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1. 发明授权

US5939010A Laser machining method 失效
标题翻译：激光加工方法
公开(公告)号：US5939010A
公开(公告)日：1999-08-17
申请号：US996817
申请日：1997-12-23
申请人： Takayuki Yuyama , Masaru Kanaoka
发明人： Takayuki Yuyama , Masaru Kanaoka
IPC分类号： B23K26/00 , B23K26/06 , B23K26/38 , H05K3/00
CPC分类号： B23K26/0622 , B23K26/382 , B23K26/386 , B23K26/40 , B23K26/402 , H05K3/0026 , B23K2203/16 , B23K2203/42 , B23K2203/50
摘要： In the present invention, a laser beam with a prespecified oscillation frequency is divided into the arbitrary number of pulses to be irradiated to all holes in an area, and this step is repeated until the irradiation reaches a desired number of pulses, whereby an interactive time can be decided according to the number of divided pulses and a cooling period of time can be obtained, and also the number of pulses per one division is set to be a plurality of pulses, which allows an etching rate to be increased, so that the number of pulses required for machining can be reduced as compared to a case where a laser is irradiated to all the holes pulse by pulse.
摘要翻译：在本发明中，具有预定振荡频率的激光束被划分为要照射到区域中的所有孔的任意数量的脉冲，并且重复该步骤直到照射达到期望数量的脉冲，由此交互时间可以根据分割脉冲的数量决定并且可以获得冷却时间，并且每个分割的脉冲数也被设置为多个脉冲，这允许蚀刻速率增加，使得与通过脉冲脉冲对激光照射到所有空穴的情况相比，可以减少加工所需的脉冲数。

2. 发明授权

US5820953A Thermoformed package with integrated predetermined breaking points, and a process for the production thereof 失效
标题翻译：具有集成预定断裂点的热成型包装及其生产方法
公开(公告)号：US5820953A
公开(公告)日：1998-10-13
申请号：US151781
申请日：1993-11-15
申请人： Ekkehard Beer , Tobias Rentzsch , Alfred Schad
发明人： Ekkehard Beer , Tobias Rentzsch , Alfred Schad
IPC分类号： B65B69/00 , B23K26/40 , B23K26/402 , B29C35/08 , B29C37/00 , B29C59/00 , B29C71/04 , B65D1/30 , B65D65/28 , B65D75/62 , B32B1/02
CPC分类号： B65D1/30 , B23K26/40 , B23K26/402 , B29C59/007 , B29C71/04 , B23K2203/16 , B23K2203/42 , B29C2035/0838 , B29C2791/009 , B29C37/0057 , B29L2031/712 , Y10T428/1352 , Y10T428/15 , Y10T428/24661
摘要： A thermoformed plastic package with integrated predetermined breaking points formed by discrete regions in the plastic matrix at which points the mechanical properties of the plastic have been modified by action of a laser beam.
摘要翻译：一种具有集成的预定断裂点的热成型塑料包装，其由塑料基体中的离散区域形成，其中塑料的机械性能已通过激光束的作用而被改变。

