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    • 2. 发明授权
    • Amorphous polymers and process for the production thereof
    • 非晶聚合物及其生产方法
    • US5239042A
    • 1993-08-24
    • US773956
    • 1991-11-15
    • Isaburo FukawaTsuneaki Tanabe
    • Isaburo FukawaTsuneaki Tanabe
    • C07D307/91C08G65/40C08G75/23
    • C07D307/91C08G65/405C08G65/4075C08G75/23
    • There are disclosed dibenzofuran amorphous polymer comprising a recurring unit represented by following formula (II) and having a molecular weight giving a reduced viscosity of at least 0.2 dl/g as measured in the form of a 0.5% (W/V) solution in N-methyl-pyrrolidone at 25.degree. C., a process for producing said amorphous polymer, a dibenzofuran copolymer comprising, in addition to a recurring unit represented by following formula (II), at least one type of recurring unit represented by following general formula (III) in a specific proportion and having a molecular weight giving a reduced viscosity of at least 0.2 dl/g as measured in the form of a 0.5% (W/V) solution in concentrated sulfuric acid at 25.degree. C., and a process for producing said copolymer. ##STR1## wherein A is --O--, --CO--, --S--, --SO.sub.2 --, a divalent alkylene group or a single bond and n is a number of 0, 1 or 2. There are also disclosed benzofuran derivatives useful as a starting material and a process for producing said derivatives. The above-mentioned amorphous polymer and copolymer are excellent in stability at the time of molding, low in polarity an low in moisture absorption, so that they are useful as starting materials for the manufacture of molded articles.
    • PCT No.PCT / JP90 / 00351 Sec。 371日期1991年11月15日 102(e)日期1991年11月15日PCT 1990年3月16日PCT公布。 第WO91 / 13929号公报 公开了二苯并呋喃无定形聚合物,其包含由下式(II)表示的重复单元,并且具有至少0.2dl / g的分子量,其为0.5%( W / V)溶液,一种制备所述无定形聚合物的方法,二苯并呋喃共聚物除了由下式(II)表示的重复单元外还包含至少一种类型的重复 以下的通式(III)表示的单元,以比例为0.5%(W / V)浓硫酸溶液的形式,其比例为25的比浓粘度为至少0.2dl / g的分子量 ℃,以及所述共聚物的制造方法。 (II)其中A是-O - , - CO - , - S - , - SO 2 - ,二价亚烷基或单键,n是0,1或2的数 还公开了可用作起始原料的苯并呋喃衍生物和制备所述衍生物的方法。 上述无定形聚合物和共聚物在成型时的稳定性优异,极性低,吸湿性低,因此它们可用作制造模制品的原料。
    • 5. 发明授权
    • Method of manufacturing interconnection structural body
    • 互连结构体的制造方法
    • US06479374B1
    • 2002-11-12
    • US09647310
    • 2000-09-27
    • Takaaki IokaTsuneaki TanabeIchiro Doi
    • Takaaki IokaTsuneaki TanabeIchiro Doi
    • H01L2144
    • H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02345H01L21/31695
    • Disclosed is a method for producing a circuit structure having an insulator layer comprising a porous silicon oxide thin film, which comprises (1) forming a preliminary insulator layer comprising a silicon oxide-organic polymer composite thin film formed on a substrate, which silicon oxide-organic polymer composite thin film comprises a silicon oxide having an organic polymer dispersed therein, (2) forming, in the preliminary insulator layer, a groove which defines a pattern for a circuit, (3) forming, in the groove, a metal layer which functions as a circuit, and (4) removing the organic polymer from the preliminary insulator layer to render the preliminary insulator layer porous, thereby converting the preliminary insulator layer to an insulator layer comprising a porous silicon oxide thin film. By the method of the present invention, the capacitance between mutually adjacent circuit lines (line-to-line capacitance) in the circuit structure can be lowered.
