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1. 发明授权

US5488255A Cooling device for semiconductor packages, having flexible film heat expulsion means 失效
标题翻译：用于半导体封装的冷却装置，具有柔性膜散热装置
公开(公告)号：US5488255A
公开(公告)日：1996-01-30
申请号：US162265
申请日：1993-12-07
申请人： Kazuo Sato , Mitsuhiro Shikida , Shigeo Ohashi , Toshio Hatada , Noriyuki Ashiwake , Shinji Tanaka , Takeshi Harada , Yukio Honda
发明人： Kazuo Sato , Mitsuhiro Shikida , Shigeo Ohashi , Toshio Hatada , Noriyuki Ashiwake , Shinji Tanaka , Takeshi Harada , Yukio Honda
IPC分类号： F04B43/04 , F04B45/047 , H01L23/467 , H02N1/00 , H01L23/34
CPC分类号： H01L23/467 , F04B43/043 , F04B45/047 , H02K99/20 , H02N1/006 , H01L2924/0002 , H01L2924/15192
摘要： A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.
摘要翻译：根据本发明的冷却装置，其中通过平面电极和设置在平坦电极的端部上的侧板形成空间，并且固定在该空间中的具有字母S的形状的柔性膜被固定到半导体封装，使得一个平板电极安装在半导体封装上。各个扁平电极交替供电以移动柔性膜的S形部分。

2. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

3. 发明授权

US5764483A Cooling unit for electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5764483A
公开(公告)日：1998-06-09
申请号：US730441
申请日：1996-10-15
申请人： Shigeo Ohashi , Toshio Hatada , Shinji Tanaka
发明人： Shigeo Ohashi , Toshio Hatada , Shinji Tanaka
IPC分类号： H05K7/20 , G06F1/20 , H01L23/427 , H01L23/433 , H01L23/473
CPC分类号： G06F1/203 , H01L23/427 , H01L23/433 , H01L23/473 , H01L2924/0002
摘要： Heat generated at heat generating components is efficiently transported to a wall of a metal box serving as a heat dissipation section to cool the heat generating components even in an apparatus, in which box the heat generating components together with other components are mounted. The heat generating components and the heat dissipation section are connected to each other through a thermal transport device having a flexible structure. The heat generating components and the box are readily connected to each other irrespective of the arrangement of components, and heat is efficiently transported by driving the liquid. In the heat dissipation section, because the heat generating components and the wall of the metal box are thermally connected to each other, a high heat dissipation capacity is obtained as heat is diffused extensively into the wall due to a high thermal conductivity of the metal box.
摘要翻译：在发热部件中产生的热量即使在其中安装有发热部件的装置中也能有效地输送到用作散热部分的金属盒的壁上，以冷却发热部件。发热部件和散热部通过具有柔性结构的热传输装置相互连接。不管组件的布置如何，发热部件和箱体彼此容易地连接，并且通过驱动液体而有效地输送热量。在散热部中，由于发热部件和金属盒的壁彼此热连接，因为由于金属盒的高导热性而热量扩散到壁中，所以获得高的散热能力。

4. 发明授权

US5774334A Low thermal resistant, fluid-cooled semiconductor module 失效
标题翻译：低耐热，流体冷却的半导体模块
公开(公告)号：US5774334A
公开(公告)日：1998-06-30
申请号：US520338
申请日：1995-08-28
申请人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
发明人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
摘要翻译：半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。作为导热介质的液体封装在半导体模块中。半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

5. 发明授权

US5705850A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译：所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。散热器一体地形成在壳体上。利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

6. 发明授权

US5406807A Apparatus for cooling semiconductor device and computer having the same 失效
标题翻译：用于冷却半导体器件的设备和具有该器件的计算机
公开(公告)号：US5406807A
公开(公告)日：1995-04-18
申请号：US77109
申请日：1993-06-16
申请人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
发明人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
IPC分类号： H01L23/427 , F25D17/02
CPC分类号： H01L23/427 , H01L2924/0002 , Y10S165/908
摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.
摘要翻译：一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。

