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1. 发明申请

US20050159520A1 Crosslinkable fill compositons for uniformly protecting via and contact holes 有权
标题翻译：可交联填料组合物，用于均匀保护孔和接触孔
公开(公告)号：US20050159520A1
公开(公告)日：2005-07-21
申请号：US10964288
申请日：2004-10-13
申请人： James Lamb , Xie Shao
发明人： James Lamb , Xie Shao
IPC分类号： H01L21/312 , H01L21/768 , C08K5/17
CPC分类号： H01L21/02118 , H01L21/02282 , H01L21/312 , H01L21/76808 , Y10T428/31663 , Y10T428/31667 , Y10T428/31692
摘要： A via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.
摘要翻译：提供了一种通孔和接触孔填充组合物和在双镶嵌生产电路中使用组合物的方法。广泛地，填充组合物包括一定量的固体组分，包括聚合物粘合剂和固体组分的溶剂体系。溶剂系统的沸点小于组合物的交联温度。用于溶剂系统的优选溶剂包括选自醇，醚，二醇醚，酰胺，酮及其混合物的那些溶剂。优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂，特别优选聚酯。在使用中，将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面，随后加热到组成回流温度，以使组合物均匀地流入并覆盖孔形成表面和基底表面。然后将组合物固化，并进行双镶嵌工艺的其余部分。

2. 发明授权

US5892096A Non-subliming mid-UV dyes and ultra-thin organic arcs having differential solubility 失效
标题翻译：非升华中紫外线染料和具有差异溶解度的超薄有机电弧
公开(公告)号：US5892096A
公开(公告)日：1999-04-06
申请号：US598711
申请日：1996-02-08
申请人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
发明人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
IPC分类号： C07C45/74 , C07C49/84 , C07C255/41 , G03F7/09 , C07C255/09
CPC分类号： G03F7/091 , C07C255/41 , C07C45/74 , C07C49/84
摘要： Mid-UV dyes enabling ultra thin antireflection coatings for multi-layer i-line photoetching are produced from bichalcones; bis-a-cyanoacrylates/bis-cyanoacrylamides; and 1.4 divinylbenzenes. The dyes are nonsubliminal and differentially insoluble in standard photoresist solvents.
摘要翻译：使用双层i线光刻技术实现超薄抗反射涂层的紫外线紫外线染料由双柠檬烯生产; 双氰基丙烯酸酯/双氰基丙烯酰胺; 和1.4二乙烯基苯。染料在标准光刻胶溶剂中是非共沸的和差异不溶的。

3. 发明授权

US5688987A Non-subliming Mid-UV dyes and ultra-thin organic arcs having differential solubility 失效
标题翻译：不升华的中紫外线染料和具有不同溶解度的超薄有机电弧
公开(公告)号：US5688987A
公开(公告)日：1997-11-18
申请号：US336340
申请日：1994-11-09
申请人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
发明人： Jim D. Meador , Xie Shao , Vandana Krishnamurthy , Earnest C. Murphy , Tony D. Flaim , Terry Lowell Brewer
IPC分类号： C07C45/74 , C07C49/84 , C07C255/41 , G03F7/09 , C07C255/00
CPC分类号： G03F7/091 , C07C255/41 , C07C45/74 , C07C49/84
摘要： Mid-UV dyes enabling ultra thin antireflection coatings for multi-layer i-line photoetching are produced from bichalcones; bis-a-cyanoacrylates/bis-cyanoacrylamides; and 1.4 divinylbenzenes. The dyes are nonsubliminal and differentially insoluble in standard photoresist solvents.
摘要翻译：使用双层i线光刻技术实现超薄抗反射涂层的紫外线紫外线染料由双柠檬烯生产; 双氰基丙烯酸酯/双氰基丙烯酰胺; 和1.4二乙烯基苯。染料在标准光刻胶溶剂中是非共沸的和差异不溶的。

