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1. 发明授权

US08134231B2 Semiconductor chip and semiconductor device 有权
标题翻译：半导体芯片和半导体器件
公开(公告)号：US08134231B2
公开(公告)日：2012-03-13
申请号：US12348543
申请日：2009-01-05
申请人： Hikari Sano , Yoshihiro Tomita , Takahiro Nakano
发明人： Hikari Sano , Yoshihiro Tomita , Takahiro Nakano
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L27/14618 , H01L23/3677 , H01L23/481 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L2224/02351 , H01L2224/02372 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/014
摘要： A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
摘要翻译：一种半导体芯片，包括：包括前表面的基板; 形成在所述前表面上且包括多个半导体元件的集成电路; 以及形成在所述基板的与所述半导体元件中的至少一个相对应的区域中的散热塞。散热塞由具有大于在其基板的背面上具有开口的非穿透孔中形成的基板的热导率的材料制成。

2. 发明申请

US20090059055A1 OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20090059055A1
公开(公告)日：2009-03-05
申请号：US12195081
申请日：2008-08-20
申请人： Takahiro Nakano , Yoshihiro Tomita , Hikari Sano
发明人： Takahiro Nakano , Yoshihiro Tomita , Hikari Sano
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14627 , H01L27/14687 , H01L2224/02372 , H01L2224/05001 , H01L2224/05009 , H01L2224/05022 , H01L2224/05548 , H01L2224/0557 , H01L2224/11 , H01L2924/00014 , H04N5/2254 , H01L2224/05099
摘要： An optical device includes: an optical element including an imaging region, a peripheral circuit region formed at the rim of the imaging region and including a plurality of electrode portions, and a plurality of microlenses formed on the imaging region; a plurality of through-hole electrodes connected to the respective electrode portions and formed through the semiconductor substrate along the thickness of the semiconductor substrate; a plurality of metal interconnects connected to the respective through-hole electrodes and formed on a back surface of the semiconductor substrate opposite to a principal surface of the semiconductor substrate; an adhesive member formed on a surface of the optical element and made of a resin; and a transparent board bonded to the optical element with the adhesive member interposed therebetween. The transparent board has a planar shape larger than that of the optical element.
摘要翻译：光学装置包括：光学元件，包括成像区域，形成在成像区域的边缘处并包括多个电极部分的外围电路区域和形成在成像区域上的多个微透镜; 多个通孔电极，其连接到各个电极部分并沿半导体衬底的厚度形成在半导体衬底上; 多个金属互连件，连接到相应的通孔电极并形成在与半导体衬底的主表面相对的半导体衬底的背面上; 形成在所述光学元件的表面上并由树脂制成的粘合部件; 以及粘合到光学元件上的透明板，其间插入有粘合构件。透明板具有比光学元件大的平面形状。

3. 发明申请

US20090189276A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE 有权
标题翻译：半导体芯片和半导体器件
公开(公告)号：US20090189276A1
公开(公告)日：2009-07-30
申请号：US12348543
申请日：2009-01-05
申请人： Hikari SANO , Yoshihiro Tomita , Takahiro Nakano
发明人： Hikari SANO , Yoshihiro Tomita , Takahiro Nakano
IPC分类号： H01L23/34
CPC分类号： H01L27/14618 , H01L23/3677 , H01L23/481 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L2224/02351 , H01L2224/02372 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/014
摘要： A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
摘要翻译：一种半导体芯片，包括：包括前表面的基板; 形成在所述前表面上且包括多个半导体元件的集成电路; 以及形成在所述基板的与所述半导体元件中的至少一个相对应的区域中的散热塞。散热塞由具有大于在其基板的背面上具有开口的非贯通孔中形成的基板的热导率的材料制成。

