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1. 发明申请

US20060208360A1 Top via pattern for bond pad structure 有权
标题翻译：顶部通孔图案用于焊盘结构
公开(公告)号：US20060208360A1
公开(公告)日：2006-09-21
申请号：US11081704
申请日：2005-03-17
申请人： Ho-Yin Yiu , Fu-Jier Fan , Yu-Jui Wu , Aaron Wang , Hsiang-Wei Wang , Huang-Sheng Lin , Ming-Hsien Chen , Ruey-Yun Shiue
发明人： Ho-Yin Yiu , Fu-Jier Fan , Yu-Jui Wu , Aaron Wang , Hsiang-Wei Wang , Huang-Sheng Lin , Ming-Hsien Chen , Ruey-Yun Shiue
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/05567 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/05042 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/05552
摘要： Top via pattern for a bond pad structure has at least one first via group and at least one second via group adjacent to each other. The first via group has at least two line vias extending in a first direction. The second via group has at least two line vias extending in a second direction different from said first direction. The line via of the first via group does not cross the line via of the second via group.
摘要翻译：用于接合焊盘结构的顶部通孔图案具有至少一个彼此相邻的第一通孔组和至少一个第二通孔组。第一通孔组具有沿第一方向延伸的至少两条线通孔。第二通孔组具有沿与第一方向不同的第二方向延伸的至少两条线通孔。第一通孔组的通路不穿过第二通路组的通路。

2. 发明授权

US07323784B2 Top via pattern for bond pad structure 有权
标题翻译：顶部通孔图案用于焊盘结构
公开(公告)号：US07323784B2
公开(公告)日：2008-01-29
申请号：US11081704
申请日：2005-03-17
申请人： Ho-Yin Yiu , Fu-Jier Fan , Yu-Jui Wu , Aaron Wang , Hsiang-Wei Wang , Huang-Sheng Lin , Ming-Hsien Chen , Ruey-Yun Shiue
发明人： Ho-Yin Yiu , Fu-Jier Fan , Yu-Jui Wu , Aaron Wang , Hsiang-Wei Wang , Huang-Sheng Lin , Ming-Hsien Chen , Ruey-Yun Shiue
IPC分类号： H01L29/40
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/05567 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/05042 , H01L2924/10329 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/05552
摘要： Top via pattern for a bond pad structure has at least one first via group and at least one second via group adjacent to each other. The first via group has at least two line vias extending in a first direction. The second via group has at least two line vias extending in a second direction different from said first direction. The line via of the first via group does not cross the line via of the second via group.
摘要翻译：用于接合焊盘结构的顶部通孔图案具有至少一个彼此相邻的第一通孔组和至少一个第二通孔组。第一通孔组具有沿第一方向延伸的至少两条线通孔。第二通孔组具有沿与第一方向不同的第二方向延伸的至少两条线通孔。第一通孔组的通路不穿过第二通路组的通路。

3. 发明授权

US06673652B1 Underfilling method for a flip-chip packaging process 失效
标题翻译：倒装芯片封装工艺的底部填充方法
公开(公告)号：US06673652B1
公开(公告)日：2004-01-06
申请号：US09128226
申请日：1998-08-03
申请人： Jao-Chin Cheng , Ming-Hsien Chen
发明人： Jao-Chin Cheng , Ming-Hsien Chen
IPC分类号： H01L2144
CPC分类号： H01L21/563 , H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/73203 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2224/29099 , H01L2924/00 , H01L2224/05599
摘要： An underfilling method for a flip-chip packaging process includes coating a underfill material layer over bumps on a semiconductor substrate, performing a die sawing process on the semiconductor substrate to from a number of dies, and performing a flip-chip process on each of the dies to adhere each of the dies to another substrate. Because the underfill material is coated from the top of the bumps, the air-trapping problem can be eliminated. The process time is shortened to improve yield because the underfill material is dispensed over all the dies before the die-sawing process. This is different from the conventional underfilling process, which has to dispense underfill material and seal edges on each individual die.
摘要翻译：用于倒装芯片封装工艺的底部填充方法包括在半导体衬底上的凸块上涂覆底部填充材料层，对半导体衬底进行模具切割处理以从多个裸片上进行倒装芯片处理，将每个管芯粘附到另一个基底上。因为底部填充材料是从凸起的顶部涂覆的，所以可以消除空气捕获问题。缩短处理时间以提高产量，因为在模切工艺之前将底部填充材料分配在所有模具上。这与传统的填充过程不同，后处理过程必须在每个单独的模具上分配底部填充材料和密封边缘。

