个销来保持散热装置和印刷电路板之间的弹簧力。还描述了其它实施例。

6. 发明申请

US20080068790A1 FAN INTEGRATED THERMAL MANAGEMENT DEVICE 有权
标题翻译：风扇集成热管理装置
公开(公告)号：US20080068790A1
公开(公告)日：2008-03-20
申请号：US11532978
申请日：2006-09-19
申请人： Seri Lee
发明人： Seri Lee
IPC分类号： G06F1/20
CPC分类号： G06F1/20
摘要： A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include a heat-conductive base and a plurality of heat-conductive extensions extending from the base and defining one or more fan blade regions. One or more fans may be mounted relative to the heat-conductive extensions such that at least one fan blade is located in the fan blade region and is configured to rotate through the fan blade region. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：诸如散热器的风扇集成热管理装置可以包括集成式风扇，以促进空气流过装置。热管理装置的一个实施例可以包括导热基座和从基座延伸并限定一个或多个风扇叶片区域的多个导热延伸部。可以相对于导热延伸部安装一个或多个风扇，使得至少一个风扇叶片位于风扇叶片区域中并且构造成旋转穿过风扇叶片区域。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

7. 发明授权

US07019977B2 Method of attaching non-adhesive thermal interface materials 失效
标题翻译：安装非粘合热界面材料的方法
公开(公告)号：US07019977B2
公开(公告)日：2006-03-28
申请号：US10740956
申请日：2003-12-17
申请人： Seri Lee , Seung M. You , Jae W. Chang
发明人： Seri Lee , Seung M. You , Jae W. Chang
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/3128 , H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011
摘要： Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.
摘要翻译：将散热器固定到诸如集成电路封装的电子设备上，包括仅将粘合剂层施加到热界面材料上的表面的周边。使用粘合剂层将热界面材料施加到散热器和/或集成电路封装。散热器与集成电路封装件热接触，以在操作过程中提取热量。

8. 发明授权

US06501655B1 High performance fin configuration for air cooled heat sinks 失效
标题翻译：空气冷却散热片的高性能翅片配置
公开(公告)号：US06501655B1
公开(公告)日：2002-12-31
申请号：US09716877
申请日：2000-11-20
申请人： Seri Lee , Lloyd L. Pollard, II
发明人： Seri Lee , Lloyd L. Pollard, II
IPC分类号： H05K720
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H05K7/1431 , H01L2924/00
摘要： A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions. The thermally conductive base plate is attached to the array such that the thermally conductive base plate is in close proximity to the bottom portion. The top and bottom portions extend outwardly from the thermally conductive base plate. The top portion of the array further extends laterally beyond the bottom portion of the array. The top and bottom portions of the array are of sufficient size so as to allow components on a motherboard to encroach around the integrated circuit device.
摘要翻译：在一个示例性实施例中，散热系统和从集成电路器件提取热量的方法包括导热基板。散热系统和方法还包括具有顶部和底部的基本上平行的翅片结构的阵列。导热基板附接到阵列，使得导热基板紧邻底部。顶部和底部从导热基板向外延伸。阵列的顶部部分进一步横向延伸超过阵列的底部。阵列的顶部和底部具有足够的尺寸，以便允许主板上的部件侵入集成电路装置。

9. 发明授权

US10390991B2 Medical devices incorporating thermoelectric transducer and controller 有权
公开(公告)号：US10390991B2
公开(公告)日：2019-08-27
申请号：US13584853
申请日：2012-08-14
申请人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
发明人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
IPC分类号： A61F7/00 , F25B21/02 , H01L35/32
摘要： A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.

10. 发明授权

US08833435B2 Microscale cooling apparatus and method 有权
标题翻译：微型冷却装置及方法
公开(公告)号：US08833435B2
公开(公告)日：2014-09-16
申请号：US12511945
申请日：2009-07-29
申请人： Matthew Determan , Scott W. C. H. Lee , Abel Manuel Siu Ho , Seri Lee
发明人： Matthew Determan , Scott W. C. H. Lee , Abel Manuel Siu Ho , Seri Lee
IPC分类号： F28F27/00 , F28F3/12 , F28D15/02 , H01L23/427 , F28D21/00
CPC分类号： F28D15/0266 , F28D2021/0029 , F28D2021/0031 , F28F3/12 , F28F9/02 , F28F2250/04 , F28F2260/02 , F28F2270/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).
摘要翻译：描述了一种用于提供散热器组件的方法和系统。组件包括两相散热器，冷凝器和泵。两相散热器可以包括容纳沸腾冷却剂流和交联连接通道的流动微通道，其至少部分平衡沸腾冷却剂的压力场。冷凝器从散热器接收冷却液并除去热量。泵通过组件驱动冷却剂。在一个方面，组件是用于冷却剂的封闭系统。在另一方面，冷凝器包括第一和第二板以及它们之间的热交换面。冷却液从散热片流过板。气态冷却剂通过热交换表面。在一个方面，气态冷却剂与冷却剂流动的方向相反。在一个方面，至少一个板包括用于绝缘板的一部分的虚拟通道。

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