4. 发明授权

US07960271B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07960271B2
公开(公告)日：2011-06-14
申请号：US12203982
申请日：2008-09-04
申请人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
发明人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
IPC分类号： H01L21/44 , H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/03912 , H01L2224/0401 , H01L2224/05012 , H01L2224/05013 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05552 , H01L2224/05554 , H01L2224/05655 , H01L2224/0603 , H01L2224/1147 , H01L2224/11474 , H01L2224/11901 , H01L2224/11902 , H01L2224/13005 , H01L2224/13006 , H01L2224/13012 , H01L2224/13023 , H01L2224/13027 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13155 , H01L2224/1403 , H01L2224/141 , H01L2224/14104 , H01L2224/81143 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/00014 , H01L2924/01047 , H01L2924/207 , H01L2224/13099 , H01L2924/00012
摘要： The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.
摘要翻译：本发明提供一种能够抑制在回流加热期间由凸块的高度变化引起的不良连接的半导体器件，可以应用于窄的阵列间距，并且可以自由地调节凸块的高度。

5. 发明申请

US20090065933A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090065933A1
公开(公告)日：2009-03-12
申请号：US12203982
申请日：2008-09-04
申请人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
发明人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/03912 , H01L2224/0401 , H01L2224/05012 , H01L2224/05013 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05552 , H01L2224/05554 , H01L2224/05655 , H01L2224/0603 , H01L2224/1147 , H01L2224/11474 , H01L2224/11901 , H01L2224/11902 , H01L2224/13005 , H01L2224/13006 , H01L2224/13012 , H01L2224/13023 , H01L2224/13027 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13155 , H01L2224/1403 , H01L2224/141 , H01L2224/14104 , H01L2224/81143 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/00014 , H01L2924/01047 , H01L2924/207 , H01L2224/13099 , H01L2924/00012
摘要： The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.
摘要翻译：本发明提供一种能够抑制在回流加热期间由凸块的高度变化引起的不良连接的半导体器件，可以应用于窄的阵列间距，并且可以自由地调节凸块的高度。

6. 发明申请

US20100148294A1 OPTICAL DEVICE AND ELECTRONIC DEVICES USING THE SAME 审中-公开
标题翻译：光学器件和使用该光学器件的电子器件
公开(公告)号：US20100148294A1
公开(公告)日：2010-06-17
申请号：US12712420
申请日：2010-02-25
申请人： Kyoko FUJII , Takahiro Nakano , Hikari Sano
发明人： Kyoko FUJII , Takahiro Nakano , Hikari Sano
IPC分类号： H01L31/0216
CPC分类号： H04N5/2253 , H01L27/14609 , H01L27/14623 , H01L27/14625 , H01L27/14627
摘要： An optical device such as an image sensor alleviates reduction in image quality caused by light reaching a peripheral circuit section other than a light receiving section. A semiconductor substrate includes an interconnect layer, a light receiving section provided with a plurality of light receiving elements on the interconnect layer, and a peripheral circuit section provided in a same layer as the light receiving section, and surrounding the light receiving section. Light entry elements are provided on a surface of the semiconductor substrate. A light shielding film is formed of a metal layer, and covers at least one part of a region corresponding to the peripheral circuit section. A first electrode is formed in the region corresponding to the peripheral circuit section, and in an opening of the light shielding film to be electrically isolated from the light shielding film.
摘要翻译：诸如图像传感器的光学装置减轻了到达光接收部分以外的外围电路部分的光的图像质量的降低。半导体衬底包括互连层，在互连层上设置有多个光接收元件的光接收部分和设置在与光接收部分相同的层中并围绕光接收部分的外围电路部分。光入射元件设置在半导体衬底的表面上。遮光膜由金属层形成，并且覆盖对应于外围电路部分的区域的至少一部分。第一电极形成在与外围电路部分对应的区域中，并且在遮光膜的开口中与遮光膜电隔离。

