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    • 6. 发明授权
    • Cleaning apparatus, cleaning method and recording medium
    • 清洁装置,清洁方法和记录介质
    • US08308870B2
    • 2012-11-13
    • US12610599
    • 2009-11-02
    • Teruomi MinamiTakashi YabutaSatoru TanakaHirotaka MaruyamaKouichi Eguchi
    • Teruomi MinamiTakashi YabutaSatoru TanakaHirotaka MaruyamaKouichi Eguchi
    • B08B3/08
    • H01L21/67051
    • Disclosed are a cleaning apparatus and a cleaning method, which can collect a chemical liquid without reducing the throughput after a substrate is subjected to a cleaning treatment and dried by using a drying solvent, such as IPA. The disclosed cleaning apparatus carries out a chemical liquid cleaning treatment, a rinsing treatment, and a drying treatment with IPA, in order, on a wafer W while rotating wafer W, and includes a cleaning liquid supply device for supplying a cleaning liquid for cleaning the drain cup and the drain tube to the drain cup in a state where the cleaning liquid is not supplied to the wafer. Also, the apparatus further includes a control unit for controlling respective components of the cleaning apparatus. The control unit, after the cleaning treatment and then the rinsing treatment of wafer W, at the time when the drying treatment is performed by IPA, controls the cleaning liquid to be supplied to the drain cup.
    • 公开了一种清洁装置和清洁方法,其可以在基板经受清洁处理之后收集化学液体而不降低生产量,并通过使用诸如IPA的干燥溶剂进行干燥。 所公开的清洁装置在旋转晶片W的同时在晶片W上进行化学液体清洗处理,漂洗处理和IPA干燥处理,并且包括用于提供用于清洁的清洁液的清洗液供给装置 排水杯和排水管排入排水杯,在清洗液未供给到晶片的状态下。 此外,该装置还包括用于控制清洁装置的各个部件的控制单元。 在通过IPA进行干燥处理之后,控制单元在进行清洁处理,然后进行晶片W的漂洗处理之后,控制向排水杯供给的清洗液。