4. 发明申请

US20110280110A1 Indicator timepiece having light diffusing effect 审中-公开
标题翻译：指示灯具有光漫射效果
公开(公告)号：US20110280110A1
公开(公告)日：2011-11-17
申请号：US12800337
申请日：2010-05-13
申请人： Ming-Hsien Chen
发明人： Ming-Hsien Chen
IPC分类号： G04B19/30
CPC分类号： G04B19/30
摘要： An indicator timepiece having a light diffraction function is provided. Therein a light diffusion unit is provided between a timepiece movement and a time indicating unit of the indicator timepiece for receiving a lighting device and providing at least light diffraction to a light generated from the lighting device. Thereby the light diffraction of the light diffusion unit converts the light into a sheet-like lighting presented on the time indicating unit.
摘要翻译：提供具有光衍射功能的指示器时钟。其中，在钟表运动和指示器表的时间指示单元之间设置光扩散单元，用于接收照明装置，并且至少对从照明装置产生的光提供光衍射。由此，光漫射单元的光衍射将光转换成在时间指示单元上呈现的片状照明。

5. 发明申请

US20070152295A1 Metal-insulator-metal capacitor structure having low voltage dependence 失效
标题翻译：具有低电压依赖性的金属 - 绝缘体 - 金属电容器结构
公开(公告)号：US20070152295A1
公开(公告)日：2007-07-05
申请号：US11322209
申请日：2005-12-29
申请人： Der-Chyang Yeh , Chie-Iuan Lin , Chuan-Ying Lee , Y. Chao , Ming-Hsien Chen
发明人： Der-Chyang Yeh , Chie-Iuan Lin , Chuan-Ying Lee , Y. Chao , Ming-Hsien Chen
IPC分类号： H01L29/00
CPC分类号： H01L23/5223 , H01L28/60 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor capacitor device. A dielectric layer is on a substrate. A stack capacitor structure is disposed in the dielectric layer and comprises first and overlying second MIM capacitors electrically connected in parallel. The first and second MIM capacitors have individual upper and lower electrode plates and different compositions of capacitor dielectric layers.
摘要翻译：一种半导体电容器件。电介质层在衬底上。堆叠电容器结构设置在电介质层中，并且包括并联电连接的第一和第二MIM电容器。第一和第二MIM电容器具有单独的上电极板和下电极板以及电容器介电层的不同组成。

6. 发明授权

US07763923B2 Metal-insulator-metal capacitor structure having low voltage dependence 失效
标题翻译：具有低电压依赖性的金属 - 绝缘体 - 金属电容器结构
公开(公告)号：US07763923B2
公开(公告)日：2010-07-27
申请号：US11322209
申请日：2005-12-29
申请人： Der-Chyang Yeh , Chie-Iuan Lin , Chuan-Ying Lee , Yi-Ting Chao , Ming-Hsien Chen
发明人： Der-Chyang Yeh , Chie-Iuan Lin , Chuan-Ying Lee , Yi-Ting Chao , Ming-Hsien Chen
IPC分类号： H01L27/108
CPC分类号： H01L23/5223 , H01L28/60 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor capacitor device. A dielectric layer is on a substrate. A stack capacitor structure is disposed in the dielectric layer and comprises first and overlying second MIM capacitors electrically connected in parallel. The first and second MIM capacitors have individual upper and lower electrode plates and different compositions of capacitor dielectric layers.
摘要翻译：一种半导体电容器件。电介质层在衬底上。堆叠电容器结构设置在电介质层中，并且包括并联电连接的第一和第二MIM电容器。第一和第二MIM电容器具有单独的上电极板和下电极板以及电容器介电层的不同组成。

7. 发明申请

US20080083938A1 IMAGE SENSORS AND METHODS OF FABRICATING IMAGE SENSORS 有权
标题翻译：图像传感器和图像传感器的制作方法
公开(公告)号：US20080083938A1
公开(公告)日：2008-04-10
申请号：US11548189
申请日：2006-10-10
申请人： Yao Hsiang Liang , Wen-Kung Cheng , Chen-Peng Fan , Ming-Hsien Chen , Richard Chen , Jung-Chen Yang , Wen-Yu Ho , Chao-Keng Li , Yong-Sin Chang , Labo Chang
发明人： Yao Hsiang Liang , Wen-Kung Cheng , Chen-Peng Fan , Ming-Hsien Chen , Richard Chen , Jung-Chen Yang , Wen-Yu Ho , Chao-Keng Li , Yong-Sin Chang , Labo Chang
IPC分类号： H01L31/06 , H01L21/00
CPC分类号： H01L27/14609 , H01L27/14643 , H01L27/14689
摘要： A semiconductor structure includes a transistor formed over a substrate. The transistor includes a transistor gate and at least one source/drain region. The semiconductor structure includes a pre-determined region coupled to the transistor. The semiconductor structure further includes a resist protection oxide (RPO) layer formed over the pre-determined region, wherein the RPO layer has a level of nitrogen of about 0.35 atomic % or less.
摘要翻译：半导体结构包括形成在衬底上的晶体管。晶体管包括晶体管栅极和至少一个源极/漏极区域。半导体结构包括耦合到晶体管的预定区域。半导体结构还包括形成在预定区域上的抗蚀剂保护氧化物（RPO）层，其中RPO层具有约0.35原子％或更低的氮含量。