3. 发明授权

US5731047A Multiple frequency processing to improve electrical resistivity of blind micro-vias 失效
标题翻译：多频处理提高了盲孔的电阻率
公开(公告)号：US5731047A
公开(公告)日：1998-03-24
申请号：US746425
申请日：1996-11-08
申请人： David B. Noddin
发明人： David B. Noddin
IPC分类号： B23K26/00 , H05K3/00 , H05K3/46 , B05D3/02 , C08J7/18
CPC分类号： H05K3/0035 , B23K26/0006 , B23K2203/16 , B23K2203/30 , B23K2203/42 , H01L2224/16225 , H01L2924/15311 , H05K2203/0554 , H05K2203/1105 , H05K2203/128 , H05K3/4652
摘要： A method of forming a blind-via in a laminated substrate by forming a first conductive layer. A dielectric layer is then formed on the first conductive layer. An exposed second conductive layer is formed on the dielectric layer, with the second conductive layer having a preformed aperture. The dielectric layer is laser drilled through to the first conductive layer to form a blind-via at a location within the preformed aperture of the second conductive layer using a plurality of laser pulses. Each laser pulse has a first energy density per pulse that is greater than an ablation threshold of the dielectric layer and less than an ablation threshold of the first conductive layer. The first conductive layer is then laser drilled for a predetermined number of pulses. Each of the predetermined number of pulses has a second energy density per pulse that is greater than an ablation threshold of the first conductive layer. The predetermined number of pulses cause the surface of the first conductive layer exposed by the laser drilling to become molten.
摘要翻译：通过形成第一导电层在层叠基板中形成盲通孔的方法。然后在第一导电层上形成电介质层。暴露的第二导电层形成在电介质层上，其中第二导电层具有预制孔。使用多个激光脉冲将电介质层激光钻到第一导电层上以在第二导电层的预制孔的位置处形成盲通孔。每个激光脉冲具有大于电介质层的消融阈值且小于第一导电层的消融阈值的每脉冲的第一能量密度。然后将第一导电层激光钻出预定数量的脉冲。预定数量的脉冲中的每一个具有大于第一导电层的消融阈值的每脉冲的第二能量密度。预定数量的脉冲导致由激光钻孔暴露的第一导电层的表面变得熔化。

4. 发明授权

US5637925A Uses of uniaxially electrically conductive articles 失效
标题翻译：单轴导电制品的用途
公开(公告)号：US5637925A
公开(公告)日：1997-06-10
申请号：US007389
申请日：1993-01-21
申请人： Michael J. Ludden , Nicholas J. G. Smith , Paul J. Gibney , Peter Nyholm
发明人： Michael J. Ludden , Nicholas J. G. Smith , Paul J. Gibney , Peter Nyholm
IPC分类号： B23K1/00 , B23K20/02 , B23K26/40 , B23K31/02 , H01L21/48 , H01L23/373 , H01L23/498 , H05K1/03 , H05K3/00 , H01L23/48
CPC分类号： H01L21/486 , B23K1/0016 , B23K20/023 , B23K26/40 , B23K26/402 , B23K31/02 , H01L23/3733 , H01L23/49827 , H01L23/4985 , B23K2201/40 , B23K2203/16 , B23K2203/42 , H01L2224/05554 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/3011 , H05K1/0333 , H05K1/0346 , H05K1/036 , H05K2201/0116 , H05K2201/10378 , H05K2203/107 , H05K3/0017 , H05K3/0032
摘要： The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).
摘要翻译：目前的概念包括“1：1”单轴（40），每个芯片连接位置有一个导电通孔，“镜芯片”测试，与芯片的散热焊接，避免与芯片的导电断裂边缘接触，铟固体柱，金属凹槽（41）在通孔中。所有这些都受优选材料（UPILEX聚酰亚胺）和技术（U.V.激光烧蚀，孔的最小锥度）。

5. 发明授权

US5630308A Laser scoring of packaging substrates 失效
标题翻译：包装基材的激光刻痕
公开(公告)号：US5630308A
公开(公告)日：1997-05-20
申请号：US270782
申请日：1994-07-05
申请人： Anthony Guckenberger
发明人： Anthony Guckenberger
IPC分类号： B23K26/067 , B23K26/40 , B29C35/08 , B29C37/00 , B29C59/00 , B32B27/08 , B32B27/32 , B65D75/58 , B65D85/36 , B65B61/18 , B65B43/04
CPC分类号： B23K26/067 , B23K26/40 , B23K26/402 , B29C59/007 , B32B27/08 , B32B27/32 , B65D75/58 , B65D75/5844 , B23K2203/16 , B23K2203/172 , B23K2203/42 , B29C2035/0838 , B29C2791/009 , B29C37/0057 , B29L2009/00 , B65D85/36
摘要： Packaging machinery alignment, and a package having tear initiation and tear control, result from laser scoring of the package substrate, particularly, by providing at least two substantially parallel, substantially straight or linear, laser scores across the entire width of such package substrate.
摘要翻译：特别是通过在这种封装衬底的整个宽度上提供至少两个基本上平行的，基本上直的或线性的激光刻痕，包装机械对准以及具有撕裂开始和撕裂控制的封装。

