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    • 3. 发明申请
    • Lithography pattern shrink process and articles
    • 平版印刷图案收缩工艺和文章
    • US20050147901A1
    • 2005-07-07
    • US11063411
    • 2005-02-23
    • Ram SabnisJames Lamb
    • Ram SabnisJames Lamb
    • H01L21/28B32B3/10G03C5/00G03F7/00G03F7/16G03F7/40H01L21/00H01L21/027H01L21/312H01L21/768
    • H01L21/02274G03F7/40H01L21/02118H01L21/0212H01L21/312H01L21/76816H01L21/76885Y10T428/24331Y10T428/24562
    • Novel processes of applying a thin, uniform, conformal organic polymeric film by a wide variety of deposition processes into lithography pattern substrates are provided. The inventive processes result in shrinking of the gaps in the lithography pattern equally, thus producing a smaller dimension. The amount of pattern shrinkage is selectively controlled by controlling the deposition rate to provide the desired final structure dimension. A wide variety of organic films is used as materials for these films. The inventive methods are applicable to any patterning technique used in lithography to provide a reduction in pattern sizes. Examples of the applicable device levels include the production of gate layers, ion implantation of active device layers and substantive metal layers, dielectric patterning, interconnect processes produced by damascene, dual damascene, backend packaging layers, and devices requiring multiple layers deposited by electrodeposition, CVD or sputtering. The inventive methods are useful for providing highly conformal coatings on large surface substrates having super submicron (i.e., 0.15 μm or smaller) features. The process is environmentally friendly and relatively low cost compared to other options.
    • 提供了通过各种各样的沉积工艺将薄的,均匀的共形有机聚合物膜应用于光刻图案衬底的新方法。 本发明的方法导致平版印刷图案中间隙的缩小,从而产生更小的尺寸。 通过控制沉积速率以提供期望的最终结构尺寸来选择性地控制图案收缩量。 使用各种有机薄膜作为这些薄膜的材料。 本发明的方法适用于在光刻中使用的任何图案化技术以提供图案尺寸的减小。 可应用的器件级别的实例包括栅极层的生产,有源器件层的离子注入和实质金属层,电介质图案化,由镶嵌生成的互连工艺,双镶嵌,后端封装层以及需要通过电沉积沉积多层的器件 或溅射。 本发明的方法可用于在具有超亚微米(即0.15μm或更小)特征的大表面基底上提供高保形涂层。 与其他选项相比,该过程是环保的,成本相对较低。
    • 7. 发明申请
    • AUTOMATED PROCESS AND APPARATUS FOR PLANARIZATION OF TOPOGRAPHICAL SURFACES
    • 自动化过程和设备的地形表面平面设计
    • US20070105384A1
    • 2007-05-10
    • US11619484
    • 2007-01-03
    • Jeremy McCutcheonJames Lamb
    • Jeremy McCutcheonJames Lamb
    • H01L21/461
    • H01L21/31058H01L21/67092H01L21/6719
    • An improved apparatus (20) and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus (20) includes a planarizing unit (28) preferably having an optical flat flexible sheet (88) and a backup optical flat body (82), and a curing assembly (30). In operation, a substrate (78) having a planarizable coating (76) is placed within a vacuum chamber (26) beneath sheet (88) and body (82). A pressure differential is created across sheet (88) so as to deflect the sheet into contact with a central region C of the coating (76), whereupon the coating (76) is brought into full planarizing contact with sheet (88) and body (82) by means of a support (114) and vacuum chuck (120); at this point the coating (76) is cured using assembly (30). After curing, a pressure differential is established across sheet (88) for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet (88) and coating (76).
    • 提供了一种改进的装置(20)和方法,用于有效的高速接触平面化涂覆的可固化基板例如微电子器件以实现非常高的平坦度。 装置(20)包括平坦化单元(28),优选地具有光学平面柔性片(88)和备用光学平坦体(82),以及固化组件(30)。 在操作中,具有可平面化涂层(76)的基板(78)被放置在薄片(88)和主体(82)下方的真空室(26)内。 在片材(88)之间产生压差,以便将片材偏转成与涂层(76)的中心区域C接触,于是涂层(76)与片材(88)和主体(88)完全平坦化接触 82)通过支撑件(114)和真空卡盘(120); 在这一点上,涂层(76)使用组件(30)固化。 固化后,在片材(88)之间建立用于将片材从涂层的周边部分P顺序分离,然后片材(88)和涂层(76)的完全分离的压力差。
    • 10. 发明申请
    • Crosslinkable fill compositons for uniformly protecting via and contact holes
    • 可交联填料组合物,用于均匀保护孔和接触孔
    • US20050159520A1
    • 2005-07-21
    • US10964288
    • 2004-10-13
    • James LambXie Shao
    • James LambXie Shao
    • H01L21/312H01L21/768C08K5/17
    • H01L21/02118H01L21/02282H01L21/312H01L21/76808Y10T428/31663Y10T428/31667Y10T428/31692
    • A via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.
    • 提供了一种通孔和接触孔填充组合物和在双镶嵌生产电路中使用组合物的方法。 广泛地,填充组合物包括一定量的固体组分,包括聚合物粘合剂和固体组分的溶剂体系。 溶剂系统的沸点小于组合物的交联温度。 用于溶剂系统的优选溶剂包括选自醇,醚,二醇醚,酰胺,酮及其混合物的那些溶剂。 优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂,特别优选聚酯。 在使用中,将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面,随后加热到组成回流温度,以使组合物均匀地流入并覆盖 孔形成表面和基底表面。 然后将组合物固化,并进行双镶嵌工艺的其余部分。