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1. 发明申请

US20070047377A1 Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly 有权
标题翻译：内存模块印制电路板，制造方法及内存模块/插座组件
公开(公告)号：US20070047377A1
公开(公告)日：2007-03-01
申请号：US11500960
申请日：2006-08-09
申请人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
发明人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
IPC分类号： G11C8/00
CPC分类号： H05K3/403 , H01L2224/48091 , H01L2224/4824 , H05K3/0052 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/0919 , H05K2203/1189 , H01L2924/00014
摘要： Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要翻译：本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

2. 发明授权

US08189342B2 Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly 有权
标题翻译：内存模块印制电路板，制造方法及内存模块/插座组件
公开(公告)号：US08189342B2
公开(公告)日：2012-05-29
申请号：US11500960
申请日：2006-08-09
申请人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
发明人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
IPC分类号： H05K1/14
CPC分类号： H05K3/403 , H01L2224/48091 , H01L2224/4824 , H05K3/0052 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/0919 , H05K2203/1189 , H01L2924/00014
摘要： Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要翻译：本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

3. 发明授权

US07576437B2 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
标题翻译：半导体封装的印刷电路板和使用其的半导体封装的安装方法
公开(公告)号：US07576437B2
公开(公告)日：2009-08-18
申请号：US11598755
申请日：2006-11-14
申请人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
发明人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
IPC分类号： H01L23/48 , H01L23/495
CPC分类号： H05K3/3421 , H05K3/243 , H05K3/282 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10689 , H05K2203/046 , Y02P70/613
摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.
摘要翻译：示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。半导体封装的引线可以安装在绝缘基板上。连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。

4. 发明申请

US20070109758A1 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
标题翻译：半导体封装的印刷电路板和使用其的半导体封装的安装方法
公开(公告)号：US20070109758A1
公开(公告)日：2007-05-17
申请号：US11598755
申请日：2006-11-14
申请人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
发明人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K3/243 , H05K3/282 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10689 , H05K2203/046 , Y02P70/613
摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.
摘要翻译：示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。半导体封装的引线可以安装在绝缘基板上。连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

5. 发明授权

US07900349B2 Method of fabricating an electronic device 失效
标题翻译：制造电子装置的方法
公开(公告)号：US07900349B2
公开(公告)日：2011-03-08
申请号：US11950280
申请日：2007-12-04
申请人： Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
发明人： Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
IPC分类号： H05K3/34
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/98 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24227 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/225 , H05K3/3442 , H05K2201/10636 , H05K2201/10674 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49144 , Y10T29/53274 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.
摘要翻译：公开了一种具有可再加工电子部件的电子装置，电子装置的制造方法以及电子部件的再加工方法。电子设备包括设置在板体中的第一腔。第一金属图案设置在板体上并与第一腔相邻。第一电子部件设置在第一腔中。第一连接图案被设置成与第一电子部件的上边缘部分相邻并且延伸到第一金属图案，使得第一金属图案电连接到第一电子部件。

6. 发明申请

US20060283009A1 Component mounting apparatus including a demagnetizing device and method thereof 审中-公开
标题翻译：具有退磁装置及其方法的部件安装装置
公开(公告)号：US20060283009A1
公开(公告)日：2006-12-21
申请号：US11452902
申请日：2006-06-15
申请人： Dong-Woo Shin , Byong-Kun Bae , Nam-Yong Oh , Dong-Chun Lee , Seong-Chan Han , Sun-Kyu Hwang
发明人： Dong-Woo Shin , Byong-Kun Bae , Nam-Yong Oh , Dong-Chun Lee , Seong-Chan Han , Sun-Kyu Hwang
IPC分类号： B23P19/00
CPC分类号： H05K13/0417 , H05K13/0409 , H05K13/041 , Y10T29/49131 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.
摘要翻译：一种电子部件安装装置，包括用于使头部喷嘴退磁的去磁器，以及使电子部件装置退磁的方法。该方法可以基于条件来设置条件，安装电子部件，以及使电子部件安装装置的头部喷嘴退磁。

7. 发明授权

US06449156B1 Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof 有权
标题翻译：配有耦合装置的散热器，附有散热器的存储模块及其制造方法
公开(公告)号：US06449156B1
公开(公告)日：2002-09-10
申请号：US09952303
申请日：2001-09-12
申请人： Seong-Chan Han , Dong-Woo Shin , Dong-Chun Lee , Wang-Jae Lee
发明人： Seong-Chan Han , Dong-Woo Shin , Dong-Chun Lee , Wang-Jae Lee
IPC分类号： H05K720
CPC分类号： G11C5/04
摘要： A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.
摘要翻译：公开了一种新颖的散热器结构，用于安装到模块板，半导体芯片被附着到模块板上，并用于散发或扩散从半导体芯片产生的热量。散热器包括散热器基座和用于将散热器基座耦合到模块板的耦合装置。联接装置通过散热器底座。联接装置包括一体形成的上主体部分和至少穿过下主体部分的孔口，以及与下主体部分一体形成的凸缘基部。带凸缘的底座将联接装置固定在散热器底座上。上身部的外部尺寸小于下主体部的内部尺寸。结果，许多散热器可以稳定堆叠。

8. 发明授权

US07061768B2 Open socket 失效
标题翻译：打开插座
公开(公告)号：US07061768B2
公开(公告)日：2006-06-13
申请号：US10868976
申请日：2004-06-17
申请人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
发明人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
IPC分类号： H05K5/03
CPC分类号： H01R13/2471 , H01R13/111
摘要： An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.
摘要翻译：可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。

9. 发明申请

US20050118878A1 Open socket 失效
标题翻译：打开插座
公开(公告)号：US20050118878A1
公开(公告)日：2005-06-02
申请号：US10868976
申请日：2004-06-17
申请人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
发明人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
IPC分类号： H01R33/76 , H01R13/24 , H01R24/00
CPC分类号： H01R13/2471 , H01R13/111
摘要： An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.
摘要翻译：可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。

10. 发明授权

US08148828B2 Semiconductor packaging device 有权
标题翻译：半导体封装器件
公开(公告)号：US08148828B2
公开(公告)日：2012-04-03
申请号：US12604680
申请日：2009-10-23
申请人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Oh
发明人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Oh
IPC分类号： H01L23/48 , H01L23/34
CPC分类号： H01L23/24 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/1005 , H01L2225/1058 , H01L2924/00014 , H05K3/284 , H05K2201/10515 , H05K2201/10734 , H05K2201/2018 , H05K2203/1316 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.
摘要翻译：提供半导体封装装置。半导体封装组，侧保持器壁和填充层可以位于基板上。侧保持器壁可以位于半导体封装组周围。填充层可以位于侧保持器壁和半导体封装组之间。

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