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1. 发明申请

US20090189276A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE 有权
标题翻译：半导体芯片和半导体器件
公开(公告)号：US20090189276A1
公开(公告)日：2009-07-30
申请号：US12348543
申请日：2009-01-05
申请人： Hikari SANO , Yoshihiro Tomita , Takahiro Nakano
发明人： Hikari SANO , Yoshihiro Tomita , Takahiro Nakano
IPC分类号： H01L23/34
CPC分类号： H01L27/14618 , H01L23/3677 , H01L23/481 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L2224/02351 , H01L2224/02372 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/014
摘要： A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
摘要翻译：一种半导体芯片，包括：包括前表面的基板; 形成在所述前表面上且包括多个半导体元件的集成电路; 以及形成在所述基板的与所述半导体元件中的至少一个相对应的区域中的散热塞。散热塞由具有大于在其基板的背面上具有开口的非贯通孔中形成的基板的热导率的材料制成。

2. 发明授权

US08134231B2 Semiconductor chip and semiconductor device 有权
标题翻译：半导体芯片和半导体器件
公开(公告)号：US08134231B2
公开(公告)日：2012-03-13
申请号：US12348543
申请日：2009-01-05
申请人： Hikari Sano , Yoshihiro Tomita , Takahiro Nakano
发明人： Hikari Sano , Yoshihiro Tomita , Takahiro Nakano
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L27/14618 , H01L23/3677 , H01L23/481 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L2224/02351 , H01L2224/02372 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/014
摘要： A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
摘要翻译：一种半导体芯片，包括：包括前表面的基板; 形成在所述前表面上且包括多个半导体元件的集成电路; 以及形成在所述基板的与所述半导体元件中的至少一个相对应的区域中的散热塞。散热塞由具有大于在其基板的背面上具有开口的非穿透孔中形成的基板的热导率的材料制成。

3. 发明申请

US20090059055A1 OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20090059055A1
公开(公告)日：2009-03-05
申请号：US12195081
申请日：2008-08-20
申请人： Takahiro Nakano , Yoshihiro Tomita , Hikari Sano
发明人： Takahiro Nakano , Yoshihiro Tomita , Hikari Sano
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14627 , H01L27/14687 , H01L2224/02372 , H01L2224/05001 , H01L2224/05009 , H01L2224/05022 , H01L2224/05548 , H01L2224/0557 , H01L2224/11 , H01L2924/00014 , H04N5/2254 , H01L2224/05099
摘要： An optical device includes: an optical element including an imaging region, a peripheral circuit region formed at the rim of the imaging region and including a plurality of electrode portions, and a plurality of microlenses formed on the imaging region; a plurality of through-hole electrodes connected to the respective electrode portions and formed through the semiconductor substrate along the thickness of the semiconductor substrate; a plurality of metal interconnects connected to the respective through-hole electrodes and formed on a back surface of the semiconductor substrate opposite to a principal surface of the semiconductor substrate; an adhesive member formed on a surface of the optical element and made of a resin; and a transparent board bonded to the optical element with the adhesive member interposed therebetween. The transparent board has a planar shape larger than that of the optical element.
摘要翻译：光学装置包括：光学元件，包括成像区域，形成在成像区域的边缘处并包括多个电极部分的外围电路区域和形成在成像区域上的多个微透镜; 多个通孔电极，其连接到各个电极部分并沿半导体衬底的厚度形成在半导体衬底上; 多个金属互连件，连接到相应的通孔电极并形成在与半导体衬底的主表面相对的半导体衬底的背面上; 形成在所述光学元件的表面上并由树脂制成的粘合部件; 以及粘合到光学元件上的透明板，其间插入有粘合构件。透明板具有比光学元件大的平面形状。

4. 发明授权

US07960271B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07960271B2
公开(公告)日：2011-06-14
申请号：US12203982
申请日：2008-09-04
申请人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
发明人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
IPC分类号： H01L21/44 , H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/03912 , H01L2224/0401 , H01L2224/05012 , H01L2224/05013 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05552 , H01L2224/05554 , H01L2224/05655 , H01L2224/0603 , H01L2224/1147 , H01L2224/11474 , H01L2224/11901 , H01L2224/11902 , H01L2224/13005 , H01L2224/13006 , H01L2224/13012 , H01L2224/13023 , H01L2224/13027 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13155 , H01L2224/1403 , H01L2224/141 , H01L2224/14104 , H01L2224/81143 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/00014 , H01L2924/01047 , H01L2924/207 , H01L2224/13099 , H01L2924/00012
摘要： The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.
摘要翻译：本发明提供一种能够抑制在回流加热期间由凸块的高度变化引起的不良连接的半导体器件，可以应用于窄的阵列间距，并且可以自由地调节凸块的高度。

