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    • 4. 发明申请
    • Method of making a planar electrode
    • 制作平面电极的方法
    • US20110204019A1
    • 2011-08-25
    • US12927552
    • 2010-11-15
    • Jonathan BornsteinDavid HansenSteven W. Longcor
    • Jonathan BornsteinDavid HansenSteven W. Longcor
    • H05K3/00
    • Chemical mechanical polishing (CMP) of thin film materials using a slurry including a surfactant chemical operative to polish high portions of the film being planarized while preventing the polishing of low portions of the film is disclosed. The low portions can be in a step reduction region of a deposited film. The CMP process can be used for form a planar surface upon which subsequent thin-film layers can be deposited, such as an electrically conductive material for an electrode. The subsequently deposited thin-film layers are substantially planar as deposited without having to use CMP. The resulting thin-film layers are planar and have a uniform cross-sectional thickness that can be beneficial for layers of memory material for a memory cell. The processing can be performed back-end-of-the-line (BEOL) on a previously front-end-of-the-line (FEOL) processed substrate (e.g., silicon wafer) and the BEOL process can be used to fabricate two-terminal non-volatile cross-point memory arrays.
    • 公开了使用包括表面活性剂化学品的浆料的薄膜材料的化学机械抛光(CMP),其可操作以抛光待平坦化的膜的高部分,同时防止薄膜的低部分的抛光。 低部分可以在沉积膜的阶梯还原区域中。 CMP工艺可以用于形成平坦表面,在该平面上可以沉积后续的薄膜层,例如用于电极的导电材料。 随后沉积的薄膜层基本上是平面的,不必使用CMP沉积。 所得到的薄膜层是平面的并且具有均匀的横截面厚度,这对存储单元的记忆材料层是有利的。 可以在先前的前端(FEOL)处理的基板(例如,硅晶片)上执行后端处理(BEOL),并且BEOL过程可用于制造两个 - 终端非易失性交叉点存储器阵列。
    • 5. 发明授权
    • Method of making a planar electrode
    • 制作平面电极的方法
    • US07832090B1
    • 2010-11-16
    • US12660424
    • 2010-02-25
    • Jonathan BornsteinDavid HansenSteven W. Longcor
    • Jonathan BornsteinDavid HansenSteven W. Longcor
    • H01R43/00
    • H01L27/24H01L21/3212H01L21/7684H01L21/76849Y10T29/49117Y10T29/49126Y10T29/4913Y10T29/49155Y10T29/49165
    • Chemical mechanical polishing (CMP) of thin film materials using a slurry including a surfactant chemical operative to polish high portions of the film being planarized while preventing the polishing of low portions of the film is disclosed. The low portions can be in a step reduction region of a deposited film. The CMP process can be used for form a planar surface upon which subsequent thin-film layers can be deposited, such as an electrically conductive material for an electrode. The subsequently deposited thin-film layers are substantially planar as deposited without having to use CMP. The resulting thin-film layers are planar and have a uniform cross-sectional thickness that can be beneficial for layers of memory material for a memory cell. The processing can be performed back-end-of-the-line (BEOL) on a previously front-end-of-the-line (FEOL) processed substrate (e.g., silicon wafer) and the BEOL process can be used to fabricate two-terminal non-volatile cross-point memory arrays.
    • 公开了使用包括表面活性剂化学品的浆料的薄膜材料的化学机械抛光(CMP),其可操作以抛光待平坦化的膜的高部分,同时防止薄膜的低部分的抛光。 低部分可以在沉积膜的阶梯还原区域中。 CMP工艺可以用于形成平坦表面,在该平面上可以沉积后续的薄膜层,例如用于电极的导电材料。 随后沉积的薄膜层基本上是平面的,不必使用CMP沉积。 所得到的薄膜层是平面的并且具有均匀的横截面厚度,这对存储单元的记忆材料层是有利的。 可以在先前的前端(FEOL)处理的基板(例如,硅晶片)上执行后端处理(BEOL),并且BEOL过程可用于制造两个 - 终端非易失性交叉点存储器阵列。