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    • 1. 发明授权
    • System and method for cleaning workpieces
    • 用于清洁工件的系统和方法
    • US06818604B2
    • 2004-11-16
    • US09971332
    • 2001-10-04
    • Ismail EmeshYakov EpshteynPeriya GopalanGuangshum ChenXingbo Yang
    • Ismail EmeshYakov EpshteynPeriya GopalanGuangshum ChenXingbo Yang
    • C11D732
    • H01L21/67046B08B1/04G11B23/505
    • The invention relates generally to a system and method for improved cleaning of workpieces and workpiece cleaning tools. More specifically, the invention provides systems and methods for cleaning workpieces and sponges by manipulating the surface charge of one or more sponges by exposing them to various cleaning fluids. In one embodiment, sponges such as PVA sponges, having either positive, negative or neutral charges, are used to clean surfaces of workpieces such as semiconductor wafers. While cleaning a workpiece, a sponge may be exposed to a workpiece cleaning fluid, which may or may not alter the surface charge of the sponge. After cleaning the workpiece, the sponge may be exposed to a sponge cleaning fluid, which may or may not alter the surface charge of the sponge. Manipulating the surface charge of a sponge during and/or after cleaning of a workpiece may enhance cleaning of the workpiece, by attracting oppositely charged particles and/or repelling similarly charged particles from the workpiece surface. Manipulating the surface charge of a sponge may also enhance cleaning of the sponge, by reducing or eliminating the attractive forces between the surface of the sponge and the charged particles attached to it.
    • 本发明一般涉及用于改进工件和工件清洁工具的清洁的系统和方法。 更具体地,本发明提供了通过将它们暴露于各种清洁流体来操纵一种或多种海绵的表面电荷来清洁工件和海绵的系统和方法。 在一个实施例中,使用具有正,负或中性电荷的诸如PVA海绵的海绵来清洁诸如半导体晶片的工件的表面。 在清洁工件时,海绵可能会暴露于工件清洁液中,这可能会影响或不会改变海绵的表面电荷。 在清洁工件之后,海绵可能暴露于海绵清洗液中,这可能会改变或不会改变海绵的表面电荷。 在清洁工件期间和/或之后操作海绵的表面电荷可以通过从工件表面吸引带相反电荷的颗粒和/或排斥相似带电的颗粒来增强工件的清洁。 操纵海绵的表面电荷还可以通过减少或消除海绵表面和附着在其上的带电粒子之间的吸引力来增强海绵的清洁。
    • 6. 发明授权
    • Method and apparatus for cleaning workpieces with uniform relative velocity
    • 用于以均匀相对速度清洁工件的方法和设备
    • US06502271B1
    • 2003-01-07
    • US09492020
    • 2000-01-26
    • Yakov Epshteyn
    • Yakov Epshteyn
    • A46B1302
    • H01L21/67046B08B1/04
    • A method and apparatus for cleaning a wafer in a dual brush cleaning system is disclosed. Two brushes, preferably made of PVA and wetted by cleaning fluids, are positioned opposite one another and spaced apart enough to allow a portion of a wafer to be inserted between their working surfaces and make frictional engagement with them. The top brush is rotated at a first speed and the bottom brush is rotated at a second faster speed sufficient for the freely rotating wafer to rotate at the same speed and in the same direction as the top brush. The bottom brush may have raised areas on its surface to assist in efficiently gripping and rotating the wafer. A common rotation speed and direction causes a uniform relative velocity between the top brush and the wafer that results in an improved cleaning operation.
    • 公开了一种在双刷清洁系统中清洁晶片的方法和装置。 优选由PVA制成并用清洁液润湿的两个刷子彼此相对设置并间隔开,以允许晶片的一部分插入在其工作表面之间并与它们摩擦接合。 顶部刷子以第一速度旋转,并且底部刷子以足以使自由旋转的晶片以与顶部刷子相同的速度和相同的方向旋转的第二更快的速度旋转。 底部刷可能在其表面上具有凸起区域以帮助有效地夹紧和旋转晶片。 常见的旋转速度和方向导致顶刷和晶片之间的均匀的相对速度导致改进的清洁操作。