5. 发明申请

US20090211793A1 SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE 审中-公开
标题翻译：基板模块，制造基板模块的方法和电子装置
公开(公告)号：US20090211793A1
公开(公告)日：2009-08-27
申请号：US12330923
申请日：2008-12-09
申请人： Takahiro NAKANO , Masanori Minamio , Yoshihiro Tomita , Hikari Sano
发明人： Takahiro NAKANO , Masanori Minamio , Yoshihiro Tomita , Hikari Sano
IPC分类号： H05K1/18 , H05K3/02
CPC分类号： H01L27/14636 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/13 , H01L27/14618 , H01L2224/0231 , H01L2224/0233 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12043 , H01L2924/351 , H05K1/115 , H05K3/388 , H05K2201/09509 , Y10T29/49155 , H01L2924/00
摘要： In a substrate module of the present invention, a connection electrode is provided on a first surface of a substrate, and a first penetrating hole portion is running through the substrate in a thickness direction thereof so as to reach a reverse surface of the connection electrode, with a penetrating electrode being provided inside the first penetrating hole portion. The penetrating electrode defines a depression in a position opposing the reverse surface of the connection electrode, and an upper portion of the penetrating electrode is thicker than a side portion of the penetrating electrode. The penetrating electrode is present also on a second surface of the substrate, and is connected to a wiring electrode on the second surface.
摘要翻译：在本发明的基板模块中，在基板的第一面上设置有连接电极，第一贯通孔部在其厚度方向上贯穿基板，从而到达连接电极的背面，其中穿透电极设置在第一穿透孔部分的内部。穿透电极在与连接电极的反面相对的位置形成凹部，并且穿透电极的上部比穿透电极的侧部更厚。穿透电极也存在于基板的第二表面上，并且连接到第二表面上的布线电极。

6. 发明申请

US20090065933A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090065933A1
公开(公告)日：2009-03-12
申请号：US12203982
申请日：2008-09-04
申请人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
发明人： Hideki Takehara , Yoshihiro Tomita , Seiji Fujiwara , Takahiro Nakano , Hikari Sano
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/03912 , H01L2224/0401 , H01L2224/05012 , H01L2224/05013 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05552 , H01L2224/05554 , H01L2224/05655 , H01L2224/0603 , H01L2224/1147 , H01L2224/11474 , H01L2224/11901 , H01L2224/11902 , H01L2224/13005 , H01L2224/13006 , H01L2224/13012 , H01L2224/13023 , H01L2224/13027 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13155 , H01L2224/1403 , H01L2224/141 , H01L2224/14104 , H01L2224/81143 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/00014 , H01L2924/01047 , H01L2924/207 , H01L2224/13099 , H01L2924/00012
摘要： The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.
摘要翻译：本发明提供一种能够抑制在回流加热期间由凸块的高度变化引起的不良连接的半导体器件，可以应用于窄的阵列间距，并且可以自由地调节凸块的高度。

7. 发明申请

US20110147905A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110147905A1
公开(公告)日：2011-06-23
申请号：US13039937
申请日：2011-03-03
申请人： Masaki Utsumi , Hikari Sano , Hiroaki Fujimoto , Yoshihiro Tomita
发明人： Masaki Utsumi , Hikari Sano , Hiroaki Fujimoto , Yoshihiro Tomita
IPC分类号： H01L23/06 , H01L21/78
CPC分类号： H01L33/62 , H01L21/76898 , H01L23/481 , H01L27/14618 , H01L2224/0554 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/13025 , H01L2224/16225 , H01L2924/00014 , H01L2924/01055 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In a semiconductor element, upper through-hole conductor portions and lower through-hole conductor portions are formed such that pore size A of the joint surface of the upper through-hole conductor portion and the lower through-hole conductor portion is smaller than pore size B of the upper through-hole conductor portion on the major surface of the semiconductor element and pore size C of the lower through-hole conductor portion on the other surface of the semiconductor element. Further, electrode portions are formed respectively on the top surfaces of the upper through-hole conductor portions and protrusions 4 are formed respectively on the top surfaces of the electrode portions. Moreover, an optical member pressed in contact with the protrusions is fixed on the semiconductor element with an adhesive.
摘要翻译：在半导体元件中，形成上通孔导体部和下通孔导体部，使得上通孔导体部和下通孔导体部的接合面的孔径A小于孔径 B，半导体元件的主表面上的上通孔导体部分的孔径C和半导体元件另一表面上的下通孔导体部分的孔径C. 此外，电极部分分别形成在上通孔导体部分的顶表面上，突起4分别形成在电极部分的顶表面上。此外，用粘合剂固定在半导体元件上与突起接触的光学部件。

