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1. 发明授权

US06448331B1 Alkoxysilane/organic polymer composition for thin insulating film production and use thereof 失效
标题翻译：用于薄绝缘膜生产的烷氧基硅烷/有机聚合物组合物及其用途
公开(公告)号：US06448331B1
公开(公告)日：2002-09-10
申请号：US09423798
申请日：1999-11-12
申请人： Takaaki Ioka , Tsuneaki Tanabe
发明人： Takaaki Ioka , Tsuneaki Tanabe
IPC分类号： C08G7702
CPC分类号： C08J5/18 , C08G2270/00 , C08J2383/02 , C08J2383/04 , C08L83/02 , C08L83/04 , C09D183/12 , C09D183/14 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02337 , H01L21/02359 , H01L21/3122 , H01L21/316 , H01L21/31695 , Y10S525/903 , Y10T428/31507 , Y10T428/31663 , C08L2666/02
摘要： Disclosed is an alkoxysilane/organic polymer composition for use in producing an insulating thin film, comprising (A) a specific alkoxysilane; (B) a specific organic polymer; and (C) a solvent for alkoxysilane (A) and organic polymer (B), wherein solvent (C) comprises at least one organic solvent selected from the group consisting of amide linkage-containing organic solvents and ester linkage-containing organic solvents. Also disclosed are a silica-organic polymer composite thin film which is produced by a process comprising: forming a thin film of the composition of the present invention; subjecting the thin film to a hydrolysis and dehydration-condensation reaction with respect to the alkoxysilane thereof, to thereby cause the alkoxysilane to be gelled in the thin film; and removing the solvent remaining in the thin film by drying, and a porous silica thin film which is obtained by removing the organic polymer from the silica-organic polymer composite thin film. Both of the silica-organic polymer composite thin film and the porous silica thin film have advantages not only in that these thin films have a low dielectric constant suitable for insulating layers for a multilevel interconnect for a semiconductor device, but also in that these thin films can be produced by a method which can be easily performed in the current process for producing a semiconductor device.
摘要翻译：公开了用于制造绝缘薄膜的烷氧基硅烷/有机聚合物组合物，其包含（A）特定的烷氧基硅烷; （B）特定的有机聚合物; 和（C）烷氧基硅烷（A）和有机聚合物（B）的溶剂，其中溶剂（C）包含至少一种选自含酰胺键的有机溶剂和含有酯键的有机溶剂的有机溶剂。还公开了一种二氧化硅 - 有机聚合物复合薄膜，其通过以下方法制备，所述方法包括：形成本发明组合物的薄膜; 使薄膜与其烷氧基硅烷进行水解和脱水缩合反应，从而使烷氧基硅烷在薄膜中凝胶化; 并通过干燥除去残留在薄膜中的溶剂，以及通过从二氧化硅 - 有机聚合物复合薄膜中除去有机聚合物而获得的多孔二氧化硅薄膜。二氧化硅 - 有机聚合物复合薄膜和多孔二氧化硅薄膜的优点不仅在于这些薄膜具有适于用于半导体器件的多层互连的绝缘层的低介电常数，而且这些薄膜可以通过在当前的制造半导体器件的工艺中容易地进行的方法来制造。

2. 发明授权

US06479374B1 Method of manufacturing interconnection structural body 失效
标题翻译：互连结构体的制造方法
公开(公告)号：US06479374B1
公开(公告)日：2002-11-12
申请号：US09647310
申请日：2000-09-27
申请人： Takaaki Ioka , Tsuneaki Tanabe , Ichiro Doi
发明人： Takaaki Ioka , Tsuneaki Tanabe , Ichiro Doi
IPC分类号： H01L2144
CPC分类号： H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02345 , H01L21/31695
摘要： Disclosed is a method for producing a circuit structure having an insulator layer comprising a porous silicon oxide thin film, which comprises (1) forming a preliminary insulator layer comprising a silicon oxide-organic polymer composite thin film formed on a substrate, which silicon oxide-organic polymer composite thin film comprises a silicon oxide having an organic polymer dispersed therein, (2) forming, in the preliminary insulator layer, a groove which defines a pattern for a circuit, (3) forming, in the groove, a metal layer which functions as a circuit, and (4) removing the organic polymer from the preliminary insulator layer to render the preliminary insulator layer porous, thereby converting the preliminary insulator layer to an insulator layer comprising a porous silicon oxide thin film. By the method of the present invention, the capacitance between mutually adjacent circuit lines (line-to-line capacitance) in the circuit structure can be lowered.
摘要翻译：公开了一种具有包括多孔氧化硅薄膜的绝缘体层的电路结构的方法，该方法包括：（1）形成包含在基板上形成的氧化硅 - 有机聚合物复合薄膜的预备绝缘体层，有机聚合物复合薄膜包括其中分散有有机聚合物的氧化硅，（2）在预备绝缘体层中形成限定电路图案的凹槽，（3）在凹槽中形成金属层，作为电路起作用，（4）从预备绝缘体层除去有机聚合物，使预备绝缘体层多孔化，由此将预备绝缘体层转化为包含多孔氧化硅薄膜的绝缘体层。通过本发明的方法，可以降低电路结构中相互相邻的电路线之间的电容（线对线电容）。

