专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07183993B2 Dipole antenna 失效
标题翻译：偶极天线
公开(公告)号：US07183993B2
公开(公告)日：2007-02-27
申请号：US11026149
申请日：2004-12-29
申请人： Hsin-Kuo Dai , Yun-Long Ke , Lung-Sheng Tai , Shu-Chen Yang , Chin-Pao Kuo
发明人： Hsin-Kuo Dai , Yun-Long Ke , Lung-Sheng Tai , Shu-Chen Yang , Chin-Pao Kuo
IPC分类号： H01Q9/28
CPC分类号： H01Q9/28 , H01Q19/10 , H01Q21/30
摘要： A dual-band antenna for communication device includes a first dipole antenna, a second dipole antenna and a coaxial feed line. The first dipole antenna includes a first radiating element disposed at a first plane and a first ground portion disposed at a second plane. The second dipole antenna includes a second radiating element disposed at a first plane and a second ground portion disposed at a second plane. The feed line includes an inner conductor electrically connecting to the first and second radiating elements and an outer conductor electrically connecting to the first and second ground portions. The first and second radiating elements both further include a compensating portion for improving radiating patterns of the first and second dipole antennas and a broadband portion for increasing frequency bands of the first and second dipole antennas.
摘要翻译：用于通信设备的双频带天线包括第一偶极天线，第二偶极天线和同轴馈线。第一偶极天线包括设置在第一平面处的第一辐射元件和设置在第二平面处的第一接地部分。第二偶极天线包括设置在第一平面处的第二辐射元件和设置在第二平面处的第二接地部分。馈电线包括电连接到第一和第二辐射元件的内部导体和电连接到第一和第二接地部分的外部导体。第一和第二辐射元件还包括用于改善第一和第二偶极天线的辐射图案的补偿部分和用于增加第一和第二偶极子天线的频带的宽带部分。

2. 发明申请

US20050231437A1 Dipole antenna 失效
标题翻译：偶极天线
公开(公告)号：US20050231437A1
公开(公告)日：2005-10-20
申请号：US11026149
申请日：2004-12-29
申请人： Hsin-Kuo Dai , Yun-Long Ke , Lung-Sheng Tai , Shu-Chen Yang , Chin-Pao Kuo
发明人： Hsin-Kuo Dai , Yun-Long Ke , Lung-Sheng Tai , Shu-Chen Yang , Chin-Pao Kuo
IPC分类号： H01Q9/28 , H01Q19/10 , H01Q21/30
CPC分类号： H01Q9/28 , H01Q19/10 , H01Q21/30
摘要： A dual-band antenna for communication device includes a first dipole antenna, a second dipole antenna and a coaxial feed line. The first dipole antenna includes a first radiating element disposed at a first plane and a first ground portion disposed at a second plane. The second dipole antenna includes a second radiating element disposed at a first plane and a second ground portion disposed at a second plane. The feed line includes an inner conductor electrically connecting to the first and second radiating elements and an outer conductor electrically connecting to the first and second ground portions. The first and second radiating elements both further include a compensating portion for improving radiating patterns of the first and second dipole antennas and a broadband portion for increasing frequency bands of the first and second dipole antennas.
摘要翻译：用于通信设备的双频带天线包括第一偶极天线，第二偶极天线和同轴馈线。第一偶极天线包括设置在第一平面处的第一辐射元件和设置在第二平面处的第一接地部分。第二偶极天线包括设置在第一平面处的第二辐射元件和设置在第二平面处的第二接地部分。馈电线包括电连接到第一和第二辐射元件的内部导体和电连接到第一和第二接地部分的外部导体。第一和第二辐射元件还包括用于改善第一和第二偶极天线的辐射图案的补偿部分和用于增加第一和第二偶极子天线的频带的宽带部分。

3. 发明授权

US07473642B2 Method for fabricating conductive layer 失效
标题翻译：导电层制造方法
公开(公告)号：US07473642B2
公开(公告)日：2009-01-06
申请号：US11761374
申请日：2007-06-12
申请人： Hsien-Kun Chiu , Chin-Chuan Lai , Yi-Pen Lin , Shu-Chen Yang
发明人： Hsien-Kun Chiu , Chin-Chuan Lai , Yi-Pen Lin , Shu-Chen Yang
IPC分类号： H01L21/44
CPC分类号： H05K3/182 , C23C18/1608 , C23C18/1653 , C25D5/56 , H01L21/2885 , H01L21/76838 , H01L27/124 , H05K3/064 , H05K2203/0709
摘要： A method for fabricating a conductive layer is provided. First, a substrate is provided and a patterned adhesion layer is formed on the substrate. Next, a chemical plating process is performed to form a first metal layer on the patterned adhesion layer by placing the substrate in an electroplating solution and the electroplating solution is shocked. Thereafter, a second metal layer is formed on the first metal layer by performing a plating process.
摘要翻译：提供一种制造导电层的方法。首先，提供基板，并且在基板上形成图案化的粘附层。接着，进行化学镀处理，通过将基板置于电镀液中而使电镀液被冲击而在图案化的粘合层上形成第一金属层。此后，通过进行电镀工艺在第一金属层上形成第二金属层。

