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1. 发明授权

US06723385B1 Process for the preliminary treatment of copper surfaces 有权
标题翻译：铜表面预处理工艺
公开(公告)号：US06723385B1
公开(公告)日：2004-04-20
申请号：US10129705
申请日：2000-09-05
申请人： Udo Grieser , Heinrich Meyer , Uwe Hauf
发明人： Udo Grieser , Heinrich Meyer , Uwe Hauf
IPC分类号： B05D300
CPC分类号： H05K3/389 , C23C22/52 , C23C22/83 , C23F1/18 , H05K3/383 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： A process to pretreat copper surfaces for tight bonding to organic substrates as those found in multilayer printed circuit boards includes first treating the copper with a solution containing hydrogen peroxide, and at least one acid, and at least one nitrogen-containing five-member heterocyclic compound which does not contain sulfur, selenium or tellurium atoms in the heterocycle. Thereafter the copper surfaces are brought into contact with a second solution containing at least one adhesion-promoting compound from the group consisting of sufinic acid, selinic acid, telluric acid, and heterocyclic compounds that contain at least one sulfur, and/or selenium and/or tellurium atom in the heterocycie and also sulfonium, selenonium and telluronium salts.
摘要翻译：预处理铜表面以与多层印刷电路板中发现的铜表面紧密结合的方法包括首先用含有过氧化氢的溶液和至少一种酸和至少一种含氮五元杂环化合物处理铜其在杂环中不含硫，硒或碲原子。此后，使铜表面与含有至少一种粘附促进化合物的第二溶液接触，所述粘合促进化合物包括由齐墩果酸，联苯二酸，碲酸和含有至少一个硫和/或硒和/或硒的杂环化合物组成的组，或碲原子，还有锍，硒和碲鎓盐。

2. 发明授权

US06593249B2 Method for forming a metal pattern on a dielectric substrate 失效
标题翻译：在电介质基板上形成金属图案的方法
公开(公告)号：US06593249B2
公开(公告)日：2003-07-15
申请号：US09852384
申请日：2001-05-10
申请人： Heinrich Meyer , Udo Grieser
发明人： Heinrich Meyer , Udo Grieser
IPC分类号： H01L2131
CPC分类号： H01L21/31 , G03F7/202 , H05K3/0032 , H05K3/0076 , H05K3/061 , H05K3/4644 , H05K2203/135
摘要： A method of reproducibly manufacturing circuit carriers with very fine circuit structures, more specifically with structure widths of 50 &mgr;m and less, is described in which a substrate provided with a base metal surface is provided, a layer of varnish is applied onto the substrate by an electrophoretic method, the layer of varnish is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare, the bare base metal surface is etched, the layer of varnish being ablated by means of ultraviolet irradiation, more specifically with an ultraviolet laser beam.
摘要翻译：描述了一种可重复地制造具有非常精细的电路结构的电路载体的方法，更具体地说，其结构宽度为50um以下，其中提供了具有贱金属表面的基板，通过一个电泳方法中，在不对应于要形成的金属图案的区域的至少一部分中，清漆层被烧蚀，贱金属表面被裸露，裸露的贱金属表面被蚀刻，清漆层被烧蚀通过紫外线照射更具体地使用紫外线激光束。