4. 发明授权

US06391472B1 Fill material for dual damascene processes 有权
标题翻译：填充双镶嵌工艺的材料
公开(公告)号：US06391472B1
公开(公告)日：2002-05-21
申请号：US09931264
申请日：2001-08-16
申请人： James E. Lamb, III , Xie Shao
发明人： James E. Lamb, III , Xie Shao
IPC分类号： B21D3900
CPC分类号： H01L21/76808 , H01L21/312 , Y10T428/12556 , Y10T428/24802
摘要： An improved via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.
摘要翻译：提供了一种改进的通孔和接触孔填充组合物以及在双镶嵌生产电路中使用该组合物的方法。广泛地，填充组合物包括一定量的固体组分，包括聚合物粘合剂和固体组分的溶剂体系。溶剂系统的沸点小于组合物的交联温度。用于溶剂系统的优选溶剂包括选自醇，醚，二醇醚，酰胺，酮及其混合物的那些溶剂。优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂，特别优选聚酯。在使用中，将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面，随后加热到组成回流温度，以使组合物均匀地流入并覆盖孔形成表面和基底表面。然后将组合物固化，并进行双镶嵌工艺的其余部分。

5. 发明授权

US5919598A Method for making multilayer resist structures with thermosetting anti-reflective coatings 失效
标题翻译：制备具有热固性抗反射涂层的多层抗蚀剂结构的方法
公开(公告)号：US5919598A
公开(公告)日：1999-07-06
申请号：US692714
申请日：1996-08-06
申请人： Tony D. Flaim , Jim D. Meador , Xie Shao , Terry Lowell Brewer
发明人： Tony D. Flaim , Jim D. Meador , Xie Shao , Terry Lowell Brewer
IPC分类号： C08G59/14 , C08G59/16 , C08G59/40 , C08G59/68 , C08L63/00 , C09D163/00 , G03F7/09 , G03C1/795 , C08L5/04 , C08L59/00 , G03C1/835
CPC分类号： G03F7/091 , C08G59/1455 , C08G59/68 , C08L63/00 , Y10S430/136 , Y10S522/904
摘要： A method for making multilayer resist structures for microlithographic processing using a thermosetting anti-reflective coating is disclosed for a broad range of exposure wavelengths, said coating containing an active curing catalyst, ether or ester linkages derived from epoxy functionality greater than 3.0, a dye-grafted hydroxyl-functional oligomer, and an alkylated aminoplast crosslinking agent, all present in a low-to-medium alcohol-containing solvent.
摘要翻译：公开了使用热固性抗反射涂层进行微光刻处理的多层抗蚀剂结构的方法，用于宽范围的曝光波长，所述涂层含有活性固化催化剂，衍生自大于3.0的环氧官能团的醚或酯键，接枝的羟基官能低聚物和烷基化的氨基塑料交联剂，均存在于低至中等含醇溶剂中。

6. 发明授权

US06670425B2 Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings 有权
标题翻译：具有环氧化物环的聚合物的抗反射涂层与光衰减化合物和未反应的环氧化物环反应
公开(公告)号：US06670425B2
公开(公告)日：2003-12-30
申请号：US09874783
申请日：2001-06-05
申请人： Rama Puligadda , James E. Lamb, III , Tony D. Flaim , Runhui Huang , Xie Shao
发明人： Rama Puligadda , James E. Lamb, III , Tony D. Flaim , Runhui Huang , Xie Shao
IPC分类号： B32B2706
CPC分类号： G03F7/091 , Y10S438/952 , Y10T428/31511 , Y10T428/31525
摘要： Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.
摘要翻译：提供抗反射组合物和使用具有低介电常数材料的那些组合物的方法。在一个实施方案中，组合物包括包含具有未反应的环氧基团的重复单体的聚合物。在另一个实施方案中，聚合物还包含包含与光衰减化合物反应以便打开环的环氧化物环的重复单体。组合物可以施加到电介质层，以便在双镶嵌工艺期间最小化或防止反射，同时阻挡当将有机抗反射涂层施加到低介电常数层时通常发生的通孔或光致抗蚀剂中毒。

