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    • 3. 发明授权
    • Semiconductor device having a silicon-on-insulator structure
    • 具有绝缘体上硅结构的半导体器件
    • US5777365A
    • 1998-07-07
    • US721626
    • 1996-09-26
    • Hitoshi YamaguchiToshiyuki MorishitaHiroaki Himi
    • Hitoshi YamaguchiToshiyuki MorishitaHiroaki Himi
    • H01L21/336H01L21/76H01L21/762H01L27/12H01L29/10H01L29/78H01L29/786H01L27/02
    • H01L29/7824H01L21/76264H01L29/66681H01L21/76275H01L21/76286H01L29/78603
    • A semiconductor device of SOI structure exhibits a excellent heat-radiating characteristic while assuring breakdown-voltage and element-isolating performance. A buried silicon oxide film having a thickness required by the breakdown-voltage of a semiconductor element is buried between a SOI layer and a silicon substrate. A SOI layer is divided into island silicon regions by a groove for electrical-isolation use, and the groove is filled with dielectric such as an oxide film and polycrystalline silicon. In an island silicon region, a LDMOS transistor having high breakdown voltage may be formed as the semiconductor element, and potential distribution is created in accordance with a voltage application to the semiconductor element. The buried silicon oxide film at a region where low electric potential is distributed, for example a region below a grounded well region of the LDMOS transistor, is made thin. Through the thin portion of the buried silicon oxide film, heat generated by the operation of the semiconductor element can easily be propagated to the silicon substrate and radiated.
    • SOI结构的半导体器件在确保击穿电压和元件隔离性能的同时表现出优异的散热特性。 具有半导体元件的击穿电压所需的厚度的掩埋氧化硅膜被掩埋在SOI层和硅衬底之间。 SOI层通过用于电绝缘的沟槽被划分为岛状硅区域,并且沟槽填充有诸如氧化物膜和多晶硅的电介质。 在岛状硅区域中,可以形成具有高击穿电压的LDMOS晶体管作为半导体元件,并且根据对半导体元件的施加电压产生电位分布。 在低电位分布的区域(例如LDMOS晶体管的接地阱区域下方的区域)中的掩埋氧化硅膜变薄。 通过掩埋氧化硅膜的薄壁部分,可以容易地将由半导体元件的工作产生的热量传播到硅衬底并辐射。