8. 发明授权

US07772625B2 Image sensor having an RPO layer containing nitrogen 有权
标题翻译：具有含有氮的RPO层的图像传感器
公开(公告)号：US07772625B2
公开(公告)日：2010-08-10
申请号：US11548189
申请日：2006-10-10
申请人： Yao Hsiang Liang , Wen-Kung Cheng , Chen-Peng Fan , Ming-Hsien Chen , Richard Chen , Jung-Chen Yang , Wen-Yu Ho , Chao-Keng Li , Yong-Sin Chang , Labo Chang
发明人： Yao Hsiang Liang , Wen-Kung Cheng , Chen-Peng Fan , Ming-Hsien Chen , Richard Chen , Jung-Chen Yang , Wen-Yu Ho , Chao-Keng Li , Yong-Sin Chang , Labo Chang
IPC分类号： H01L31/09
CPC分类号： H01L27/14609 , H01L27/14643 , H01L27/14689
摘要： A semiconductor structure includes a transistor formed over a substrate. The transistor includes a transistor gate and at least one source/drain region. The semiconductor structure includes a pre-determined region coupled to the transistor. The semiconductor structure further includes a resist protection oxide (RPO) layer formed over the pre-determined region, wherein the RPO layer has a level of nitrogen of about 0.35 atomic % or less.
摘要翻译：半导体结构包括形成在衬底上的晶体管。晶体管包括晶体管栅极和至少一个源极/漏极区域。半导体结构包括耦合到晶体管的预定区域。半导体结构还包括形成在预定区域上的抗蚀剂保护氧化物（RPO）层，其中RPO层具有约0.35原子％或更低的氮含量。

9. 发明申请

US20080096687A1 Golf Club Head 审中-公开
标题翻译：高尔夫俱乐部主管
公开(公告)号：US20080096687A1
公开(公告)日：2008-04-24
申请号：US11958004
申请日：2007-12-17
申请人： Ming-Hsien Chen
发明人： Ming-Hsien Chen
IPC分类号： A63B53/04
CPC分类号： A63B53/047 , A63B60/54 , A63B2053/0408 , A63B2053/0416 , A63B2053/0425 , A63B2209/00 , A63B2209/02 , A63B2209/10
摘要： A golf club head includes: a head body having a front face and a recess formed in the front face; a striking member fitted in the recess, and having a striking plate flush with the front face and having a thickness ranging from 0.6 mm to 1.4 mm, a carbon-fibre composite layer having a thickness ranging from 3.0 mm to 5.0 mm, and a first adhesive layer for adhering the striking plate to the composite layer; and a second adhesive layer to adhere the composite layer of the striking member to the head body. A weight ratio of the composite layer to the striking member ranges from 50% to 85%.
摘要翻译：高尔夫球杆头包括：头体，其具有形成在前表面中的前表面和凹部; 安装在凹部中的冲击构件，具有与前表面齐平并且具有0.6mm至1.4mm的厚度的冲击板，厚度范围为3.0mm至5.0mm的碳纤维复合层，以及第一用于将击打板粘合到复合层的粘合剂层; 以及第二粘合剂层，以将击打构件的复合层粘附到头部本体。复合层与打击构件的重量比为50％至85％。

10. 发明申请

US20060020537A1 Internet business transactions approach model system 审中-公开
标题翻译：互联网业务交易方式示范系统
公开(公告)号：US20060020537A1
公开(公告)日：2006-01-26
申请号：US10897540
申请日：2004-07-23
申请人： Yun-Ming Chang , Ming-Hsien Chen , Po-Jih Wang
发明人： Yun-Ming Chang , Ming-Hsien Chen , Po-Jih Wang
IPC分类号： G06Q40/00
CPC分类号： G06Q30/08 , G06Q40/04
摘要： The present invention relates to an internet business transactions approach model system, which uses an internet electrical business platform to proceed the following steps. Generate the member chain group, being able to recommend son members by existed members, and generate the member chain group by above linkage of members and their son members. Account the requirement information from members to take the internet transaction. The internet electrical business platform is able to use the trading information interactive interface program (living shopping messenger) to send out the goods requirement information to venders that are collected interactively from all the members of the member chain group. And, the members also is able to send out the goods requirement information via this internet electrical business platform, and the internet electrical business platform will merge and match the information of buyers and venders for required goods and estimated prices, to negotiate with venders with large quantities for a group of members or lead a individual buyer to match with a suitable vender. Finally, take the approach feedback mechanism, feedback money to members by a percentage of revenue from the internet electrical business platform.
摘要翻译：本发明涉及一种使用互联网电商业平台进行以下步骤的互联网商业交易方式模型系统。生成成员链组，能够由现有成员推荐儿子成员，并通过成员及其子成员之间的联系来生成成员链组。记录会员的需求信息进行互联网交易。互联网电子商务平台能够使用交易信息交互界面程序（生活购物信使）向成员链所有成员交互式收集的供应商发出货物需求信息。而且，会员还可以通过这个互联网电子商务平台发出货物需求信息，互联网电子商务平台将合并和匹配买家和卖家的所需商品信息和估价，与大型商家谈判一组成员的数量或导致个人买家与适当的供应商匹配。最后，采取方法反馈机制，通过网络电子商务平台的收入百分比向成员汇报资金。

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