    • 公开了一种具有包括多孔氧化硅薄膜的绝缘体层的电路结构的方法,该方法包括:(1)形成包含在基板上形成的氧化硅 - 有机聚合物复合薄膜的预备绝缘体层, 有机聚合物复合薄膜包括其中分散有有机聚合物的氧化硅,(2)在预备绝缘体层中形成限定电路图案的凹槽,(3)在凹槽中形成金属层, 作为电路起作用,(4)从预备绝缘体层除去有机聚合物,使预备绝缘体层多孔化,由此将预备绝缘体层转化为包含多孔氧化硅薄膜的绝缘体层。 通过本发明的方法,可以降低电路结构中相互相邻的电路线之间的电容(线对线电容)。
    • 6. 发明授权
    • Alkoxysilane/organic polymer composition for thin insulating film production and use thereof
    • 用于薄绝缘膜生产的烷氧基硅烷/有机聚合物组合物及其用途
    • US06448331B1
    • 2002-09-10
    • US09423798
    • 1999-11-12
    • Takaaki IokaTsuneaki Tanabe
    • Takaaki IokaTsuneaki Tanabe
    • C08G7702
    • C08J5/18C08G2270/00C08J2383/02C08J2383/04C08L83/02C08L83/04C09D183/12C09D183/14H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02337H01L21/02359H01L21/3122H01L21/316H01L21/31695Y10S525/903Y10T428/31507Y10T428/31663C08L2666/02
    • Disclosed is an alkoxysilane/organic polymer composition for use in producing an insulating thin film, comprising (A) a specific alkoxysilane; (B) a specific organic polymer; and (C) a solvent for alkoxysilane (A) and organic polymer (B), wherein solvent (C) comprises at least one organic solvent selected from the group consisting of amide linkage-containing organic solvents and ester linkage-containing organic solvents. Also disclosed are a silica-organic polymer composite thin film which is produced by a process comprising: forming a thin film of the composition of the present invention; subjecting the thin film to a hydrolysis and dehydration-condensation reaction with respect to the alkoxysilane thereof, to thereby cause the alkoxysilane to be gelled in the thin film; and removing the solvent remaining in the thin film by drying, and a porous silica thin film which is obtained by removing the organic polymer from the silica-organic polymer composite thin film. Both of the silica-organic polymer composite thin film and the porous silica thin film have advantages not only in that these thin films have a low dielectric constant suitable for insulating layers for a multilevel interconnect for a semiconductor device, but also in that these thin films can be produced by a method which can be easily performed in the current process for producing a semiconductor device.
    • 公开了用于制造绝缘薄膜的烷氧基硅烷/有机聚合物组合物,其包含(A)特定的烷氧基硅烷; (B)特定的有机聚合物; 和(C)烷氧基硅烷(A)和有机聚合物(B)的溶剂,其中溶剂(C)包含至少一种选自含酰胺键的有机溶剂和含有酯键的有机溶剂的有机溶剂。 还公开了一种二氧化硅 - 有机聚合物复合薄膜,其通过以下方法制备,所述方法包括:形成本发明组合物的薄膜; 使薄膜与其烷氧基硅烷进行水解和脱水缩合反应,从而使烷氧基硅烷在薄膜中凝胶化; 并通过干燥除去残留在薄膜中的溶剂,以及通过从二氧化硅 - 有机聚合物复合薄膜中除去有机聚合物而获得的多孔二氧化硅薄膜。 二氧化硅 - 有机聚合物复合薄膜和多孔二氧化硅薄膜的优点不仅在于这些薄膜具有适于用于半导体器件的多层互连的绝缘层的低介电常数,而且这些薄膜 可以通过在当前的制造半导体器件的工艺中容易地进行的方法来制造。
    • 7. 发明授权
    • Aromatic copolymer and composition containing the same
    • 芳族共聚物和含有它们的组合物
    • US06323300B1
    • 2001-11-27
    • US09308589
    • 1999-05-21
    • Kohei KitaTsuneaki TanabeMitsuo Konishi
    • Kohei KitaTsuneaki TanabeMitsuo Konishi
    • C08G6514
    • C08G65/44Y10T428/31551
    • Disclosed is an aromatic copolymer comprising a plurality of aromatic copolymer chains, each comprising (A) recurring 2,6-diphenylphenol units and (B) phenolic comonomer units, each comonomer unit being independently selected from the group consisting of (i) an oxyphenylene monomer unit which is monosubstituted with a monovalent aromatic group or a halogen atom, (ii) an &agr;-oxynaphthylene monomer unit, (iii) a &bgr;-oxynaphthylene monomer unit, and (iv) an oxyphenylene monomer unit which is substituted with at least one aliphatic group, wherein the amounts of (A) and (B) are from 50 to 98% by weight and from 2 to 50% by weight, based on the weight of the aromatic copolymer, provided that, when (iv) is present as the comonomer unit, the amount of (iv) is 20% by weight or less, based on the weight of (B), and wherein the aromatic copolymer has a weight average molecular weight of from 1,000 to 3,000,000. A method for producing the aromatic copolymer is also disclosed. The aromatic copolymer of the present invention has excellent electrical characteristics (such as a low dielectric constant), an excellent heat resistance, excellent film-forming properties, low water absorption properties and an excellent adhesion to other materials, and can be advantageously used as a material for various electronic parts.
    • 公开了包含多个芳族共聚物链的芳族共聚物,每个芳族共聚物链包含(A)重复的2,6-二苯基苯酚单元和(B)酚类共聚单体单元,每个共聚单体单元独立地选自(i)氧联苯单体 被单价芳族基团或卤素原子单取代的单元,(ii)α-氧基萘基单体单元,(iii)β-氧基萘基单体单元,和(iv)被至少一个脂族基团取代的氧亚苯基单体单元 基团,其中基于芳族共聚物的重量,(A)和(B)的量为50至98重量%和2至50重量%,条件是当(iv)作为 共聚单体单元,基于(B)的重量,(iv)的量为20重量%以下,并且其中所述芳族共聚物的重均分子量为1,000〜3,000,000。 还公开了制备芳族共聚物的方法。 本发明的芳香族共聚物具有优异的电特性(例如低介电常数),优异的耐热性,优异的成膜性,低吸水性和与其它材料的优异粘附性,并且可以有利地用作 各种电子零件的材料。