3. 发明授权

US06562149B1 Solution and process to pretreat copper surfaces 有权
标题翻译：预处理铜表面的方法和工艺
公开(公告)号：US06562149B1
公开(公告)日：2003-05-13
申请号：US09601494
申请日：2000-08-22
申请人： Udo Grieser , Heinrich Meyer
发明人： Udo Grieser , Heinrich Meyer
IPC分类号： C23C2248
CPC分类号： C23F1/18 , C23C22/52 , C23C22/83 , H05K3/383 , H05K3/389 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded to organic substrates. The solution is used, in particular, for firmly bonding laminated multilayered printed circuit boards and for firmly bonding resists to the copper surfaces of printed circuit boards. The solutions contain (a) hydrogen peroxide; (b) at least one acid; (c) at least one nitrogen-containing, five-membered heterocyclic compound which does not contain any sulphur, selenium or tellurium atom in the heterocycle; and (d) at least one adhesive compound from the group consisting of sulfinic acids, seleninic acids, tellurinic acids, heterocyclic compounds containing at least one sulphur, selenium and/or tellurium atom in the heterocycle, and sulfonium, selenonium and telluronium salts having the general formula (A), in which A stands for S, Se or Te; R1, R2 and R3 stand for alkyl, substituted alkyl, alkenyl, phenyl, substituted phenyl, benzyl, cycloalkyl, substituted cycloalkyl, R1, R2 and R3 being the same or different; and X− stands for an anion of an inorganic or organic acid or hydroxide, provided that the acid selected to constitute component (b) is not identical to the sulfinic, seleninic or tellurinic acids selected as component (d).
摘要翻译：本发明涉及用于铜表面的初步处理的方法和解决方案，其随后将牢固地结合到有机基底上。特别地，该溶液用于牢固地粘结层叠的多层印刷电路板，并将抗蚀剂牢固地粘合到印刷电路板的铜表面。溶液含有（a）过氧化氢; （b）至少一种酸; （c）至少一种在杂环中不含硫，硒或碲原子的含氮五元杂环化合物; 和（d）至少一种由亚磺酸，硒酸，碲酸，杂环中含有至少一个硫，硒和/或碲原子的杂环化合物组成的组，以及锍，硒和碲鎓盐，其具有通式（A），其中A代表S，Se或Te; R1，R2和R3代表烷基，取代的烷基，烯基，苯基，取代的苯基，苄基，环烷基，取代的环烷基，R1，R2和R3相同或不同; 并且X代表无机或有机酸或氢氧化物的阴离子，条件是选自构成组分（b）的酸与选自组分（d）的亚磺酸，硒化或碲酸反应不同。

4. 发明授权

US5693209A Process for metallization of a nonconductor surface 失效
标题翻译：非导体表面的金属化工艺
公开(公告)号：US5693209A
公开(公告)日：1997-12-02
申请号：US518575
申请日：1995-08-23
申请人： Burkhard Bressel , Heinrich Meyer , Walter Meyer , Klaus Gedrat
发明人： Burkhard Bressel , Heinrich Meyer , Walter Meyer , Klaus Gedrat
IPC分类号： C08G61/12 , C25D5/56 , H05K3/18
CPC分类号： H05K3/188 , C08G61/123 , C25D5/56 , H05K2203/0796 , Y10S205/92
摘要： The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.
摘要翻译：用于直接金属化具有非导体表面的电路板的方法包括使非导体表面与碱性高锰酸盐溶液反应以形成化学吸附在非导体表面上的二氧化锰; 形成弱酸和吡咯或吡咯衍生物及其可溶性低聚物的水溶液; 使含有吡咯单体及其低聚物的水溶液与其上具有化学吸附的二氧化锰的非导体表面接触，以在非导体表面上沉积粘附的导电不溶性聚合物产物; 并在其上形成有不溶性粘附聚合物产物的非导体表面上直接电沉积金属。低聚物有利地在室温至溶液凝固点之间的温度下形成含有0.1至200g / l吡咯单体的水溶液。

5. 发明授权

US5503877A Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate 失效
标题翻译：用于在基底上产生金属种子的复合低聚物或聚合物
公开(公告)号：US5503877A
公开(公告)日：1996-04-02
申请号：US337669
申请日：1994-11-10
申请人： Lutz Stamp , Elisabeth Zettelmeyer , Heinrich Meyer , Gonzalo U. Desmaison
发明人： Lutz Stamp , Elisabeth Zettelmeyer , Heinrich Meyer , Gonzalo U. Desmaison
IPC分类号： C08G85/00 , C23C18/30 , B05D3/00 , B05D3/12
CPC分类号： C08G85/00 , C23C18/30
摘要： Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N or O atom, or a multiple bond, or several of these elements. The complex compounds are useful for the generation of metal seeds on a non-metallic substrate.
摘要翻译：公开了包含周期表第8至第11组的金属与至少一种有机配体的复合化合物，其中络合物以低聚或聚合形式存在，有机配体优选含有至少一个N或O原子，或多重键或这些元素中的几个。复合化合物可用于在非金属基底上产生金属种子。