7. 发明授权

US06663916B2 Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings 有权
公开(公告)号：US06663916B2
公开(公告)日：2003-12-16
申请号：US10174173
申请日：2002-06-18
申请人： Rama Puligadda , James E. Lamb, III , Tony D. Flaim , Runhui Huang , Xie Shao
发明人： Rama Puligadda , James E. Lamb, III , Tony D. Flaim , Runhui Huang , Xie Shao
IPC分类号： B05D302
CPC分类号： G03F7/091 , Y10S438/952 , Y10T428/31511 , Y10T428/31525
摘要： Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

8. 发明授权

US5919599A Thermosetting anti-reflective coatings at deep ultraviolet 失效
标题翻译：深紫外线热固性抗反射涂层
公开(公告)号：US5919599A
公开(公告)日：1999-07-06
申请号：US940169
申请日：1997-09-30
申请人： Jim Meador , Douglas J. Guerrero , Xie Shao , Vandana Krishnamurthy
发明人： Jim Meador , Douglas J. Guerrero , Xie Shao , Vandana Krishnamurthy
IPC分类号： G03F7/11 , C08F8/00 , C08F220/32 , C08F283/10 , C09D133/06 , G03F7/09 , G03C1/492 , C08K63/00
CPC分类号： G03F7/091 , C08F283/10 , C08F8/18 , C09D133/062 , C08F2800/10 , C08F2800/20 , C08F2810/20
摘要： Anti-reflective coating compositions having improved etch rate, inter alia, are prepared from certain high molecular weight polymers and copolymers, particularly glycidyl methacrylate with grafted dyes.
摘要翻译：特别是由某些高分子量聚合物和共聚物，特别是具有接枝染料的甲基丙烯酸缩水甘油酯制备具有改善的蚀刻速率的抗反射涂料组合物。

9. 发明授权

US07998318B2 Crosslinkable fill compositions for uniformly protecting via and contact holes 有权
标题翻译：用于均匀保护通孔和接触孔的可交联填充组合物
公开(公告)号：US07998318B2
公开(公告)日：2011-08-16
申请号：US10964288
申请日：2004-10-13
申请人： James E. Lamb, III , Xie Shao
发明人： James E. Lamb, III , Xie Shao
IPC分类号： H01L21/28 , H01L21/302 , H01L21/3065 , H01L21/3205 , H01L21/312 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/02118 , H01L21/02282 , H01L21/312 , H01L21/76808 , Y10T428/31663 , Y10T428/31667 , Y10T428/31692
摘要： A via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.
摘要翻译：提供了一种通孔和接触孔填充组合物和在双镶嵌生产电路中使用组合物的方法。广泛地，填充组合物包括一定量的固体组分，包括聚合物粘合剂和固体组分的溶剂体系。溶剂系统的沸点小于组合物的交联温度。用于溶剂系统的优选溶剂包括选自醇，醚，二醇醚，酰胺，酮及其混合物的那些溶剂。优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂，特别优选聚酯。在使用中，将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面，随后加热到组成回流温度，以使组合物均匀地流入并覆盖孔形成表面和基底表面。然后将组合物固化，并进行双镶嵌工艺的其余部分。

10. 发明授权

US07026237B2 Fill material for dual damascene processes 有权
公开(公告)号：US07026237B2
公开(公告)日：2006-04-11
申请号：US10759447
申请日：2004-01-16
申请人： James E. Lamb, III , Xie Shao
发明人： James E. Lamb, III , Xie Shao
IPC分类号： H01L21/4763
CPC分类号： H01L21/76808 , H01L21/312 , Y10T428/12556 , Y10T428/24802
摘要： An improved via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.

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