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    • 2. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US4563227A
    • 1986-01-07
    • US660255
    • 1984-10-12
    • Hiroyuki SakaiKenji KawakitaTsutomu FujitaToyoki Takemoto
    • Hiroyuki SakaiKenji KawakitaTsutomu FujitaToyoki Takemoto
    • H01L21/762H01L21/38H01L21/467
    • H01L21/76232H01L21/762
    • The invention provides a method for manufacturing a semiconductor device, wherein a semiconductor substrate is vertically etched to form a groove, antioxidant insulating films are formed on the side walls of the groove, and local oxidation is performed. Lateral extrusion of an oxide film which is a so-called bird's beak and a projection of the oxide film which is a so-called bird's head are substantially eliminated. As a result, the active region of the transistor, that is, the element formation region may not be narrowed, providing high packing density and high precision. Furthermore, the surface of the semiconductor substrate is flattened to prevent short-circuiting and disconnections of wiring layers. Stable manufacturing process provides a high yield of the semiconductor device. Electrical characteristics of the semiconductor device are greatly improved.
    • 本发明提供一种制造半导体器件的方法,其中半导体衬底被垂直蚀刻以形成沟槽,在沟槽的侧壁上形成抗氧化绝缘膜,并进行局部氧化。 基本上消除了所谓的鸟喙的氧化膜的侧向挤出和所谓的鸟头的氧化膜的突起。 结果,晶体管的有源区,即元件形成区域可能不会变窄,提供高的堆积密度和高精度。 此外,半导体衬底的表面被平坦化以防止布线层的短路和断开。 稳定的制造工艺提供了高产量的半导体器件。 半导体器件的电气特性大大提高。
    • 7. 发明授权
    • Method of making bipolar transistors
    • 制造双极晶体管的方法
    • US4826780A
    • 1989-05-02
    • US124423
    • 1987-11-23
    • Toyoki TakemotoTadao KomedaHaruyasu YamadaTsutomu Fujita
    • Toyoki TakemotoTadao KomedaHaruyasu YamadaTsutomu Fujita
    • H01L21/74H01L21/761H01L21/8228H01L27/02H01L27/06H01L27/082H01L27/092H01L21/38
    • H01L27/0244H01L21/74H01L21/761H01L21/82285H01L27/0623H01L27/0826H01L27/0922Y10S148/009Y10S148/151
    • In a semiconductor IC, a vertical pnp or npn transistor of a uniform characteristic and a high breakdown voltage is made by forming, for example, a p.sup.- -collector region (39) in an n-type epitaxial region, an n-well base region (41) formed in the p.sup.- -collector region (39) and a p-emitter region (42) formed in the n-well base region (41); and furthermore, for example as shown in FIG. 9, p.sup.- -regions (40) and (49) are formed simultaneously with the p.sup.- -collector region (39) and an n-region (53) is formed simultaneously with the n-well base region (41), thereby constituting IIL of superior characteristics and a high resistance device at the same time as forming of the vertical transistor without substantial increase of manufacturing steps; and in the similar way, by combining the p.sup.- -region and n-region formed in the above-mentioned simultaneous steps with other region formed simultaneously with the forming of the vertical transistor, high h.sub.FE transistor, high speed vertical npn transistor, cross-over devices, p-channel and/or n-channel MOS transistors can be formed within limited manufacturing steps.
    • 在半导体IC中,通过在n型外延区域中形成例如p型集电极区域(39),形成具有均匀特性和高击穿电压的垂直pnp或npn晶体管,n阱基极 形成在p型集电极区域(39)中的区域(41)和形成在n阱基极区域(41)中的p型发射极区域(42)。 此外,例如如图1所示。 如图9所示,p-区域(40)和(49)与p-集电极区域(39)同时形成,并且与n-阱基区域(41)同时形成n区域(53),从而构成 IIL具有优越的特性和高电阻器件,同时形成垂直晶体管而不大幅度增加制造步骤; 并且以类似的方式,通过将在上述同步步骤中形成的p区域和n区域与形成垂直晶体管,高hFE晶体管,高速垂直npn晶体管, 可以在有限的制造步骤中形成器件,p沟道和/或n沟道MOS晶体管。