3. 发明申请

US20060269724A1 Antireflection film 失效
公开(公告)号：US20060269724A1
公开(公告)日：2006-11-30
申请号：US10561000
申请日：2004-06-10
申请人： Toshihiko Ohashi , Takaaki Ioka
发明人： Toshihiko Ohashi , Takaaki Ioka
IPC分类号： B32B27/18 , B32B33/00
CPC分类号： G02B1/111 , Y10T428/24372 , Y10T428/24942 , Y10T428/24994 , Y10T428/252 , Y10T428/259 , Y10T428/31504 , Y10T428/31786
摘要： An antireflection film comprising silica particles and at least one binder compound, which has a silica particle content of 30% by weight or more, an arithmetic mean surface roughness (Ra) of not more than 2 nm, and a surface silicon atom content of 10 atom % or more.

4. 发明申请

US20050031791A1 Coating composition for forming low-refractive index thin layers 失效
$Coating composition for forming low-refractive index thin layers$
标题翻译：用于形成低折射率薄层的涂料组合物
公开(公告)号：US20050031791A1
公开(公告)日：2005-02-10
申请号：US10496870
申请日：2002-12-13
申请人： Yoro Sasaki , Hiroyuki IHanahata , Takaaki Ioka
发明人： Yoro Sasaki , Hiroyuki IHanahata , Takaaki Ioka
IPC分类号： C09D1/00 , C09D183/04 , C09D183/14 , G02B1/11 , G02B1/111 , G02B1/14 , B05D3/02 , B32B3/26
CPC分类号： C09D183/14 , C08G77/08 , C09D1/00 , C09D183/04
摘要： A composition comprising a fluid, silica precursor (A) obtained by subjecting alkoxysilane(s) to hydrolysis/polycondensation in the presence of an acid catalyst, a basic compound (B) having a basic hydroxyl group and/or a basic nitrogen atom, wherein the pH of a 0.1 N aqueous solution of compound (B) is 11 or more, and the vapor pressure of compound (B) is 1.3 kPa or lower at 100° C., and an organic compound (C) having a boiling point of 100° C. or higher, compound (C) being compatible with silica precursor (A), wherein the amount of compound (B) is from 0.0015 to 0.5 mol, in terms of the total molar amount of the basic hydroxyl groups and the basic nitrogen atoms in compound (B), per mole of Si atoms contained in silica precursor (A).
摘要翻译：一种组合物，其包含流体，在酸催化剂存在下使烷氧基硅烷进行水解/缩聚而得到的二氧化硅前体（A），碱性羟基和/或碱性氮原子的碱性化合物（B），其中化合物（B）的0.1N水溶液的pH为11以上，化合物（B）的蒸气压在100℃下为1.3kPa以下，有机化合物（C）的沸点为 100℃以上的化合物（C）与二氧化硅前体（A）相容，其中化合物（B）的量为碱金属羟基和碱性羟基的总摩尔量的0.0015〜0.5摩尔化合物（B）中的氮原子，相对于二氧化硅前体（A）中所含的每摩尔Si原子。