8. 发明申请

US20100176475A1 OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20100176475A1
公开(公告)日：2010-07-15
申请号：US12649524
申请日：2009-12-30
申请人： Hikari Sano , Yoshihiro Tomita
发明人： Hikari Sano , Yoshihiro Tomita
IPC分类号： H01L31/0232 , H01L31/0216 , H01L31/18
CPC分类号： H01L27/14625 , H01L27/14603 , H01L27/14621 , H01L27/1464 , H01L27/14683 , H01L27/14685
摘要： An optical device according to an aspect of the present invention includes: a semiconductor substrate layer including a plurality of elements; at least one optical component which is formed at the first principal surface side of the semiconductor substrate layer and transmits incident light of desired wavelength; and an interconnect layer formed on second principal surface of the semiconductor substrate layer. In the semiconductor substrate layer, (i) a photoelectric conversion element region is formed at a position corresponding to the at least one optical component, and (ii) at least one element among the plurality of elements is formed near the second principal surface. At least a part of the at least one optical component is formed as a part of the semiconductor substrate layer, and the interconnect layer includes the conductive material electrically connected to the photoelectric conversion element region and the at least one element.
摘要翻译：根据本发明的一个方面的光学器件包括：包括多个元件的半导体衬底层; 至少一个光学部件，形成在所述半导体衬底层的第一主表面侧并透射所需波长的入射光; 以及形成在所述半导体衬底层的第二主表面上的互连层。在半导体衬底层中，（i）在与至少一个光学部件相对应的位置形成光电转换元件区域，（ii）在第二主表面附近形成多个元件中的至少一个元件。所述至少一个光学部件的至少一部分形成为所述半导体衬底层的一部分，并且所述互连层包括与所述光电转换元件区域和所述至少一个元件电连接的所述导电材料。

9. 发明申请

US20190099776A1 COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME 审中-公开
公开(公告)号：US20190099776A1
公开(公告)日：2019-04-04
申请号：US15720497
申请日：2017-09-29
申请人： Ken P. Hackenberg , Nachiket R. Raravikar , James C. Matayabas, JR. , Elizabeth Nofen , Nisha Ananthakrishnan , Manabu Nakagawasai , Yoshihiro Tomita
发明人： Ken P. Hackenberg , Nachiket R. Raravikar , James C. Matayabas, JR. , Elizabeth Nofen , Nisha Ananthakrishnan , Manabu Nakagawasai , Yoshihiro Tomita
IPC分类号： B05C5/02 , F16K21/18 , B05B1/02 , B05B1/30
摘要： A fluid applicator configured to apply a fluid to at least one substrate feature. The includes compressible reticulated media including an input interface configured for coupling with a fluid reservoir, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the applicator profile. The compressible reticulated media includes filling and dispensing configurations. In the dispensing configuration the substrate interface is configured for engagement with the at least one substrate feature, the compressible reticulated media is compressed, and according to the compression the fluid is applied across the feature profile. In the filling configuration the compressible reticulated media is configured for expansion relative to the dispensing configuration, and the fluid infiltrates the reticulations according to the expansion.

10. 发明申请

US20150270169A1 METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTRONIC PACKAGE 有权
标题翻译：将第一电子包连接到第二电子包的方法
公开(公告)号：US20150270169A1
公开(公告)日：2015-09-24
申请号：US14219749
申请日：2014-03-19
申请人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
发明人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
IPC分类号： H01L21/768 , H01L21/56 , H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L25/50 , H01L21/4853 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L24/03 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/16227 , H01L2224/48227 , H01L2224/81801 , H01L2225/06517 , H01L2225/06548 , H01L2225/06555 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/01029 , H01L2924/06 , H01L2924/15311 , H01L2924/15321 , H01L2924/1815 , H01L2924/381
摘要： A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
摘要翻译：一种制造电子封装的方法。该方法包括用电导体填充模具以在模具内形成多个电互连。模具包括填充有多个电导体以形成多个电互连的开口。制造电子封装的方法还包括将模具附接到基板，使得电互连件接合基板上的电触点。制造电子封装的方法还可以包括在电绝缘体上形成接合电互连并将管芯连接到衬底上的导电焊盘，使得管芯电连接到至少一些电互连。

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