6. 发明授权

US4939370A Method of and device for inspecting and/or controlling metallization processes 失效
标题翻译：用于检查和/或控制金属化处理的方法和装置
公开(公告)号：US4939370A
公开(公告)日：1990-07-03
申请号：US266382
申请日：1988-11-02
申请人： Heinrich Meyer , Waldfried J. L. Plieth , Martin Kurpjoweit
发明人： Heinrich Meyer , Waldfried J. L. Plieth , Martin Kurpjoweit
IPC分类号： C23C16/52 , C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , C25D21/12 , G01B11/06
CPC分类号： G01B11/0616 , C23C18/1619 , C23C18/1675 , C25D21/12
摘要： A method for checking and/or controlling a metallization process in a galvanizing or chemical is based on the measurement of light scattered off or reflected from a surface portion being metallized. A deviation from a predetermined nominal value of the scattered or reflected light intensity serves for controlling at least one process parameter to neutralize the deviation.
摘要翻译：用于检查和/或控制镀锌或化学品中的金属化处理的方法是基于被金属化的表面部分散射掉或反射的光的测量。与散射或反射光强度的预定标称值的偏差用于控制至少一个过程参数以中和偏差。

7. 发明授权

US07380698B2 Method of connecting module layers suitable for the production of microstructure modules and a microstructure module 有权
标题翻译：连接适用于生产微结构模块和微结构模块的模块层的方法
公开(公告)号：US07380698B2
公开(公告)日：2008-06-03
申请号：US10394601
申请日：2003-03-21
申请人： Heinrich Meyer , Konrad Crämer , Olaf Kurtz , Ralph Herber , Wolfgang Friz , Carsten Schwiekendick , Oliver Ringtunatus , Christian Madry
发明人： Heinrich Meyer , Konrad Crämer , Olaf Kurtz , Ralph Herber , Wolfgang Friz , Carsten Schwiekendick , Oliver Ringtunatus , Christian Madry
IPC分类号： B23K31/02
CPC分类号： B23K1/20 , B23K1/0012 , B23K35/001 , B23K35/002 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/28 , B23K35/282 , B23K35/286 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/3066 , B23K35/36 , B23K2103/04 , B23K2103/10 , B23K2103/12 , F28F2260/02
摘要： A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.
摘要翻译：提供一种连接微结构化组分层的方法和用于制造微结构组分层和微结构组分层的方法。至少一个多功能阻挡涂层施加到用于微结构化组分层的基材层的接合表面。这些层由铝/铝合金和/或铜/铜合金和/或贵金属钢制成。至少一个焊料/钎焊涂层施加到每个阻挡涂层。包含组分层的被覆基材层被堆叠。堆叠的组件层通过焊接/钎焊加热连接。焊接/钎焊涂层的熔化温度比热熔接后高。

8. 发明授权

US6120672A Process for manufacturing inductive counting systems 失效
标题翻译：制造感应计数系统的过程
公开(公告)号：US6120672A
公开(公告)日：2000-09-19
申请号：US068404
申请日：1998-06-05
申请人： Franz Kohnle , Heinrich Meyer , Gonzalo Urrutia Desmaison
发明人： Franz Kohnle , Heinrich Meyer , Gonzalo Urrutia Desmaison
IPC分类号： G06K19/07 , B42D15/10 , C23C18/16 , C23C18/18 , G06K19/067 , G06K19/077 , H05K3/18 , C23C28/00
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1653 , G06K19/067
摘要： A process is described for producing inductively operating counting systems by forming a conducting structure on an electrically non-conducting substrate, comprising a step involving the application of a suitable catalyst for the currentless deposition of metals onto the electrically non-conducting substrate as well as conventional pretreatment and post-treatment steps. The following process steps are essential for the process according to the invention:1) Application of a liquid photoresist, the liquid photoresist being printed only onto the surface not subsequently covered by the conductive pattern and onto the fine-structured portions of the conduction pattern,2) Subsequent photostructuring of the fine-structured portions of the conductive pattern by illumination and subsequent developing,3) Subsequent currentless deposition of a first thin metallic layer onto the exposed, catalytically coated surface regions,4) Subsequent electrolytic deposition of a second metallic layer onto the first metallic layer, and5) Subsequent application of a decorative protective lacquer or varnish film.
摘要翻译： PCT No.PCT / EP97 / 00845 Sec。 371日期：1998年6月5日 102（e）1998年6月5日PCT 1997年2月21日提交PCT公布。公开号WO97 / 39163 日期1997年10月23日描述了一种用于通过在非导电衬底上形成导电结构来生产电感计数系统的方法，其包括施加合适的催化剂以将金属无电镀沉积到非导电底物以及常规的预处理和后处理步骤。以下工艺步骤对于根据本发明的方法是必需的：1）液体光致抗蚀剂的应用，液态光致抗蚀剂仅被印刷在随后被导电图案覆盖的表面上和导电图案的精细结构部分上， 2）通过照明和随后的显影对导电图案的精细结构部分进行随后的光结构，3）随后无电镀沉积第一薄金属层到暴露的，催化涂覆的表面区域上，4）随后的电解沉积第二金属层在第一金属层上，以及5）随后应用装饰性保护漆或清漆膜。

