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1. 发明授权

US07380698B2 Method of connecting module layers suitable for the production of microstructure modules and a microstructure module 有权
标题翻译：连接适用于生产微结构模块和微结构模块的模块层的方法
公开(公告)号：US07380698B2
公开(公告)日：2008-06-03
申请号：US10394601
申请日：2003-03-21
申请人： Heinrich Meyer , Konrad Crämer , Olaf Kurtz , Ralph Herber , Wolfgang Friz , Carsten Schwiekendick , Oliver Ringtunatus , Christian Madry
发明人： Heinrich Meyer , