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    • 6. 发明申请
    • Formulation Delivery Device
    • 配方输送装置
    • US20100094254A1
    • 2010-04-15
    • US12579028
    • 2009-10-14
    • William J. CaseyTyler J. Holschlag
    • William J. CaseyTyler J. Holschlag
    • A61M5/32A61M5/20
    • A61M5/32A61M5/1452A61M5/3232A61M5/3287A61M5/5013A61M5/504A61M2005/1585A61M2005/2073A61M2205/8281
    • The present invention provides a device for injection of formulations into a patient. In one embodiment the injection is sub-cutaneous. The device is convenient for injecting viscous formulations that would otherwise clog conventional injection devices, for example formulations containing microspheres, suspensions, and other viscous substances. Generally, the device features a needle for piercing the skin, an internal chamber for holding and transmitting fluid, a plunger for applying pressure to the internal chamber, a switch for triggering withdrawal of the needle, a sheath at least partially encompassing the needle and having a flow path within the sheath, and a spring that expands when the switch is triggered, and which thereby at least partially withdraws the needle from the sheath.
    • 本发明提供了用于将制剂注射到患者体内的装置。 在一个实施方案中,注射是皮下的。 该装置便于注入粘性制剂,否则会阻塞常规注射装置,例如含有微球,悬浮液和其它粘性物质的制剂。 通常,该装置具有用于刺穿皮肤的针头,用于保持和传送流体的内部腔室,用于向内部腔室施加压力的柱塞,用于触发抽出针头的开关,至少部分地包围针头并具有 护套内的流路,以及当开关被触发时膨胀的弹簧,并且由此至少部分地将针从护套中取出。
    • 10. 发明授权
    • Method of utilizing a plasma gas mixture containing argon and CF.sub.4
to clean and coat a conductor
    • 利用含有氩和CF4的等离子体气体混合物来清洁和涂覆导体的方法
    • US6092714A
    • 2000-07-25
    • US270646
    • 1999-03-16
    • William J. Casey
    • William J. Casey
    • B23K1/20H05K3/34B23K9/00B23K28/00B23K31/02
    • B23K1/206B23K2201/38H05K3/3489
    • A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma. The treatment of conductive surfaces according to the method of the present invention has shown to allow a soldering operation for 3 to 8 hours following treatment without additional preparation, cleaning or treatment.
    • 一种利用包含氩和CF4的等离子体气体混合物来清洁和涂覆等离子体反应室中的导体以清洁和涂覆导体的方法。 用于清洁和涂覆导体的方法包括清洁过程的组合,包括物理还原和化学反应以及在导体暴露于本发明的方法期间在氟氟金属组合物(SnOxFy)上形成的聚合钝化膜的形成 。 由于退化碳四氟化碳(CF4)气体和降解的环境和休闲碳氢化合物以各种未指定的有机污染物的形式存在而形成聚合钝化膜,以在高能环境中形成粗聚合物分子 的等离子体。 根据本发明的方法处理导电表面已显示允许焊接操作在处理后3至8小时,无需额外的制备,清洁或处理。