9. 发明授权

US6099711A Process for the electrolytic deposition of metal layers 失效
标题翻译：金属层电解沉积工艺
公开(公告)号：US6099711A
公开(公告)日：2000-08-08
申请号：US66313
申请日：1998-04-23
申请人： Wolfgang Dahms , Heinrich Meyer , Stefan Kretschmer
发明人： Wolfgang Dahms , Heinrich Meyer , Stefan Kretschmer
IPC分类号： C25D3/38 , C25D5/18 , H05K3/24 , C25D21/18
CPC分类号： C25D3/38 , C25D5/18 , H05K3/241 , Y10S205/92
摘要： The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes and applying direct current, only uneven metal distribution can be attained on complex shaped workpieces. By using a pulse current or pulse voltage method, the problem of the coatings being of varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes. In order to guarantee sufficient stability of the anodes and a bright coating even at those points on the workpiece surfaces, onto which the metal is deposited with high current density, it is essential to add compounds of an electrochemically reversible redox system to the depositing solution.
摘要翻译： PCT No.PCT / EP96 / 05140 Sec。 371日期：1998年4月23日 102（e）1998年4月23日PCT 1996年11月21日PCT PCT。出版物WO97 / 19206 日期1997年5月29日本发明涉及金属涂层的电解沉积方法，特别是具有一定物理机械和光学性质以及均匀涂层厚度的铜涂层的电解沉积方法。根据已知的使用可溶性阳极并施加直流电流的方法，在复杂形状的工件上只能获得不均匀的金属分布。通过使用脉冲电流或脉冲电压法，可以确实减少涂层在工件表面各处的厚度变化的问题。然而，在沉积过程中通过溶解阳极的几何比例的连续变化的另外的问题并不解决。这可以通过使用不溶性阳极来避免。为了确保阳极和光亮涂层的稳定性，即使在工件表面上的这些点，金属以高电流密度沉积在其上，必须将电化学上可逆的氧化还原体系的化合物添加到沉积溶液中。

10. 发明授权

US5487076A Method for securing data in read-write memories in mobile data storage systems 失效
标题翻译：用于在移动数据存储系统中的读写存储器中保护数据的方法
公开(公告)号：US5487076A
公开(公告)日：1996-01-23
申请号：US85265
申请日：1993-06-29
申请人： Heinrich Meyer
发明人： Heinrich Meyer
IPC分类号： G06F11/10 , H03M13/00
CPC分类号： G06F11/1004
摘要： To check the useful data of a read-write memory, subsets of the data are formed from the total quantity of useful data, and error-correction data are calculated for each subset of useful data. The subsets of useful data and the corresponding error-correction data are transmitted block-by-block to the read-write memory. During each reading operation, the block containing the desired useful data is read out and the integrity of that data is checked with the aid of the error-correction data.
摘要翻译：为了检查读写存储器的有用数据，数据的子集由有用数据的总数形成，并且针对有用数据的每个子集计算纠错数据。有用数据子集和对应的纠错数据逐块传输到读写存储器。在每次读取操作期间，读出包含期望的有用数据的块，借助于纠错数据检查该数据的完整性。

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