6. 发明授权

US5628926A Method of forming via holes in a insulation film and method of cutting the insulation film 失效
标题翻译：在绝缘膜中形成通孔的方法和切割绝缘膜的方法
公开(公告)号：US5628926A
公开(公告)日：1997-05-13
申请号：US364451
申请日：1994-12-27
申请人： Haba Belgacem , Yukio Morishige
发明人： Haba Belgacem , Yukio Morishige
IPC分类号： B23K26/16 , B23K26/38 , B23K26/40 , H01L21/48 , H05K3/00 , H05K3/38 , B23K26/00
CPC分类号： H05K3/0032 , B23K26/16 , B23K26/382 , B23K26/40 , B23K26/402 , H01L21/486 , B23K2201/40 , B23K2201/42 , B23K2203/08 , B23K2203/12 , B23K2203/14 , B23K2203/16 , B23K2203/172 , B23K2203/26 , B23K2203/42 , B23K2203/50 , H05K2201/0112 , H05K2201/015 , H05K2201/0154 , H05K2201/0209 , H05K2203/0285 , H05K2203/1388 , H05K3/002 , H05K3/0055 , H05K3/388
摘要： A method of forming via holes in an organic insulation film or cutting the film includes the steps of exposing predetermined parts of the film to a laser beam to raise a temperature of the exposed parts of the film until the exposed parts are transformed or decomposed and subjecting the film to an ultra sonic wave so that the transformed or decomposed parts are dispersed.
摘要翻译：在有机绝缘膜中形成通孔或切割膜的方法包括以下步骤：将膜的预定部分暴露于激光束，以提高膜的暴露部分的温度，直到暴露部分变形或分解并且经受将该胶片变成超声波，使得转化或分解的部分分散。

7. 发明授权

US5495978A Bonding diverse thermal expansion materials 失效
标题翻译：粘合各种热膨胀材料
公开(公告)号：US5495978A
公开(公告)日：1996-03-05
申请号：US300857
申请日：1994-09-06
申请人： David L. Muth
发明人： David L. Muth
IPC分类号： B23K1/19 , B23K103/16
CPC分类号： B23K1/19 , B23K2203/16
摘要： The disclosure is for a method of bonding materials with severely mismatched coefficients of thermal expansion, such as carbon/carbon and a composite of aluminum oxide and niobium and for the structure of the bonded joint. The key to a good bond between such materials is the use of a thin layer of porous sintered metal as an intermediate material which is bonded to the two diverse thermal expansion materials. The sintered material has a porosity of 20 to 80 percent, and stays bonded to both of the different material surfaces while the sintered material itself is also not destroyed by the thermal stress.
摘要翻译：本公开内容涉及将具有严重错配的热膨胀系数的材料如碳/碳和氧化铝和铌的复合物以及用于结合接头的结构的方法。这种材料之间良好结合的关键是使用薄层的多孔烧结金属作为中间材料，其结合到两种不同的热膨胀材料上。烧结材料的孔隙率为20〜80％，并且与两种不同的材料表面保持粘合，而烧结材料本身也不被热应力破坏。

