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    • 2. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08551857B2
    • 2013-10-08
    • US13034749
    • 2011-02-25
    • Yuji ImamuraTsuyoshi FujiwaraToyohiko Kuno
    • Yuji ImamuraTsuyoshi FujiwaraToyohiko Kuno
    • H01L29/92
    • H01L23/5223H01L23/53238H01L27/0688H01L28/60H01L2924/0002H01L2924/00
    • The technique for manufacturing a high-capacitance and high-accuracy MIM electrostatic capacitor by a small number of steps is provided. After a lower electrode of the electrostatic capacitor and second wiring are formed at the same time on a first interlayer insulating film, an opening part is formed in a second interlayer insulating film deposited on the first interlayer insulating film. Next, a capacitance insulating film, a second metal film and a protective metal film are sequentially deposited on the second interlayer insulating film including the interior of the opening part, and the protective metal film, the second metal film and the capacitance insulating film on the second interlayer insulating film are polished and removed by a CMP method, thereby causing the capacitance insulating film, an upper electrode made of the second metal film and the protective metal film to remain in the opening part.
    • 提供了通过少量步骤制造高电容和高精度MIM静电电容器的技术。 在第一层间绝缘膜上同时形成静电电容器和第二布线的下电极之后,在沉积在第一层间绝缘膜上的第二层间绝缘膜中形成开口部。 接下来,在包括开口部的内部的第二层间绝缘膜上顺序地沉积电容绝缘膜,第二金属膜和保护金属膜,并且在保护金属膜,第二金属膜和电容绝缘膜上 通过CMP法对第二层间绝缘膜进行抛光和去除,从而使电容绝缘膜,由第二金属膜制成的上电极和保护金属膜保持在开口部分。