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    • 1. 发明授权
    • Piezoelectric vibration device and piezoelectric resonance component
    • 压电振动装置和压电谐振元件
    • US06362561B1
    • 2002-03-26
    • US09501086
    • 2000-02-09
    • Hideaki KurodaRyuhei Yoshida
    • Hideaki KurodaRyuhei Yoshida
    • H01L4104
    • H03H9/177H03H9/0547H03H9/1014
    • An energy-trapping piezoelectric vibration device generates a thickness shear mode and includes an elongated piezoelectric element having first and second longitudinally opposed ends, top and bottom surfaces provided between the first and second ends such that the top and bottom surfaces oppose each other, and beveled surfaces disposed at a vicinity of the first and second ends such that the thickness of the piezoelectric element gradually decreases towards the first and second ends, respectively. First and second vibration electrodes are disposed on the top surface and the bottom surface of the piezoelectric element, respectively. The first and second vibration electrodes are located at an approximate middle portion of the piezoelectric element so as to oppose each other with the piezoelectric element disposed therebetween, to define opposing portions which constitute a vibrator. A roughness of the beveled surfaces is greater than a roughness of a flat portion of the top and bottom surfaces of the piezoelectric substrate disposed beneath the vibration electrodes.
    • 能量捕获压电振动装置产生厚度剪切模式,并且包括具有第一和第二纵向相对端的细长压电元件,顶表面和底表面设置在第一和第二端之间,使得顶表面和底表面彼此相对,并且倾斜 表面设置在第一端和第二端附近,使得压电元件的厚度分别朝向第一端和第二端逐渐减小。 第一和第二振动电极分别设置在压电元件的顶表面和底表面上。 第一和第二振动电极位于压电元件的大致中间部分处以彼此相对的压电元件设置在它们之间,以限定构成振动器的相对部分。 倾斜表面的粗糙度大于设置在振动电极下方的压电基板的顶表面和底表面的平坦部分的粗糙度。
    • 3. 发明授权
    • Chip-type piezoelectric resonator and method for adjusting resonance frequency thereof
    • 片式压电谐振器及其谐振频率的调节方法
    • US06215229B1
    • 2001-04-10
    • US09310237
    • 1999-05-12
    • Hideaki KurodaMasaya WajimaRyuhei Yoshida
    • Hideaki KurodaMasaya WajimaRyuhei Yoshida
    • H03H917
    • H03H9/177H03H3/04H03H9/0561H03H9/1035H03H2003/0428
    • A capacitor-included, chip-type piezoelectric resonator allows minute and highly precise adjustment of electrostatic capacitance and the resonance frequency after production of the piezoelectric resonator by laminating a piezoelectric element and dielectric substrates. The resonator includes a piezoelectric substrate laminated with dielectric substrates and external electrodes disposed on the laminate body. A plurality of external electrodes are arranged to extend from the outer major surface of the first dielectric substrate to the outer major surface of the second dielectric substrate along first and second side surfaces disposed opposite to each other. On the outer major surface of the second dielectric substrate, at least one external electrode is divided into first and second electrode portions.
    • 包含电容器的芯片型压电谐振器通过层叠压电元件和电介质基板,能够在制造压电谐振器之后对静电电容和谐振频率进行微调和高度精确的调整。 谐振器包括层叠有电介质基板的压电基板和设置在层叠体上的外部电极。 多个外部电极布置成沿着彼此相对设置的第一和第二侧表面从第一电介质基板的外主表面延伸到第二电介质基板的外主表面。 在第二电介质基板的外主表面上,至少一个外电极被分成第一和第二电极部分。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
    • 半导体器件制造方法和半导体器件
    • US20100140617A1
    • 2010-06-10
    • US12629150
    • 2009-12-02
    • Hideaki Kuroda
    • Hideaki Kuroda
    • H01L29/78H01L21/66H01L23/544
    • H01L27/105H01L21/84H01L22/14H01L22/20H01L27/11H01L27/1104H01L27/1116H01L27/1203H01L29/78H01L29/7855
    • A semiconductor device manufacturing method includes the steps of: forming a transistor on a surface side of a silicon layer of a silicon-on-insulator substrate, the silicon-on-insulator substrate being formed by laminating a substrate, an insulating layer, and the silicon layer; forming a first insulating film covering the transistor and a wiring section including a part electrically connected to the transistor on the silicon-on-insulator substrate; measuring a threshold voltage of the transistor through the wiring section; forming a supporting substrate on a surface of the first insulating film with a second insulating film interposed between the supporting substrate and the first insulating film; removing at least a part of the substrate and the insulating layer on a back side of the silicon-on-insulator substrate; and adjusting the threshold voltage of the transistor on a basis of the measured threshold voltage.
    • 半导体器件制造方法包括以下步骤:在绝缘体上硅衬底的硅层的表面侧上形成晶体管,绝缘体上硅衬底通过层叠衬底,绝缘层和 硅层; 形成覆盖晶体管的第一绝缘膜和包括与绝缘体上硅基板上的晶体管电连接的部分的布线部分; 通过所述布线部分测量所述晶体管的阈值电压; 在所述第一绝缘膜的表面上形成支撑衬底,其中所述第二绝缘膜置于所述支撑衬底和所述第一绝缘膜之间; 在绝缘体上硅衬底的背面去除衬底和绝缘层的至少一部分; 以及基于测量的阈值电压来调整晶体管的阈值电压。
    • 8. 发明申请
    • Electroacoustic Transducer
    • 电声传感器
    • US20080218031A1
    • 2008-09-11
    • US12126022
    • 2008-05-23
    • Hideaki KurodaYoshihiro Sonoda
    • Hideaki KurodaYoshihiro Sonoda
    • H04R17/00
    • H04R17/10
    • An electroacoustic transducer having one end portion of a first piezoelectric element and one end portion of a second piezoelectric element fixed to a frame such that the first piezoelectric element and the second piezoelectric element are supported by the frame in an opening of the frame in the cantilever manner. A flexible thin film is bonded to the frame and the first and second piezoelectric elements so that it covers at least a gap between each of the piezoelectric elements and the frame. The other end portions of the piezoelectric elements are free end portions, and face each other with a gap therebetween.
    • 一种电声换能器,其具有第一压电元件的一个端部和固定到框架的第二压电元件的一个端部,使得第一压电元件和第二压电元件由框架支撑在悬臂中的框架的开口中 方式。 柔性薄膜结合到框架和第一和第二压电元件,使得它覆盖每个压电元件和框架之间的至少一个间隙。 压电元件的另一端部是自由端部,并且彼此面对地间隔开。