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1. 发明授权

US07258124B2 Apparatus and method for treating surfaces of semiconductor wafers using ozone 失效
标题翻译：使用臭氧处理半导体晶片表面的设备和方法
公开(公告)号：US07258124B2
公开(公告)日：2007-08-21
申请号：US11335948
申请日：2006-01-20
申请人： In Kwon Jeong , Yong Bae Kim , Jungyup Kim
发明人： In Kwon Jeong , Yong Bae Kim , Jungyup Kim
IPC分类号： B08B3/00
CPC分类号： H01L21/02046 , B08B3/02 , B08B3/08 , B08B2203/005 , H01L21/02238 , H01L21/31662 , H01L21/67051
摘要： An apparatus and method for treating surfaces of semiconductor wafers with a reactive gas, such as ozone, utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of processing fluid formed on a semiconductor wafer surface to increase the amount of reactive gas that reaches the wafer surface through the boundary layer. The apparatus and method may be used to clean a semiconductor wafer surface and/or grow an oxide layer on the wafer surface by oxidation.
摘要翻译：用诸如臭氧的反应性气体处理半导体晶片的表面的设备和方法利用从气体喷嘴结构喷出的气态物流，以在半导体晶片表面上形成的处理流体的边界层上形成凹坑，增加通过边界层到达晶片表面的反应气体的量。该设备和方法可用于通过氧化来清洁半导体晶片表面和/或在晶片表面上生长氧化物层。

2. 发明授权

US06942545B2 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers 失效
标题翻译：用于顺序研磨和加载/卸载半导体晶片的装置和方法
公开(公告)号：US06942545B2
公开(公告)日：2005-09-13
申请号：US09839508
申请日：2001-04-20
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B41/00 , B24B41/06 , B24B5/00
CPC分类号： B24B37/345 , B24B37/013 , B24B41/005 , B24B41/061 , B24B49/02 , B24B53/017
摘要： A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The different positions include multiple polishing positions and one or more loading/unloading positions. In some embodiments, the CMP apparatus is configured such that a semiconductor wafer is polished at a loading/unloading position. The CMP apparatus may also be configured to continuously polish one or more semiconductor wafers while the wafer carriers are being transferred to different positions. Thus, the CMP apparatus can continuously process the semiconductor wafers without significant idle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus is significantly increased. Furthermore, the wafer carriers of the CMP apparatus are preferably restricted to a small area to decrease the footprint of the apparatus.
摘要翻译：用于抛光半导体晶片的化学机械抛光（CMP）装置和方法利用多个晶片载体，其转移到抛光垫周围的不同位置以抛光至少一个半导体晶片，而另一个半导体晶片被加载到晶片之一或从其中的一个晶片承运人不同的位置包括多个抛光位置和一个或多个装载/卸载位置。在一些实施例中，CMP装置被配置为使得半导体晶片在装载/卸载位置被抛光。 CMP装置还可以被配置为在晶片载体被转移到不同位置的同时连续地抛光一个或多个半导体晶片。因此，CMP装置可以连续地处理半导体晶片而没有显着的空闲周期。因此，在这些实施例中，CMP装置的效率显着提高。此外，CMP装置的晶片载体优选地被限制在小的面积以减小装置的占地面积。

3. 发明授权

US07223153B2 Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces 失效
标题翻译：使用一个或多个抛光表面研磨半导体晶片的装置和方法
公开(公告)号：US07223153B2
公开(公告)日：2007-05-29
申请号：US10829593
申请日：2004-04-21
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B49/00 , B24B7/00
CPC分类号： B24B37/345 , B24B51/00
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.
摘要翻译：用于抛光诸如半导体晶片的物体的装置和方法利用一个或多个抛光表面，多个晶片载体和至少一个装载和卸载杯。负载和卸载杯可以被配置成以枢转方式移动到晶片载体和从晶片载体移动。负载和卸载杯可以被配置为以线性往复运动方式移动到晶片载体和从晶片载体移动。晶片载体可以构造成以枢转的方式移动到和从装载和卸载杯移动。晶片载体可以被配置成以线性往复运动的方式移动到装载和卸载杯中和从其卸载。

4. 发明授权

US07004815B2 Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers 失效
公开(公告)号：US07004815B2
公开(公告)日：2006-02-28
申请号：US11149286
申请日：2005-06-10
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B5/00
CPC分类号： B24B37/345 , B24B37/013 , B24B41/005 , B24B41/061 , B24B49/02 , B24B53/017
摘要： A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The different positions include multiple polishing positions and one or more loading/unloading positions. In some embodiments, the CMP apparatus is configured such that a semiconductor wafer is polished at a loading/unloading position. The CMP apparatus may also be configured to continuously polish one or more semiconductor wafers while the wafer carriers are being transferred to different positions. Thus, the CMP apparatus can continuously process the semiconductor wafers without significant idle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus is significantly increased. Furthermore, the wafer carriers of the CMP apparatus are preferably restricted to a small area to decrease the footprint of the apparatus.

