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1. 发明授权

US5302798A Method of forming a hole with a laser and an apparatus for forming a hole with a laser 失效
标题翻译：用激光形成孔的方法和用激光形成孔的装置
公开(公告)号：US5302798A
公开(公告)日：1994-04-12
申请号：US860687
申请日：1992-03-30
申请人： Hideo Inagawa , Shigenobu Nojo , Tohru Ohsaka
发明人： Hideo Inagawa , Shigenobu Nojo , Tohru Ohsaka
IPC分类号： B23K26/067 , B23K26/38 , H05K3/00 , B23K26/00
CPC分类号： B23K26/0676 , B23K26/067 , B23K26/382 , B23K26/40 , B23K26/402 , B23K2203/42 , B23K2203/50 , H05K3/0017
摘要： A hole forming method with a laser beam and a hole forming laser apparatus improves the efficiency of hole formation without deterioration in the quality of the formed hole. In a hole forming method for forming holes in a plurality of articles by irradiation with a condensed laser beam, the laser beam is switched in succession to plural working optical axes, thereby forming holes in succession in the articles positioned respectively on the working optical axes.
摘要翻译：具有激光束和孔形成激光装置的孔形成方法提高了孔形成的效率，而不会使形成的孔的质量劣化。在通过照射聚光激光而在多个制品中形成孔的孔形成方法中，激光束被连续地切换成多个工作光轴，从而在分别位于工作光轴上的制品中连续地形成孔。

2. 发明授权

US5215593A Method of introducing liquid into small-diameter hole 失效
标题翻译：将液体引入小口径孔的方法
公开(公告)号：US5215593A
公开(公告)日：1993-06-01
申请号：US691421
申请日：1991-04-25
申请人： Shigenobu Nojo , Hideho Inagawa , Tohru Ohsaka
发明人： Shigenobu Nojo , Hideho Inagawa , Tohru Ohsaka
IPC分类号： B08B3/10 , C23C18/18 , C25D5/34 , C25D21/10 , H05K3/00 , H05K3/26 , H05K3/42
CPC分类号： H05K3/0088 , B08B3/106
摘要： A substrate having a small-diameter hole is taken from the air and placed in a boiling vapor and/or boiling liquid in a first treatment tank of a vessel having a boiling heater, whereupon the pressure of the air in the small-diameter hole exceeds atmospheric pressure by an amount equivalent to the partial pressure of the air in the hole. Accordingly, the air cannot remain in the hole but is instead expelled to the outside. As a result, the interior of the microhole is replaced entirely by the boiling vapor and/or boiling liquid. Next, without being brought into contact with the external air, the substrate is contacted with a non-boiling liquid inside a second treatment tank, thereby preventing external gas from flowing back into the small-diameter. The non-boiling liquid and the boiling vapor and/or boiling liquid are soluble in each other. As a result, the two are unified and introduced to the small-diameter hole in the form of a liquid.
摘要翻译：将具有小直径孔的基板从空气中取出并置于具有沸腾加热器的容器的第一处理槽中的沸腾蒸气和/或沸腾液中，于是小直径孔中的空气压力超过大气压力相当于孔中空气的分压的量。因此，空气不能保留在孔中，而是排出到外部。结果，微孔的内部完全被沸腾的蒸气和/或沸腾的液体所取代。接下来，不与外部空气接触，基板与第二处理槽内的非沸腾液体接触，从而防止外部气体流回小直径。非沸腾液体和沸腾蒸气和/或沸腾液体彼此可溶。结果，两者被统一并以液体形式引入小直径孔。

3. 发明授权

US5073687A Method and apparatus for working print board by laser 失效
标题翻译：用激光打印板工作的方法和装置
公开(公告)号：US5073687A
公开(公告)日：1991-12-17
申请号：US541374
申请日：1990-06-21
申请人： Hideho Inagawa , Shigenobu Nojo
发明人： Hideho Inagawa , Shigenobu Nojo
IPC分类号： B23K26/38 , B23K26/40 , H05K3/00 , H05K3/42
CPC分类号： H05K3/0038 , B23K26/382 , B23K26/40 , B23K2201/35 , B23K2203/16 , H05K2203/108 , H05K3/427
摘要： A laser output is converted into a pulse output and the pulse output is made variable in accordance with each portion of a copper foil portion and a resin portion of the surface of a print board and a copper foil portion of the back surface.
摘要翻译：将激光输出转换为脉冲输出，根据印刷基板的表面的铜箔部分和树脂部分以及背面的铜箔部分的各部分，使脉冲输出变化。