7. 发明授权

US10000355B2 Sheet processing device and image forming device provided with the sheet processing device 有权
公开(公告)号：US10000355B2
公开(公告)日：2018-06-19
申请号：US15138856
申请日：2016-04-26
申请人： Kazuyuki Kubota , Eiji Fukasawa , Ichitaro Kubota , Hideyuki Kubota , Hisashi Osada , Takahiro Nakano , Hiroyuki Sorita , Junya Nakajima , Takuma Kobayashi , Yuuki Kubota , Takashi Saito , Isao Kondo
发明人： Kazuyuki Kubota , Eiji Fukasawa , Ichitaro Kubota , Hideyuki Kubota , Hisashi Osada , Takahiro Nakano , Hiroyuki Sorita , Junya Nakajima , Takuma Kobayashi , Yuuki Kubota , Takashi Saito , Isao Kondo
IPC分类号： B65H37/04 , B42F3/00 , B65H5/06 , B65H5/08 , B65H31/00 , B26F1/02 , B31F5/00 , B31F5/06 , B42B4/00 , B42C1/12 , B42C19/02 , G03G15/00 , B65H35/04 , B65H37/06 , B65H45/18
CPC分类号： B65H37/04 , B26F1/02 , B31F5/00 , B31F5/06 , B42B4/00 , B42C1/12 , B42C19/02 , B42F3/003 , B65H5/06 , B65H5/08 , B65H31/00 , B65H35/04 , B65H37/06 , B65H45/18 , B65H2301/43826 , B65H2301/4505 , B65H2701/18292 , B65H2801/27 , B65H2801/48 , G03G15/00 , G03G15/6541 , G03G15/6582
摘要： A sheet processing device performs saddle stitching binding a bundle of stacked paper sheets, and includes a stacker section temporarily stacking conveyed paper sheets substantially vertically; a stopper regulating the paper sheets stacked in the stacker section; a first binding section provided in the stacker and saddle-stitching, with a metallic staple, a paper sheet bundle regulated by the stopper at a binding position around a center of the paper sheet bundle in a sheet conveying direction; a second binding section saddle-stitching, without using the metallic staple, the paper sheet bundle being regulated by the stopper at the binding position around the center of the paper sheet bundle in the sheet conveying direction; and a folding section folding in half the paper sheet bundle regulated by the stopper at a folding position at which the paper sheet bundle is bound by the first binding section or second binding section.

8. 发明申请

US20180162678A1 APPARATUS FOR PROCESSING SHEETS AND APPARATUS FOR FORMING IMAGES PROVIDED WITH THE APPARATUS 审中-公开
公开(公告)号：US20180162678A1
公开(公告)日：2018-06-14
申请号：US15830813
申请日：2017-12-04
申请人： Takahiro Nakano , Shoubu Kato
发明人： Takahiro Nakano , Shoubu Kato
IPC分类号： B65H35/00 , G03G15/00 , B65H29/12 , B65H29/14
CPC分类号： B65H35/0093 , B26D7/18 , B26D2007/0018 , B26F1/0092 , B26F1/02 , B26F1/04 , B65H9/002 , B65H29/125 , B65H29/14 , B65H29/58 , B65H31/02 , B65H31/20 , B65H31/24 , B65H31/36 , B65H31/38 , B65H33/08 , B65H35/0086 , B65H35/10 , B65H37/04 , B65H43/00 , B65H2301/4212 , B65H2301/4213 , B65H2403/41 , B65H2403/5331 , B65H2404/1422 , B65H2404/1424 , B65H2404/1521 , B65H2404/632 , B65H2405/11151 , B65H2511/224 , B65H2801/27 , G03G15/6547 , G03G2215/00894 , B65H2220/02
摘要： A sheet processing apparatus is provided with a carry-in path for guiding a sheet from a carry-in entrance, a shift roller provided in the carry-in path to transport the sheet, while shifting, a carry-in roller positioned on the downstream side of the shift roller to carry the sheet from the carry-in path toward a collection tray, and a punch shift unit provided on the upstream side of the carry-in roller to process an end portion of the sheet in a processing position. The punch shift unit shifts in the same direction as the shift roller, a shift amount of the punch shift unit is set to be equal to a shift amount of the shift roller or more, and the end portion processing unit is thereby already positioned in an end portion processing position or a position near the processing position after shifting the sheet.

