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1. 发明授权

US08148828B2 Semiconductor packaging device 有权
标题翻译：半导体封装器件
公开(公告)号：US08148828B2
公开(公告)日：2012-04-03
申请号：US12604680
申请日：2009-10-23
申请人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Oh
发明人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Oh
IPC分类号： H01L23/48 , H01L23/34
CPC分类号： H01L23/24 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/1005 , H01L2225/1058 , H01L2924/00014 , H05K3/284 , H05K2201/10515 , H05K2201/10734 , H05K2201/2018 , H05K2203/1316 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.
摘要翻译：提供半导体封装装置。半导体封装组，侧保持器壁和填充层可以位于基板上。侧保持器壁可以位于半导体封装组周围。填充层可以位于侧保持器壁和半导体封装组之间。

2. 发明申请

US20100102427A1 SEMICONDUCTOR PACKAGING DEVICE 有权
标题翻译：半导体封装器件
公开(公告)号：US20100102427A1
公开(公告)日：2010-04-29
申请号：US12604680
申请日：2009-10-23
申请人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Ho
发明人： Dong-Woo Shin , Seong-Chan Han , Sun-Kyu Hwang , Hyun-Jong Oh , Nam-Yong Ho
IPC分类号： H01L25/065 , H01L23/52
CPC分类号： H01L23/24 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/1005 , H01L2225/1058 , H01L2924/00014 , H05K3/284 , H05K2201/10515 , H05K2201/10734 , H05K2201/2018 , H05K2203/1316 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.
摘要翻译：提供半导体封装装置。半导体封装组，侧保持器壁和填充层可以位于基板上。侧保持器壁可以位于半导体封装组周围。填充层可以位于侧保持器壁和半导体封装组之间。

3. 发明授权

US09056377B2 Router apparatus 有权
标题翻译：路由器设备
公开(公告)号：US09056377B2
公开(公告)日：2015-06-16
申请号：US13241339
申请日：2011-09-23
申请人： Chan-Hyung Yun , Hyun-Jong Oh , Seong-Chan Han , Hun Han
发明人： Chan-Hyung Yun , Hyun-Jong Oh , Seong-Chan Han , Hun Han
IPC分类号： B23C3/00 , B23C1/08 , B23Q9/00 , H05K3/00
CPC分类号： B23Q9/0042 , B23C1/08 , B23C3/00 , H05K3/0052 , Y10T409/307728 , Y10T409/308568 , Y10T409/30924
摘要： A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.
摘要翻译：提供路由器设备。路由器设备包括垂直堆叠的多个面板; 同时切割面板的路由器位; 连接到路由器位的一端的第一支持单元和连接到路由器位的另一端的第二支持单元。在第二支撑单元中形成导轨，以引导路线钻头的移动。

4. 发明申请

US20090310313A1 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US20090310313A1
公开(公告)日：2009-12-17
申请号：US12457522
申请日：2009-06-15
申请人： Seong-chan HAN , Dong-woo SHIN , Hyun-jong OH , Nam-yong OH
发明人： Seong-chan HAN , Dong-woo SHIN , Hyun-jong OH , Nam-yong OH
IPC分类号： H05K7/20 , H05K7/10
CPC分类号： H05K1/0271 , H01L2924/0002 , H05K1/144 , H05K1/181 , H05K2201/0133 , H05K2201/10159 , H05K2201/10265 , H05K2201/10734 , H01L2924/00
摘要： A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.
摘要翻译：提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

5. 发明申请

US20090278752A1 Mobile terminal having antenna mounted in flexible PCB of side key 有权
标题翻译：具有安装在侧键柔性PCB中的天线的移动终端
公开(公告)号：US20090278752A1
公开(公告)日：2009-11-12
申请号：US12386283
申请日：2009-04-16
申请人： Hyun Jong Oh
发明人： Hyun Jong Oh
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/44 , H01Q21/28
摘要： A mobile terminal wherein a second antenna is mounted in a flexible PCB of a side key positioned at a location separated from a first antenna is provided. The mobile terminal includes: a main body; the first antenna and a printed circuit board (PCB) positioned on the inside of the main body; a side key positioned at a side surface of the outside of the main body; and a flexible PCB of the side key positioned on the inside of the main body. The flexible PCB of the side key including the second antenna. Therefore, by mounting a second antenna in a flexible PCB of a side key positioned at a location separated from a first antenna, an emission and reception performance of the first antenna and the second antenna can be improved.
摘要翻译：提供了一种移动终端，其中第二天线安装在位于与第一天线分离的位置处的侧键的柔性PCB中。移动终端包括：主体; 第一天线和位于主体内部的印刷电路板（PCB）; 位于主体的外侧的侧面的侧键; 以及位于主体内侧的侧键的柔性PCB。侧键的柔性PCB包括第二天线。因此，通过将第二天线安装在位于与第一天线分离的位置处的侧键的柔性PCB中，可以提高第一天线和第二天线的发射和接收性能。

