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    • 4. 发明授权
    • Plasma chemical vapor deposition apparatus
    • 等离子体化学气相沉积装置
    • US06363881B2
    • 2002-04-02
    • US09232600
    • 1999-01-19
    • Masayoshi MurataYoshiaki TakeuchiHiroshi MashimaAkemi TakanoHirohisa Yoshida
    • Masayoshi MurataYoshiaki TakeuchiHiroshi MashimaAkemi TakanoHirohisa Yoshida
    • C23C16509
    • H01J37/32082H01J37/32541
    • Disclosed is a plasma chemical vapor deposition apparatus for forming an amorphous thin film, a microcrystalline thin film or a polycrystalline thin film on a surface of a target substrate by utilizing a glow discharge generated by an electric power supplied from a power source, comprising a reaction vessel, means for supplying a reactant gas into the reaction vessel, discharge means for discharge a waste gas of the reactant gas out of the reaction vessel, a ladder-shaped electrode for discharge generation arranged within the reaction vessel, a power source for supplying a high frequency power of 30 MHz to 200 MHz to the ladder-shaped electrode for a glow discharge generation, a heater for heating and supporting a target substrate, the heater being arranged within the reaction vessel in parallel to the ladder-shaped electrode for discharge generation, and a power distributor for uniformly distributing a high frequency power to the ladder-shaped electrode for discharge generation through a power supply wire.
    • 公开了一种等离子体化学气相沉积设备,用于通过利用由电源供应的电力产生的辉光放电来在目标衬底的表面上形成非晶薄膜,微晶薄膜或多晶薄膜,其包括反应 容器,用于将反应气体供给到反应容器中的装置,用于将反应气体的废气排出反应容器的排出装置,设置在反应容器内的用于排放产生的梯形电极, 用于辉光放电产生的梯形电极的高频功率为30MHz至200MHz,用于加热和支撑目标衬底的加热器,加热器与反应容器内平行于梯形电极放电产生 以及用于均匀地将高频电力分配到梯形电极用于放电发生的功率分配器 h电源线。
    • 5. 发明授权
    • High frequency plasma generator and high frequency plasma generating method
    • 高频等离子体发生器和高频等离子体发生方法
    • US07141516B2
    • 2006-11-28
    • US10519553
    • 2003-10-01
    • Keisuke KawamuraAkira YamadaHiroshi MashimaYoshiaki Takeuchi
    • Keisuke KawamuraAkira YamadaHiroshi MashimaYoshiaki Takeuchi
    • C23C16/00
    • H01J37/32155H01J37/32091
    • An object is to provide a high-frequency plasma generating apparatus and process which can further advance uniformity of the thickness of a film on a substrate with a large area in comparison with conventional apparatuses. In a reaction chamber (1), a ground electrode (3) is disposed, and a discharge electrode (2) is disposed opposite to the ground electrode (3). A substrate (4) as a processing object is placed in close contact with the ground electrode (3). A high-frequency voltage is applied to the discharge electrode (2) so as to generate plasma between the ground electrode and the discharge electrode. An RF electric power supply (15) generates a first high-frequency voltage, and outputs the generated voltage on feeding points (9) disposed on a lateral portion of the discharge electrode (2). An RF electric power supply (16) generates a second high-frequency voltage, and outputs the generated voltage on feeding points (9) disposed on another lateral portion of the discharge electrode (2). Here, the second high-frequency voltage has the same frequency as that of the first high-frequency voltage and has a phase which varies with a low-frequency signal, which is modulated by a predetermined modulation signal.