9. 发明授权

US09352604B2 Sheet processing device and image forming device provided with the sheet processing device 有权
标题翻译：具有片材处理装置的片材处理装置和图像形成装置
公开(公告)号：US09352604B2
公开(公告)日：2016-05-31
申请号：US14491493
申请日：2014-09-19
申请人： Kazuyuki Kubota , Eiji Fukasawa , Ichitaro Kubota , Hideyuki Kubota , Hisashi Osada , Takahiro Nakano , Hiroyuki Sorita , Junya Nakajima , Takuma Kobayashi , Yuuki Kubota , Takashi Saito , Isao Kondo
发明人： Kazuyuki Kubota , Eiji Fukasawa , Ichitaro Kubota , Hideyuki Kubota , Hisashi Osada , Takahiro Nakano , Hiroyuki Sorita , Junya Nakajima , Takuma Kobayashi , Yuuki Kubota , Takashi Saito , Isao Kondo
IPC分类号： B42C1/12 , B42F3/00 , B65H5/06 , B65H5/08 , B65H37/04 , B65H31/00 , B26F1/02 , B31F5/00 , B31F5/06 , B42C19/02 , G03G15/00 , B42B4/00
CPC分类号： B65H37/04 , B26F1/02 , B31F5/00 , B31F5/06 , B42B4/00 , B42C1/12 , B42C19/02 , B42F3/003 , B65H5/06 , B65H5/08 , B65H31/00 , B65H35/04 , B65H37/06 , B65H45/18 , B65H2301/43826 , B65H2301/4505 , B65H2701/18292 , B65H2801/27 , B65H2801/48 , G03G15/00 , G03G15/6541 , G03G15/6582
摘要： To provide a sheet processing device that performs saddle stitching processing that binds a bundle of stacked paper sheets at a position around a center thereof and then folds in half the paper sheet bundle at the binding portion, the device being capable of selectively performing both saddle stitching using a metallic staple and saddle stitching not using the metallic staple for environmental protection and capable of reducing a size.A sheet processing device includes a stacker section that temporarily stacks conveyed paper sheets in a substantially vertical attitude, a stopper that regulates the paper sheets stacked in the stacker section, a first binding section that is provided in the stacker and saddle-stitches, with a metallic staple, a paper sheet bundle at a binding position around a center of the paper sheet bundle in a sheet conveying direction, a second binding section that saddle-stitches, without using the metallic staple, the paper sheet bundle at the binding position around the center of the paper sheet bundle in the sheet conveying direction, and a folding section that folds in half the paper sheet bundle. An interval between the second binding section and folding section is set smaller than an interval between the first binding section and folding section.
摘要翻译：为了提供一种纸张处理装置，该纸张处理装置执行在围绕其中心的位置处捆绑堆叠纸张的马鞍形拼接处理，然后在装订部分折叠纸张束的一半，该装置能够选择性地执行马鞍缝合使用不使用金属订书钉进行环保的金属订书钉和马鞍缝合，并能够减小尺寸。片材处理装置包括：堆放器部分，其以大致垂直的姿态临时堆叠被输送的纸张;调节堆叠在堆垛部分中的纸张的止动件;设置在堆垛机和鞍形针迹中的第一捆扎部分，金属订书钉，在纸张传送方向上在纸张束的中心附近的装订位置处的纸张束，在不使用金属订书钉的情况下鞍形订书钉的第二装订部分，纸张束在纸张输送方向上的中心，以及折叠部分折叠在纸张束的一半中。第二装订部分和折叠部分之间的间隔被设定为小于第一装订部分和折叠部分之间的间隔。

10. 发明授权

US09235354B2 Storage network system and its control method 有权
标题翻译：存储网络系统及其控制方法
公开(公告)号：US09235354B2
公开(公告)日：2016-01-12
申请号：US12739862
申请日：2010-04-13
申请人： Hiroshi Ogasawara , Takahiro Nakano , Hitoshi Kamei
发明人： Hiroshi Ogasawara , Takahiro Nakano , Hitoshi Kamei
IPC分类号： G06F3/06 , G06F11/14
CPC分类号： G06F3/0649 , G06F3/0608 , G06F3/061 , G06F3/0685 , G06F11/1446
摘要： A storage network system that prevents waste of a core's resources and is thereby operated efficiently, and a method for controlling such a storage network system are provided.Policy differences between a core and a plurality of edges are buffered by enabling hierarchical control of data storage on the side of the plurality of edges in cooperation with hierarchical control of data storage on the core side, and the buffered policy is applied to the hierarchical control of the data storage on the core side.
摘要翻译：一种防止核心资源浪费并由此高效运行的存储网络系统，并且提供了一种用于控制这种存储网络系统的方法。核心与多个边缘之间的策略差异通过与核心侧的数据存储的分级控制协作来实现与多个边缘一侧的数据存储的分级控制来缓冲，并且将缓冲的策略应用于分层控制的核心方面的数据存储。

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