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1. 发明授权

US08148828B2 Semiconductor packaging device 有权
标题翻译：半导体封装器件
公开(公告)号：US08148828B2
公开(公告)日：2012-04-03
申请号：US12604680
申请日：2009-10-23
申请人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Oh
发明人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Oh
IPC分类号： H01L23/48 , H01L23/34
CPC分类号： H01L23/24 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/1005 , H01L2225/1058 , H01L2924/00014 , H05K3/284 , H05K2201/10515 , H05K2201/10734 , H05K2201/2018 , H05K2203/1316 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.
摘要翻译：提供半导体封装装置。半导体封装组，侧保持器壁和填充层可以位于基板上。侧保持器壁可以位于半导体封装组周围。填充层可以位于侧保持器壁和半导体封装组之间。

2. 发明申请

US20100102427A1 SEMICONDUCTOR PACKAGING DEVICE 有权
标题翻译：半导体封装器件
公开(公告)号：US20100102427A1
公开(公告)日：2010-04-29
申请号：US12604680
申请日：2009-10-23
申请人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Ho
发明人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Ho
IPC分类号： H01L25/065 , H01L23/52
CPC分类号： H01L23/24 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/1005 , H01L2225/1058 , H01L2924/00014 , H05K3/284 , H05K2201/10515 , H05K2201/10734 , H05K2201/2018 , H05K2203/1316 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.
摘要翻译：提供半导体封装装置。半导体封装组，侧保持器壁和填充层可以位于基板上。侧保持器壁可以位于半导体封装组周围。填充层可以位于侧保持器壁和半导体封装组之间。

3. 发明授权

US09056377B2 Router apparatus 有权
标题翻译：路由器设备
公开(公告)号：US09056377B2
公开(公告)日：2015-06-16
申请号：US13241339
申请日：2011-09-23
申请人： Chan-Hyung Yun , Hyun-Jong Oh , Seong-Chan Han , Hun Han
发明人： Chan-Hyung Yun , Hyun-Jong Oh , Seong-Chan Han , Hun Han
IPC分类号： B23C3/00 , B23C1/08 , B23Q9/00 , H05K3/00
CPC分类号： B23Q9/0042 , B23C1/08 , B23C3/00 , H05K3/0052 , Y10T409/307728 , Y10T409/308568 , Y10T409/30924
摘要： A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.
摘要翻译：提供路由器设备。路由器设备包括垂直堆叠的多个面板; 同时切割面板的路由器位; 连接到路由器位的一端的第一支持单元和连接到路由器位的另一端的第二支持单元。在第二支撑单元中形成导轨，以引导路线钻头的移动。

4. 发明申请

US20090310313A1 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US20090310313A1
公开(公告)日：2009-12-17
申请号：US12457522
申请日：2009-06-15
申请人： Seong-chan HAN , Dong-woo SHIN , Hyun-jong OH , Nam-yong OH
发明人： Seong-chan HAN , Dong-woo SHIN , Hyun-jong OH , Nam-yong OH
IPC分类号： H05K7/20 , H05K7/10
CPC分类号： H05K1/0271 , H01L2924/0002 , H05K1/144 , H05K1/181 , H05K2201/0133 , H05K2201/10159 , H05K2201/10265 , H05K2201/10734 , H01L2924/00
摘要： A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.
摘要翻译：提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

5. 发明申请

US20090278752A1 Mobile terminal having antenna mounted in flexible PCB of side key 有权
标题翻译：具有安装在侧键柔性PCB中的天线的移动终端
公开(公告)号：US20090278752A1
公开(公告)日：2009-11-12
申请号：US12386283
申请日：2009-04-16
申请人： Hyun Jong Oh
发明人： Hyun Jong Oh
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/44 , H01Q21/28
摘要： A mobile terminal wherein a second antenna is mounted in a flexible PCB of a side key positioned at a location separated from a first antenna is provided. The mobile terminal includes: a main body; the first antenna and a printed circuit board (PCB) positioned on the inside of the main body; a side key positioned at a side surface of the outside of the main body; and a flexible PCB of the side key positioned on the inside of the main body. The flexible PCB of the side key including the second antenna. Therefore, by mounting a second antenna in a flexible PCB of a side key positioned at a location separated from a first antenna, an emission and reception performance of the first antenna and the second antenna can be improved.
摘要翻译：提供了一种移动终端，其中第二天线安装在位于与第一天线分离的位置处的侧键的柔性PCB中。移动终端包括：主体; 第一天线和位于主体内部的印刷电路板（PCB）; 位于主体的外侧的侧面的侧键; 以及位于主体内侧的侧键的柔性PCB。侧键的柔性PCB包括第二天线。因此，通过将第二天线安装在位于与第一天线分离的位置处的侧键的柔性PCB中，可以提高第一天线和第二天线的发射和接收性能。

6. 发明申请

US20060228878A1 Semiconductor package repair method 审中-公开
标题翻译：半导体封装修复方法
公开(公告)号：US20060228878A1
公开(公告)日：2006-10-12
申请号：US11387801
申请日：2006-03-24
申请人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
发明人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L25/105 , H01L25/50 , H01L2224/16 , H01L2225/1058 , H01L2225/1094 , H01L2924/15331 , H05K3/3463 , H05K3/3484 , H05K2201/10992 , Y02P70/613
摘要： A lower-melting-point solder having a lower melting point than solder balls is used to bond the solder balls with a module substrate. The lower-melting-point solder has a melting point lower than the solder balls. A bonding temperature is at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls.
摘要翻译：使用熔点低于焊料球的低熔点焊料用于将焊球与模块基板结合。低熔点焊料的熔点低于焊料球。接合温度处于低熔点焊料的熔点和焊料球的熔点之间的温度。