8. 发明授权

US5444212A Apparatus and method for producing a printing screen 失效
标题翻译：用于制造印刷丝网的装置和方法
公开(公告)号：US5444212A
公开(公告)日：1995-08-22
申请号：US191482
申请日：1994-02-04
申请人： George MacNaughton , Steven Forti , Douglas Whittington , Kevin Ackley
发明人： George MacNaughton , Steven Forti , Douglas Whittington , Kevin Ackley
IPC分类号： B23K26/06 , B23K26/08 , B23K26/38 , B41C1/14 , B41F15/08 , H05K3/12
CPC分类号： B23K26/382 , B23K26/0622 , B23K26/0846 , B23K26/40 , B23K26/402 , B41C1/145 , B41F15/0863 , B23K2201/34 , B23K2203/05 , B23K2203/08 , B23K2203/12 , B23K2203/16 , B23K2203/38 , B23K2203/40 , B23K2203/42 , B23K2203/50 , H05K3/1216
摘要： An apparatus for inking or printing on the surface of an item, such as a badge or emblem, is described. The apparatus incorporates a number of sub-systems including: an apparatus for holding and positioning blank screen material; a laser ablation system for producing the desired hole pattern in the blank screen material to form screens; a print/ink station; a table assembly for supporting a plurality of labels or emblems and moving such labels or emblems sequentially to the print station; and an apparatus for moving the screens to the print/ink station. The apparatus also includes heater for drying the ink after the printing/inking step is completed. The apparatus for producing the patterns includes a laser, mirrors for moving the beam in the x and y directions, and optics for focusing the beam on the blank screen material. The inking station includes an ink tray, a reciprocating squeegee and blades for wiping ink from the leading edges of the squeegee after the squeegee passes over the pattern.
摘要翻译：描述了用于在诸如徽章或徽章的物品的表面上着墨或印刷的装置。该装置包括许多子系统，包括：用于保持和定位空白屏幕材料的装置; 激光烧蚀系统，用于在坯料筛网材料中产生所需的孔图形以形成筛网; 印刷/墨水站; 用于支撑多个标签或标志并将这样的标签或标志顺序地移动到打印站的工作台组件; 以及用于将屏幕移动到打印/墨水站的装置。该装置还包括在打印/上墨步骤完成之后干燥油墨的加热器。用于产生图案的装置包括激光器，用于在x和y方向上移动光束的反射镜，以及用于将光束聚焦在空白屏幕材料上的光学器件。上墨站包括墨盘，往复式刮刀和用于在刮板通过图案之后从刮板的前缘擦拭墨的刀片。

9. 发明授权

US5365032A Method of cutting by means of laser radiation 失效
标题翻译：通过激光辐射切割的方法
公开(公告)号：US5365032A
公开(公告)日：1994-11-15
申请号：US8793
申请日：1993-01-25
申请人： Gerhard J. Muller , Gerfried Giebel
发明人： Gerhard J. Muller , Gerfried Giebel
IPC分类号： A61B18/22 , A61C1/00 , B23K26/00 , B23K26/06 , B23K26/067 , B23K26/36 , G02B3/00 , G02B6/28 , G02B6/42 , G02B13/08 , G02B27/14
CPC分类号： G02B3/06 , A61B18/22 , A61C1/0046 , B23K26/0006 , B23K26/0608 , B23K26/067 , B23K26/36 , G02B13/08 , G02B27/123 , G02B27/145 , G02B3/005 , G02B6/2817 , G02B6/4296 , B23K2203/16 , B23K2203/30
摘要： A method of cutting by means of laser radiation wherein, particularly in order to increase the cutting efficiency in connection with composite materials, the laser radiation focused along a line extending transversely to the direction of radiation.
摘要翻译：一种通过激光辐射切割的方法，特别是为了提高与复合材料相关的切割效率，激光辐射沿着横向于辐射方向延伸的线聚焦。

10. 发明授权

US5293025A Method for forming vias in multilayer circuits 失效
标题翻译：在多层电路中形成通孔的方法
公开(公告)号：US5293025A
公开(公告)日：1994-03-08
申请号：US739295
申请日：1991-08-01
申请人： Carl B. Wang
发明人： Carl B. Wang
IPC分类号： B23K26/00 , B23K26/02 , B23K26/38 , B23K101/42 , H01L21/48 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/46 , B23K26/08
CPC分类号： H05K3/4667 , B23K26/382 , B23K26/386 , B23K26/40 , B23K26/402 , H01L21/486 , H05K3/0008 , H05K3/0029 , B23K2203/16 , B23K2203/30 , B23K2203/42 , B23K2203/50 , B23K2203/52 , H05K1/0269 , H05K1/0306 , H05K1/092
摘要： The invention is directed to a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses. Beam positioning is controlled by means of a programmed galvanometric beam positioner. The drilling sequence is optionally controlled by application of an heuristic algorithm of the symmetric Traveling Salesman Problem.
摘要翻译：本发明涉及一种用于在多层电子电路中快速形成通孔图案的方法，其中每个通孔通过用受控数量的Nd：YAG激光束脉冲钻孔形成。光束定位通过编程的电流计量束定位器来控制。可选地通过应用对称旅行销售员问题的启发式算法来控制钻取序列。

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