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    • 1. 发明授权
    • Chip-type piezoelectric resonator and method for adjusting resonance frequency thereof
    • 片式压电谐振器及其谐振频率的调节方法
    • US06215229B1
    • 2001-04-10
    • US09310237
    • 1999-05-12
    • Hideaki KurodaMasaya WajimaRyuhei Yoshida
    • Hideaki KurodaMasaya WajimaRyuhei Yoshida
    • H03H917
    • H03H9/177H03H3/04H03H9/0561H03H9/1035H03H2003/0428
    • A capacitor-included, chip-type piezoelectric resonator allows minute and highly precise adjustment of electrostatic capacitance and the resonance frequency after production of the piezoelectric resonator by laminating a piezoelectric element and dielectric substrates. The resonator includes a piezoelectric substrate laminated with dielectric substrates and external electrodes disposed on the laminate body. A plurality of external electrodes are arranged to extend from the outer major surface of the first dielectric substrate to the outer major surface of the second dielectric substrate along first and second side surfaces disposed opposite to each other. On the outer major surface of the second dielectric substrate, at least one external electrode is divided into first and second electrode portions.
    • 包含电容器的芯片型压电谐振器通过层叠压电元件和电介质基板,能够在制造压电谐振器之后对静电电容和谐振频率进行微调和高度精确的调整。 谐振器包括层叠有电介质基板的压电基板和设置在层叠体上的外部电极。 多个外部电极布置成沿着彼此相对设置的第一和第二侧表面从第一电介质基板的外主表面延伸到第二电介质基板的外主表面。 在第二电介质基板的外主表面上,至少一个外电极被分成第一和第二电极部分。
    • 2. 发明授权
    • Electronic component
    • 电子元器件
    • US06274968B1
    • 2001-08-14
    • US09173603
    • 1998-10-16
    • Masaya WajimaRyuhei Yoshida
    • Masaya WajimaRyuhei Yoshida
    • H01L4108
    • H03H9/1035
    • An electronic component includes an electronic component element having a substantially rectangular plate disposed between upper and lower case substrates in the form of substantially rectangular plates such that the upper and lower case substrates and the electronic component element are stacked and define an integral unit. Assuming that the length of the shorter sides and the length of the longer sides of the electronic component element are a0 and b0, respectively, and that the length of the shorter sides and the length of the longer sides of the lower case substrate 3 are a1 and b1, respectively, the relationships a0
    • 电子部件包括电子部件元件,其具有设置在大致矩形板的形式的上下壳体基板之间的大致矩形板,使得上下壳体基板和电子部件元件堆叠并限定一体的单元。 假设电子元件的长边长度和长边长度分别为a0和b0,下壳体基板3的长边长度和长边长度为a1 和b1分别满足关系a0
    • 8. 发明授权
    • Method of forming a groove in a surface of a mother substrate
    • 在母基板的表面形成槽的方法
    • US06276992B1
    • 2001-08-21
    • US09212884
    • 1998-12-16
    • Masuyoshi HoudaMasaya Wajima
    • Masuyoshi HoudaMasaya Wajima
    • B24B100
    • B81C1/00412B24C1/04H01L21/3046H05K1/0306H05K3/0044H05K2203/025
    • A method of forming a groove on a mother material substrate includes the steps of forming a first layer on a surface of the mother material substrate, the first layer including a chain-polymer material which is soluble in an organic solvent. Then a second layer is formed on the first layer except for a portion where the groove is to be formed. The second layer includes a chain-polymer material having very high resistance to sand blasting. Then a groove is formed by cutting the first layer and the mother material substrate at the portion where the groove is to be formed, by a sand blasting process in which sand is directed from above the second layer downwardly. Then the first and second layers are removed from the mother material by dissolving the first layer using the organic solvent.
    • 在母材基板上形成槽的方法包括以下步骤:在母材基板的表面上形成第一层,第一层包括可溶于有机溶剂的链聚合物材料。 然后,除了要形成凹槽的部分之外,在第一层上形成第二层。 第二层包括具有非常高的抗喷砂性能的链聚合物材料。 然后,通过从第二层的上方向下方引导砂的喷砂处理,通过在要形成槽的部分切割第一层和母材基板而形成凹槽。 然后通过使用有机溶剂溶解第一层从母材中除去第一层和第二层。
    • 9. 发明授权
    • Energy-trap piezoelectric resonator and energy-trap piezoelectric resonance component
    • 能量陷波压电谐振器和能量陷波压电谐振分量
    • US06232699B1
    • 2001-05-15
    • US09412966
    • 1999-10-05
    • Masaya Wajima
    • Masaya Wajima
    • H01L4108
    • H03H9/1035H03H9/0207H03H9/0547H03H9/1014H03H9/132H03H9/177
    • An energy-trap piezoelectric resonator utilizing thickness extensional vibration includes a piezoelectric substrate and first and second resonance electrodes. The piezoelectric substrate is polarized in the thickness direction thereof and has first and second main surfaces. The first resonance electrode is partially disposed on the first main surface of the piezoelectric substrate, and the second resonance electrode is partially disposed on the second main surface of the piezoelectric substrate. The second resonance electrode is arranged to oppose the first resonance electrode with the piezoelectric substrate disposed therebetween and has an external dimension that is different from that of the first resonance electrode.
    • 利用厚度延伸振动的能量陷波压电谐振包括压电基片和第一和第二谐振电极。 压电基板在其厚度方向上极化,并具有第一和第二主表面。 第一谐振电极部分地设置在压电基板的第一主表面上,第二谐振电极部分地设置在压电基板的第二主表面上。 第二谐振电极被布置成与设置在其间的压电基板相对的第一谐振电极相对,并且具有与第一谐振电极的外部尺寸不同的外部尺寸。
    • 10. 发明授权
    • Chip electronic components and mounting structure for the same
    • 芯片电子元器件和安装结构相同
    • US06747392B1
    • 2004-06-08
    • US09656106
    • 2000-09-06
    • Masaya WajimaNaoshi Bamoto
    • Masaya WajimaNaoshi Bamoto
    • H01L4104
    • H03H9/177H03H9/02133H03H9/1014H03H9/1035H03H9/56H05K3/3442H05K2201/09381H05K2201/10083H05K2201/10636Y02P70/611Y02P70/613
    • A chip electronic component capable of being mounted with high density while preventing separation of bonded portions caused by solder fillets without requiring a case member having a complicated structure is provided at a low cost. The chip electronic component includes an electronic component element board including a circuit that defines an electronic component therein and having a pair of side surfaces and a lower surface, and a plurality of external electrodes extending over at least one of the side surface and the lower surface of the electronic component element and being electrically connected to the circuit provided therein. The electrode portion provided on the lower surface of the monolithic body as an electronic component element of each external electrode is provided with narrow portions and wide portions provided thereon, and the narrow portion continues to the external electrode portion provided on the side surface thereof.
    • 以低成本提供能够以高密度安装的芯片电子部件,同时防止由焊接圆角引起的接合部分的分离而不需要具有复杂结构的壳体部件。 芯片电子部件包括电子元件基板,其包括在其中限定电子部件并具有一对侧表面和下表面的电路,以及多个外部电极,其在侧表面和下表面中的至少一个 并且电连接到设置在其中的电路。 设置在作为每个外部电极的电子元件的单片体的下表面上的电极部分设置有设置在其上的窄部分和宽部分,并且窄部分继续到设置在其侧表面上的外部电极部分。