    • 本发明的目的是提供一种高频等离子体发生装置和方法,与现有的装置相比,能够进一步提高基板上膜厚度的均匀性。 在反应室(1)中设置接地电极(3),放电电极(2)与接地电极(3)相对设置。 作为处理对象的基板(4)与接地电极(3)紧密接触。 向放电电极(2)施加高频电压,以在接地电极和放电电极之间产生等离子体。 RF电源(15)产生第一高频电压,并且在放电电极(2)的侧面部分上的馈电点(9)上输出产生的电压。 RF电源(16)产生第二高频电压,并且在放电电极(2)的另一侧面部分上的馈电点(9)上输出产生的电压。 这里,第二高频电压具有与第一高频电压相同的频率,并且具有随着由预定调制信号调制的低频信号而变化的相位。
    • 7. 发明授权
    • Process for producing photovoltaic device
    • 光电器件生产工艺
    • US08088641B2
    • 2012-01-03
    • US12993252
    • 2008-10-30
    • Hiroshi MashimaKoichi AsakusaAkemi TakanoNobuki YamashitaYoshiaki Takeuchi
    • Hiroshi MashimaKoichi AsakusaAkemi TakanoNobuki YamashitaYoshiaki Takeuchi
    • H01L21/00H01L21/20H01L21/36C23C8/00
    • H01L31/075H01L31/03762H01L31/0463H01L31/202Y02E10/548Y02P70/521
    • A process for producing a photovoltaic device, wherein when providing an n-type amorphous silicon layer on an i-type amorphous silicon layer, a desired crystallization ratio can be achieved without reducing the deposition rate. The production process comprises a p-layer formation step of depositing a p-type amorphous silicon layer, an i-layer formation step of depositing an i-type amorphous silicon layer on the p-type amorphous silicon layer, and an n-layer formation step of depositing an n-type amorphous silicon layer on the i-type amorphous silicon layer, wherein the n-layer formation step comprises a first n-layer formation step of depositing a first n-layer on the i-type amorphous silicon layer, and a second n-layer formation step of depositing a second n-layer on the first n-layer, and the deposition conditions for the first n-layer formation step are conditions that yield a higher crystallization ratio than the deposition conditions for the second n-layer formation step, for deposition onto the same base material substrate.
    • 一种制造光电器件的方法,其中当在i型非晶硅层上提供n型非晶硅层时,可以在不降低沉积速率的情况下实现期望的结晶比。 该制造方法包括沉积p型非晶硅层的p层形成步骤,在p型非晶硅层上沉积i型非晶硅层的i层形成步骤和n层形成 在i型非晶硅层上沉积n型非晶硅层的步骤,其中n层形成步骤包括在i型非晶硅层上沉积第一n层的第一n层形成步骤, 以及在第一n层上沉积第二n层的第二n层形成步骤,并且用于第一n层形成步骤的沉积条件是产生比第二n层的沉积条件更高的结晶比的条件 层形成步骤,用于沉积到相同的基底材料基底上。
    • 9. 发明申请
    • PROCESS FOR PRODUCING PHOTOVOLTAIC DEVICE
    • 生产光伏器件的方法
    • US20110092012A1
    • 2011-04-21
    • US12993252
    • 2008-10-30
    • Hiroshi MashimaKoichi AsakusaAkemi TakanoNobuki YamashitaYoshiaki Takeuchi
    • Hiroshi MashimaKoichi AsakusaAkemi TakanoNobuki YamashitaYoshiaki Takeuchi
    • H01L31/18
    • H01L31/075H01L31/03762H01L31/0463H01L31/202Y02E10/548Y02P70/521
    • A process for producing a photovoltaic device, wherein when providing an n-type amorphous silicon layer on an i-type amorphous silicon layer, a desired crystallization ratio can be achieved without reducing the deposition rate. The production process comprises a p-layer formation step of depositing a p-type amorphous silicon layer, an i-layer formation step of depositing an i-type amorphous silicon layer on the p-type amorphous silicon layer, and an n-layer formation step of depositing an n-type amorphous silicon layer on the i-type amorphous silicon layer, wherein the n-layer formation step comprises a first n-layer formation step of depositing a first n-layer on the i-type amorphous silicon layer, and a second n-layer formation step of depositing a second n-layer on the first n-layer, and the deposition conditions for the first n-layer formation step are conditions that yield a higher crystallization ratio than the deposition conditions for the second n-layer formation step, for deposition onto the same base material substrate.
    • 一种制造光电器件的方法,其中当在i型非晶硅层上提供n型非晶硅层时,可以在不降低沉积速率的情况下实现期望的结晶比。 制造方法包括沉积p型非晶硅层的p层形成步骤,在p型非晶硅层上沉积i型非晶硅层的i层形成步骤和n层形成 在i型非晶硅层上沉积n型非晶硅层的步骤,其中所述n层形成步骤包括在i型非晶硅层上沉积第一n层的第一n层形成步骤, 以及在第一n层上沉积第二n层的第二n层形成步骤,并且用于第一n层形成步骤的沉积条件是产生比第二n层的沉积条件更高的结晶比的条件 层形成步骤,用于沉积到相同的基底材料基底上。