6. 发明申请

US20060228878A1 Semiconductor package repair method 审中-公开
标题翻译：半导体封装修复方法
公开(公告)号：US20060228878A1
公开(公告)日：2006-10-12
申请号：US11387801
申请日：2006-03-24
申请人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
发明人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L25/105 , H01L25/50 , H01L2224/16 , H01L2225/1058 , H01L2225/1094 , H01L2924/15331 , H05K3/3463 , H05K3/3484 , H05K2201/10992 , Y02P70/613
摘要： A lower-melting-point solder having a lower melting point than solder balls is used to bond the solder balls with a module substrate. The lower-melting-point solder has a melting point lower than the solder balls. A bonding temperature is at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls.
摘要翻译：使用熔点低于焊料球的低熔点焊料用于将焊球与模块基板结合。低熔点焊料的熔点低于焊料球。接合温度处于低熔点焊料的熔点和焊料球的熔点之间的温度。

7. 发明申请

US20120207561A1 ROUTER APPARATUS 有权
标题翻译：路由器设备
公开(公告)号：US20120207561A1
公开(公告)日：2012-08-16
申请号：US13241339
申请日：2011-09-23
申请人： Chan-Hyung YUN , Hyun-Jong OH , Seong-Chan HAN , Hun HAN
发明人： Chan-Hyung YUN , Hyun-Jong OH , Seong-Chan HAN , Hun HAN
IPC分类号： B23Q1/01
CPC分类号： B23Q9/0042 , B23C1/08 , B23C3/00 , H05K3/0052 , Y10T409/307728 , Y10T409/308568 , Y10T409/30924
摘要： A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.
摘要翻译：提供路由器设备。路由器设备包括垂直堆叠的多个面板; 同时切割面板的路由器位; 连接到路由器位的一端的第一支持单元和连接到路由器位的另一端的第二支持单元。在第二支撑单元中形成导轨，以引导路线钻头的移动。

8. 发明申请

US20100210042A1 METHOD OF MANUFACTURING SEMICONDUCTOR MODULE 审中-公开
标题翻译：制造半导体模块的方法
公开(公告)号：US20100210042A1
公开(公告)日：2010-08-19
申请号：US12705729
申请日：2010-02-15
申请人： Hyun-Jong OH , Seong-Chan HAN , Jae-Hoon CHOI , Chan-Hyung YUN
发明人： Hyun-Jong OH , Seong-Chan HAN , Jae-Hoon CHOI , Chan-Hyung YUN
IPC分类号： H01L21/66 , H01L21/50
CPC分类号： H05K3/303 , H01L23/3128 , H01L23/49805 , H01L23/49822 , H01L23/49838 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3511 , H05K1/141 , H05K3/3436 , H05K2201/0379 , H05K2201/068 , H05K2201/09063 , H05K2201/09781 , H05K2203/302 , H05K2203/306 , Y02P70/613 , H01L2224/0401
摘要： A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members.
摘要翻译：提供一种制造半导体模块的方法。形成具有一个或多个通过加热弯曲的板单元的半导体封装。半导体封装在模块衬底上对准，并且连接构件设置在半导体封装和模块衬底之间。对板单元和连接构件施加热量以在模块基板和半导体封装之间延伸一定距离，并且形成连接图案。连接图案的高度大于连接构件的高度。

9. 发明申请

US20100006260A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20100006260A1
公开(公告)日：2010-01-14
申请号：US12496930
申请日：2009-07-02
申请人： Hyun-Jong OH , Chan-Hyung Yun , Dong-Woo Shin , Jin-Kyu Yang , Jae-Chan Lee
发明人： Hyun-Jong OH , Chan-Hyung Yun , Dong-Woo Shin , Jin-Kyu Yang , Jae-Chan Lee
IPC分类号： F28F3/00
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator.
摘要翻译：散热器包括基板和至少一个弹性板。底板连接到诸如半导体芯片的发热体。弹性板的一个端部连接到基板，并且弹性板具有锯齿形结构以确保期望的弹性。弹性板消散了发热体产生的热量。

10. 发明申请

US20080074848A1 HEAT SINK AND MEMORY MODULE USING THE SAME 有权
标题翻译：使用相同的散热和记忆模块
公开(公告)号：US20080074848A1
公开(公告)日：2008-03-27
申请号：US11859564
申请日：2007-09-21
申请人： Chang-Yong PARK , Yong-Hyun KIM , Kwang-Ho CHUN , Hyun-Jong OH
发明人： Chang-Yong PARK , Yong-Hyun KIM , Kwang-Ho CHUN , Hyun-Jong OH
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
摘要翻译：提供了散热器和使用散热器的存储器模块。在一个实施例中，散热器包括分别设置在围绕待冷却物体放置的第一和第二散热器中的第一和第二引导销。第一和第二引导销有助于防止在第一和第二散热器之间发生不对准问题，以及当第一和第二散热器受到来自第一和第二散热器的压力施加压力时，有助于防止第一和第二散热器彼此接触外。

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