4. 发明授权

US07242077B2 Leadframe with die pad 有权
标题翻译：带芯片的引线框架
公开(公告)号：US07242077B2
公开(公告)日：2007-07-10
申请号：US11076951
申请日：2005-03-11
申请人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
发明人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
摘要翻译：引线框架包括管芯焊盘，多个连接杆，多个金属挤压件和多个引线。引线布置在管芯焊盘的周围。连接杆连接到管芯焊盘的角部，并且金属挤压件连接到管芯焊盘的侧面，但与连接条分离。每个金属挤压件具有一个锁定孔和一个高于管芯焊盘的焊接表面。金属挤压件用于通过引线接合来改善接地连接。当芯片焊盘的底表面从用于半导体封装的密封剂暴露时，金属挤压件有助于固定芯片焊盘而不产生应力传输。

5. 发明申请

US20080233739A1 METHOD FOR FABRICATING CONDUCTIVE LAYER 失效
标题翻译：制导导电层的方法
公开(公告)号：US20080233739A1
公开(公告)日：2008-09-25
申请号：US11761374
申请日：2007-06-12
申请人： Hsien-Kun Chiu , Chin-Chuan Lai , Yi-Pen Lin , Shu-Chen Yang
发明人： Hsien-Kun Chiu , Chin-Chuan Lai , Yi-Pen Lin , Shu-Chen Yang
IPC分类号： H01L21/44
CPC分类号： H05K3/182 , C23C18/1608 , C23C18/1653 , C25D5/56 , H01L21/2885 , H01L21/76838 , H01L27/124 , H05K3/064 , H05K2203/0709
摘要： A method for fabricating a conductive layer is provided. First, a substrate is provided and a patterned adhesion layer is formed on the substrate. Next, a chemical plating process is performed to form a first metal layer on the patterned adhesion layer by placing the substrate in an electroplating solution and the electroplating solution is shocked. Thereafter, a second metal layer is formed on the first metal layer by performing a plating process.
摘要翻译：提供一种制造导电层的方法。首先，提供基板，并且在基板上形成图案化的粘附层。接着，进行化学镀处理，通过将基板置于电镀液中而使电镀液被冲击而在图案化的粘合层上形成第一金属层。此后，通过进行电镀工艺在第一金属层上形成第二金属层。

6. 发明申请

US20080105926A1 THIN FILM TRANSISTOR AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：薄膜晶体管及其制造方法
公开(公告)号：US20080105926A1
公开(公告)日：2008-05-08
申请号：US11738524
申请日：2007-04-23
申请人： Chin-Chuan Lai , Hsian-Kun Chiu , Yi-Pen Lin , Shu-Chen Yang
发明人： Chin-Chuan Lai , Hsian-Kun Chiu , Yi-Pen Lin , Shu-Chen Yang
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/4908 , H01L27/124 , H01L29/458
摘要： A thin film transistor and a fabrication method thereof are provided. First, a gate is formed on a substrate. Next, a gate insulating layer is formed to cover the gate and then a channel layer is formed on a portion of the gate insulating layer above the gate. Afterwards, a source and a drain are formed on the channel layer. The method of forming the gate includes forming a copper alloy layer containing nitrogen and a copper layer sequentially and then removing a portion of the copper alloy layer containing nitrogen and the copper layer. The source and the drain could be formed by the same fabrication method.
摘要翻译：提供薄膜晶体管及其制造方法。首先，在基板上形成栅极。接下来，形成栅极绝缘层以覆盖栅极，然后在栅极上方的栅极绝缘层的一部分上形成沟道层。之后，在沟道层上形成源极和漏极。形成栅极的方法包括依次形成含有氮和铜层的铜合金层，然后除去含有氮的铜合金层和铜层的一部分。源极和漏极可以通过相同的制造方法形成。

7. 外观设计

USD491896S1 Cable connector assembly 失效
公开(公告)号：USD491896S1
公开(公告)日：2004-06-22
申请号：US29186645
申请日：2003-07-17
申请人： Shu-Chen Yang , Yung-Chien Chung , Hsien-Chu Lin , Chih-Kai Huang
设计人： Shu-Chen Yang , Yung-Chien Chung , Hsien-Chu Lin , Chih-Kai Huang

8. 外观设计

USD491529S1 Cable connector assembly 失效
公开(公告)号：USD491529S1
公开(公告)日：2004-06-15
申请号：US29186641
申请日：2003-07-17
申请人： Shu-Chen Yang , Yung-Chien Chung , Hsien-Chu Lin , Chih-Kai Huang
设计人： Shu-Chen Yang , Yung-Chien Chung , Hsien-Chu Lin , Chih-Kai Huang

9. 发明申请

US20050199986A1 Leadframe with die pad 有权
标题翻译：带芯片的引线框架
公开(公告)号：US20050199986A1
公开(公告)日：2005-09-15
申请号：US11076951
申请日：2005-03-11
申请人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
发明人： Kang-Wei Ma , Shu-Chen Yang , Ying-Chen Sun , Li-Ping Chen
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
摘要翻译：引线框架包括管芯焊盘，多个连接杆，多个金属挤压件和多个引线。引线布置在管芯焊盘的周围。连接杆连接到管芯焊盘的角部，并且金属挤压件连接到管芯焊盘的侧面，但与连接条分离。每个金属挤压件具有一个锁定孔和一个高于管芯焊盘的焊接表面。金属挤压件用于通过引线接合来改善接地连接。当芯片焊盘的底表面从用于半导体封装的密封剂暴露时，金属挤压件有助于固定芯片焊盘而不产生应力传输。

10. 外观设计

USD501649S1 Electrical connector 失效
公开(公告)号：USD501649S1
公开(公告)日：2005-02-08
申请号：US29187418
申请日：2003-07-30
申请人： Shu-Chen Yang , Hsien-Chu Lin , Yung-Chien Chung
设计人： Shu-Chen Yang , Hsien-Chu Lin , Yung-Chien Chung

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式