7. 发明授权

US5959351A Liquid-cooled electronic device 失效
标题翻译：液冷电子设备
公开(公告)号：US5959351A
公开(公告)日：1999-09-28
申请号：US103227
申请日：1993-08-09
申请人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
发明人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
IPC分类号： H01L23/44 , F15D1/08 , H01L23/427 , H01L23/473 , H01L23/34
CPC分类号： F15D1/08 , H01L23/473 , F28F13/02 , H01L2924/0002
摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.
摘要翻译：公开了一种液冷电子装置。半导体器件安装在浸没在冷却液中的半导体模块的衬底上。在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在开始半导体器件通电的时间，从而稳定半导体器件的温度。

8. 发明授权

US5646824A Electronic equipment and lap-top type electronic equipment 失效
标题翻译：电子设备和膝上型电子设备
公开(公告)号：US5646824A
公开(公告)日：1997-07-08
申请号：US489623
申请日：1995-06-12
申请人： Shigeo Ohashi , Toshio Hatada , Takeo Tanaka , Susumu Iwai
发明人： Shigeo Ohashi , Toshio Hatada , Takeo Tanaka , Susumu Iwai
IPC分类号： F28D15/02 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , F28D15/00 , F28D15/0266 , H01L23/473 , G06F2200/201 , H01L2924/0002
摘要： A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging radiator which heat radiating fins are installed at a peripheral portion of a body of electronic equipment. The heat generated by the semiconductor element is transmitted by liquid moving between the headers via flexible tubes and then to the heat radiating fins, which heat is discharged outside of the body of equipment. Since the flat shaped header and the flexible tubes are employed, a high heat generating semiconductor element and the heat radiating fins are thermally connected with ease without being influenced by the configurational condition in the equipment even when many semiconductor elements are mounted inside a small space.
摘要翻译：具有热接收侧的扁平头部安装在安装在电路板上的半导体元件上。具有热接收侧的集管连接到具有附接到多个散热片的热接收侧的另一个集管，以形成散热片安装在电子设备主体的周边部分的散热片。由半导体元件产生的热量通过液体通过柔性管在集管之间移动，然后传递到散热片，热量被排放到设备本体外部。由于使用扁平形的集管和柔性管，因此即使在许多半导体元件安装在小空间内的情况下，高发热半导体元件和散热片也容易热连接而不受设备的结构条件的影响。

9. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

10. 发明授权

US5558493A Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower 失效
标题翻译：具有鼓风机和气流调节板的强制空气冷却装置可减少鼓风机入口的涡流
公开(公告)号：US5558493A
公开(公告)日：1996-09-24
申请号：US477653
申请日：1995-06-07
申请人： Yutaka Hayashi , Mitsuo Miyamoto , Michihito Watarai , Takayuki Atarashi , Tetsuya Tanaka , Toshio Hatada , Yoshihiro Takada , Takahiro Daikoku
发明人： Yutaka Hayashi , Mitsuo Miyamoto , Michihito Watarai , Takayuki Atarashi , Tetsuya Tanaka , Toshio Hatada , Yoshihiro Takada , Takahiro Daikoku
IPC分类号： F25D1/00 , C04B28/18 , F04D29/42 , H05K7/20 , F04D29/66
CPC分类号： F04D29/4213
摘要： A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.
摘要翻译：一种强制用空气冷却装置，其特征在于，具有鼓风机，所述鼓风机用于将鼓风机从壳体或机架上进行操作的设备中，从鼓风机的进气表面或进气口吸入的空气吹向电子设备，其中，装置具有垂直于入口表面垂直相交的流动调节板，其紧靠在进气表面之前安装。通过这种结构，可以防止在进气表面附近的涡流流动，从鼓风机获得的冷却能力最优化，从而达到能够有效地冷却电子设备的效果，而不需要在进气表面的鼓风机和安装有鼓风机的框架或壳体的壁面相比，与同一设备的常规安装相比，在没有流量调节板的情况下。

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