5. 发明授权

US06586336B2 Chemical-mechanical-polishing station 失效
公开(公告)号：US06586336B2
公开(公告)日：2003-07-01
申请号：US09943946
申请日：2001-08-31
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： H01L2100
CPC分类号： H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67219
摘要： A small footprint, integrated and automated semiconductor wafer processing system for planarizing semiconductor wafers. That processing system includes a wafer load station, at least one CMP polishing system, and at least one cleaning system. Also included is at least one wafer unload station and a robotic system. The robotic system, which includes from two to six robotic movers, moves semiconductor wafers through the semiconductor wafer processing system. The semiconductor wafer processing system can also include a buffer system for temporarily holding semiconductor wafers. The buffer system, the robotic system, the cleaning system, the wafer load station, and/or the wafer unload station in some applications are capable of Z-axis motion. CMP polishing systems and cleaning systems can be vertically or linearly stacked.

6. 发明授权

US07674154B2 Apparatus and method for polishing objects using object cleaners 失效
标题翻译：使用对象清洁剂抛光物体的设备和方法
公开(公告)号：US07674154B2
公开(公告)日：2010-03-09
申请号：US11517903
申请日：2006-09-08
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B49/00
CPC分类号： B24B37/345 , B08B7/04 , B08B13/00 , B24B37/04 , H01L21/67219 , H01L21/67742
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for maintenance.
摘要翻译：用于抛光诸如半导体晶片的物体的设备和方法使用至少一个物体清洁器，其可以是可移动物体清洁器。可移动物体清洁器允许进入装置的不同部分进行维护。

7. 发明授权

US07238614B2 Methods for fabricating one or more metal damascene structures in a semiconductor wafer 失效
标题翻译：在半导体晶片中制造一个或多个金属镶嵌结构的方法
公开(公告)号：US07238614B2
公开(公告)日：2007-07-03
申请号：US11270270
申请日：2005-11-08
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： H01L23/495
CPC分类号： H01L21/7684 , H01L21/31053 , H01L21/32115 , H01L21/3212 , H01L21/32125
摘要： Methods for fabricating one or more metal (e.g., copper) damascene structures in a semiconductor wafer use at least three polishing steps to reduce erosion topography in the resulting metal damascene structures and/or increase throughput. The polishing steps may be performed at four polishing units of a polishing apparatus, which may include one or more pivotable load/unload cups to transfer the semiconductor wafer between some of the polishing units.
摘要翻译：在半导体晶片中制造一个或多个金属（例如铜）镶嵌结构的方法使用至少三个抛光步骤以减少所得金属镶嵌结构中的侵蚀形貌和/或增加生产量。抛光步骤可以在抛光装置的四个抛光单元处执行，抛光装置可以包括一个或多个可枢转的装载/卸载杯，以在一些抛光单元之间传送半导体晶片。

8. 发明申请

US20060281393A1 Chemical mechanical polishing tool, apparatus and method 审中-公开
公开(公告)号：US20060281393A1
公开(公告)日：2006-12-14
申请号：US11149287
申请日：2005-06-10
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B1/00 , B24B7/30
CPC分类号： B24B37/11 , B24B37/30
摘要： A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly comprised of a central pad mount on a central shaft. That central pad mount beneficially retains a center polishing pad. Also included is a ring polishing assembly comprised of a ring pad mount with a central aperture on a ring shaft with a central aperture. The ring pad mount beneficially retains a ring polishing pad having a central aperture. The central polishing assembly and the ring polishing assembly beneficially rotate and move axially independently of one another. The apparatus includes the CMP polishing tool and a rotating polishing table. The method includes rotating a semiconductor wafer on the rotating polishing table. Then, selectively and independently moving a solid center polishing pad having an axis of rotation and/or an axially aligned ring-shaped polishing pad into contact with the surface of the semiconductor wafer.

9. 发明申请

US20050282472A1 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines 审中-公开
公开(公告)号：US20050282472A1
公开(公告)日：2005-12-22
申请号：US11209666
申请日：2005-08-24
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B37/04 , B24B57/02 , H01L21/312 , H01L21/768 , H01L23/522 , H01L23/532 , B24B1/00
CPC分类号： H01L21/76835 , B24B37/04 , B24B57/02 , H01L21/3212 , H01L21/76802 , H01L21/76807 , H01L21/76814 , H01L21/7682 , H01L21/76826 , H01L21/76829 , H01L21/76831 , H01L23/5222 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： A chemical mechanical polishing (CMP) apparatus and method for sequentially polishing multiple semiconductor wafers on a single polishing pad utilizes multiple slurry delivery lines to supply one or more types of polishing solutions to the surface of the polishing pad. The slurry delivery lines are positioned to direct the polishing solution or solutions to different polishing positions of the polishing pad. The use of multiple slurry delivery lines allows the CMP apparatus to polish the semiconductor wafers at different polishing positions of the polishing pad using different types of polishing solutions.

10. 发明授权

US07367866B2 Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups 失效
标题翻译：使用可枢转的加载/卸载杯来研磨半导体晶片的装置和方法
公开(公告)号：US07367866B2
公开(公告)日：2008-05-06
申请号：US11208158
申请日：2005-08-18
申请人： In Kwon Jeong
发明人： In Kwon Jeong
IPC分类号： B24B51/00
CPC分类号： B24B37/345
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.
摘要翻译：用于抛光诸如半导体晶片的物体的装置和方法利用可枢转的装载/卸载杯将物体转移到物体载体上以在至少一个抛光表面上抛光物体。可枢转装载/卸载杯的枢转轴线位于物体载体之间。

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