7. 发明授权

US08395553B2 Mobile terminal having antenna mounted in flexible PCB of side key 有权
公开(公告)号：US08395553B2
公开(公告)日：2013-03-12
申请号：US12386283
申请日：2009-04-16
申请人： Hyun Jong Oh
发明人： Hyun Jong Oh
IPC分类号： H01Q1/24
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/44 , H01Q21/28
摘要： A mobile terminal wherein a second antenna is mounted in a flexible PCB of a side key positioned at a location separated from a first antenna is provided. The mobile terminal includes: a main body; the first antenna and a printed circuit board (PCB) positioned on the inside of the main body; a side key positioned at a side surface of the outside of the main body; and a flexible PCB of the side key positioned on the inside of the main body. The flexible PCB of the side key including the second antenna. Therefore, by mounting a second antenna in a flexible PCB of a side key positioned at a location separated from a first antenna, an emission and reception performance of the first antenna and the second antenna can be improved.

8. 发明授权

US07920383B2 Heat sink for dissipating heat and apparatus having the same 有权
标题翻译：用于散热的散热器和具有相同功能的设备
公开(公告)号：US07920383B2
公开(公告)日：2011-04-05
申请号：US12265101
申请日：2008-11-05
申请人： Jin-Kyu Yang , Dong-Woo Shin , Hyun-Jong Oh
发明人： Jin-Kyu Yang , Dong-Woo Shin , Hyun-Jong Oh
IPC分类号： H05K7/20
CPC分类号： H01L23/3675 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.
摘要翻译：散热器包括分别与热源的第一和第二表面接触的第一和第二基板。第一基板包括从第一表面突出的支撑单元和第一散热单元，以从热源散发热量。第二基板包括与边缘部分间隔开以保持支撑单元的穿透孔和用于消散来自热源的热量的第二消散单元。联接构件定位在支撑单元的上表面上，并且向第一和第二基板施加力，从而将第一和第二基板组合到热源。将基板组合到存储器模块中，而不会损耗散热片的表面积，从而提高散热器的散热效率。

9. 发明授权

US07606035B2 Heat sink and memory module using the same 有权
标题翻译：散热器和内存模块使用相同
公开(公告)号：US07606035B2
公开(公告)日：2009-10-20
申请号：US11859564
申请日：2007-09-21
申请人： Chang-Yong Park , Yong-Hyun Kim , Kwang-Ho Chun , Hyun-Jong Oh
发明人： Chang-Yong Park , Yong-Hyun Kim , Kwang-Ho Chun , Hyun-Jong Oh
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
摘要翻译：提供了散热器和使用散热器的存储器模块。在一个实施例中，散热器包括分别设置在围绕待冷却物体放置的第一和第二散热器中的第一和第二引导销。第一和第二引导销有助于防止在第一和第二散热器之间发生不对准问题，以及当第一和第二散热器受到来自第一和第二散热器的压力施加压力时，有助于防止第一和第二散热器彼此接触外。

10. 发明申请

US20070172133A1 System and method for encoding and decoding an image using bitstream map and recording medium thereof 有权
标题翻译：使用比特流图及其记录介质对图像进行编码和解码的系统和方法
公开(公告)号：US20070172133A1
公开(公告)日：2007-07-26
申请号：US10581874
申请日：2004-11-11
申请人： Wook-Joong Kim , Myung-Seok Ki , Kyu-Heon Kim , Jin-Woong Kim , Euee-Seon Jang , Sun-Young Lee , Hyun-Jong Oh , Sung-Won Park , Jong-Woo Won
发明人： Wook-Joong Kim , Myung-Seok Ki , Kyu-Heon Kim , Jin-Woong Kim , Euee-Seon Jang , Sun-Young Lee , Hyun-Jong Oh , Sung-Won Park , Jong-Woo Won
IPC分类号： G06K9/34
CPC分类号： H04N1/41 , H04N1/32128 , H04N19/152 , H04N19/162 , H04N19/17 , H04N19/196 , H04N19/23 , H04N19/30 , H04N19/463 , H04N19/59 , H04N19/60 , H04N19/70 , H04N2201/3225
摘要： Disclosed are a system and method for encoding and decoding an image. The image compression system includes an image segmentation unit (110) for segmenting a first image into a plurality of sub-images; a first encoding unit (120) for encoding the sub-images to output sub-image bitstreams; a BMAP construction unit (130) for calculating the quantity of information of each sub-image bitstream and generating BMAP information using the calculated quantity of information and information on construction of each sub-image; and a bitstream combining unit (150) for combining the sub-image bitstreams and BMAP information.
摘要翻译：公开了一种用于对图像进行编码和解码的系统和方法。图像压缩系统包括用于将第一图像分割成多个子图像的图像分割单元（110）; 用于将子图像编码为输出子图像比特流的第一编码单元（120）; 用于计算每个子图像比特流的信息量并使用所计算的信息量和关于每个子图像的构造的信息来生成BMAP信息的BMAP构造单元（130）以及用于组合子图像比特流和BMAP信息的比特流组合单元（150）。

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