4. 发明授权

US5063280A Method and apparatus for forming holes into printed circuit board 失效
标题翻译：用于在印刷电路板中形成孔的方法和装置
公开(公告)号：US5063280A
公开(公告)日：1991-11-05
申请号：US553666
申请日：1990-07-18
申请人： Hideho Inagawa , Shigenobu Nojo
发明人： Hideho Inagawa , Shigenobu Nojo
IPC分类号： B23K26/03 , B23K26/38 , H05K1/02 , H05K3/00 , H05K3/42
CPC分类号： B23K26/032 , B23K26/0622 , B23K26/0853 , B23K26/382 , B23K26/40 , H05K3/0038 , B23K2201/34 , B23K2201/42 , B23K2203/12 , B23K2203/172 , B23K2203/42 , H05K1/0269 , H05K2203/0207 , H05K2203/163 , H05K3/427
摘要： A method of forming holes into a printed circuit board whereby when a hole is formed into the printed circuit board by using an energy beam such as a laser beam or the like, a focal point position of the beam is moved with the progressing of the hole forming process. To move the focal point position of the beam with the progressing of the hole forming process when a hole is formed into the printed circuit board by using an energy beam such as a laser beam or the like, a mechanism to move a converging optical system in the direction of the optical axis is provided. Also provided is a method of checking a penetrating state of a through hole in the case where a through hole is worked into a circuit pattern portion of a printed circuit board by using an energy beam such as a laser beam and where the beam is irradiated from the surface of the printed circuit board and the material constructing the printed circuit board is fused and discharged and penetrated to the back surface, thereby forming a through hole.
摘要翻译：一种在印刷电路板中形成孔的方法，由此当通过使用诸如激光束等的能量束将印刷电路板形成孔时，梁的焦点位置随着孔的进行而移动成型工艺。当通过使用诸如激光束等的能量束将孔形成到印刷电路板中时，随着孔形成处理的进行而移动光束的焦点位置，使得会聚光学系统在提供光轴的方向。还提供了一种在通过使用诸如激光束的能量束并且其中照射光束的通孔加工到印刷电路板的电路图案部分的情况下检查通孔的穿透状态的方法印刷电路板的表面和构成印刷电路板的材料熔融并排出并渗透到背面，从而形成通孔。

5. 发明授权

US5166493A Apparatus and method of boring using laser 失效
标题翻译：使用激光钻孔的装置和方法
公开(公告)号：US5166493A
公开(公告)日：1992-11-24
申请号：US717016
申请日：1991-06-18
申请人： Hideho Inagawa , Shigenobu Nojo
发明人： Hideho Inagawa , Shigenobu Nojo
IPC分类号： B23K26/06 , B23K26/38 , H05K3/00 , H05K3/42
CPC分类号： B23K26/0613 , B23K26/0604 , B23K26/382 , B23K26/40 , B23K26/402 , H05K3/0038 , B23K2201/35 , B23K2203/12 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H05K2203/107 , H05K2203/108 , H05K3/427
摘要： A two-step boring process is disclosed. A first step of the process is high speed rough boring by thermal processing using a long wavelength laser, and a second step is an optical chemical processing using a short wavelength laser for smoothing the bore wall. A highly reliable through hole can be high speed processed in a short period of time. The bore thus formed has excellent bore wall shape while it has a very small diameter.
摘要翻译：公开了两步钻孔工艺。该方法的第一步是通过使用长波长激光的热处理的高速粗糙钻孔，第二步是使用短波长激光器进行平滑孔壁的光学化学处理。高可靠性的通孔可以在短时间内进行高速处理。由此形成的孔具有优异的孔壁形状，而其具有非常小的直径。

6. 发明授权

US5126532A Apparatus and method of boring using laser 失效
公开(公告)号：US5126532A
公开(公告)日：1992-06-30
申请号：US459473
申请日：1990-01-02
申请人： Hideho Inagawa , Shigenobu Nojo
发明人： Hideho Inagawa , Shigenobu Nojo
IPC分类号： B23K26/06 , B23K26/38 , H05K3/00 , H05K3/42
CPC分类号： B23K26/0613 , B23K26/032 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/382 , B23K26/40 , B23K26/402 , H05K3/0038 , B23K2201/34 , B23K2201/42 , B23K2203/12 , B23K2203/172 , B23K2203/42 , H05K2203/108 , H05K3/427
摘要： A two-step boring process is disclosed. A first step of the process is high speed rough boring by thermal processing using a long wavelength laser, and a second step is an optical chemical processing using a short wavelength laser for smoothing the bore wall. A highly reliable through hole can be high speed processed in a short period of time. The bore thus formed has excellent bore wall shape while it has a very small diameter.

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