5. 发明授权

US07081272B2 Coating composition for forming low-refractive index thin layers 失效
$Coating composition for forming low-refractive index thin layers$
标题翻译：用于形成低折射率薄层的涂料组合物
公开(公告)号：US07081272B2
公开(公告)日：2006-07-25
申请号：US10496870
申请日：2002-12-13
申请人： Yoro Sasaki , Hiroyuki Hanahata , Takaaki Ioka
发明人： Yoro Sasaki , Hiroyuki Hanahata , Takaaki Ioka
IPC分类号： B05D3/10
CPC分类号： C09D183/14 , C08G77/08 , C09D1/00 , C09D183/04
摘要： A composition comprising a fluid, silica precursor (A) obtained by subjecting alkoxysilane(s) to hydrolysis/polycondensation in the presence of an acid catalyst, a basic compound (B) having a basic hydroxyl group and/or a basic nitrogen atom, wherein the pH of a 0.1 N aqueous solution of compound (B) is 11 or more, and the vapor pressure of compound (B) is 1.3 kPa or lower at 100° C., and an organic compound (C) having a boiling point of 100° C. or higher, compound (C) being compatible with silica precursor (A), wherein the amount of compound (B) is from 0.0015 to 0.5 mol, in terms of the total molar amount of the basic hydroxyl groups and the basic nitrogen atoms in compound (B), per mole of Si atoms contained in silica precursor (A).
摘要翻译：一种组合物，其包含流体，在酸催化剂存在下使烷氧基硅烷进行水解/缩聚而得到的二氧化硅前体（A），碱性羟基和/或碱性氮原子的碱性化合物（B），其中化合物（B）的0.1N水溶液的pH为11以上，化合物（B）的蒸气压在100℃下为1.3kPa以下，有机化合物（C）的沸点为 100℃以上的化合物（C）与二氧化硅前体（A）相容，其中化合物（B）的量为碱金属羟基和碱性羟基的总摩尔量的0.0015〜0.5摩尔化合物（B）中的氮原子，相对于二氧化硅前体（A）中所含的每摩尔Si原子。

6. 发明授权

US07604866B2 Antireflection film 失效
标题翻译：防反射膜
公开(公告)号：US07604866B2
公开(公告)日：2009-10-20
申请号：US10561000
申请日：2004-06-10
申请人： Toshihiko Ohashi , Takaaki Ioka
发明人： Toshihiko Ohashi , Takaaki Ioka
IPC分类号： B32B15/04 , C09K19/42 , C04B35/14
CPC分类号： G02B1/111 , Y10T428/24372 , Y10T428/24942 , Y10T428/24994 , Y10T428/252 , Y10T428/259 , Y10T428/31504 , Y10T428/31786
摘要： An antireflection film comprising silica particles and at least one binder compound, which has a silica particle content of 30% by weight or more, an arithmetic mean surface roughness (Ra) of not more than 2 nm, and a surface silicon atom content of 10 atom % or more.
摘要翻译：包含二氧化硅颗粒和至少一种粘合剂化合物的抗反射膜，其二氧化硅颗粒含量为30重量％以上，算术平均表面粗糙度（Ra）不大于2nm，表面硅原子含量为10 原子％以上。

7. 发明申请

US20060093786A1 Silica-containing laminated structure, and coating composition for use in forming a porous silica layer 审中-公开
标题翻译：含硅层压结构体和用于形成多孔二氧化硅层的涂料组合物
公开(公告)号：US20060093786A1
公开(公告)日：2006-05-04
申请号：US10541776
申请日：2004-02-20
申请人： Toshihiko Ohashi , Jun Li , Takaaki Ioka
发明人： Toshihiko Ohashi , Jun Li , Takaaki Ioka
IPC分类号： B32B3/10
CPC分类号： C08J7/04 , C08J7/06 , C08J2367/00 , C23C18/1212 , C23C18/127 , G02B1/113 , G02B2207/107 , Y10T428/24273
摘要： A silica-containing laminated structure comprising a transparent thermoplastic resin substrate and, laminated thereon, at least one porous silica layer having a refractive index of 1.22 or more and less than 1.30, wherein the at least one porous silica layer is comprised of a plurality of moniliform silica strings, each comprising a plurality of primary silica particles which are linked in rosary form, and wherein the pores of the at least one porous silica layer include pores (P), each of pores (P) having a pore opening area which is larger than the average value of the respective maximum cross-sectional areas of the primary silica particles, wherein the pore opening areas of pores (P) are measured with respect to the pore openings in the surface or cross-section of the porous silica layer.
摘要翻译：一种含二氧化硅的叠层结构体，其特征在于，包含透明热塑性树脂基材，层叠有折射率为1.22以上且小于1.30的至少一种多孔二氧化硅层，其中，所述至少一个多孔二氧化硅层由多个每个包含以念珠形式连接的多个一次二氧化硅颗粒，并且其中所述至少一个多孔二氧化硅层的孔包括孔（P），每个孔（P）的开孔面积为大于一次二氧化硅粒子的各个最大横截面积的平均值，其中相对于多孔二氧化硅层的表面或横截面中的孔隙来测量孔（P）的开孔面积。

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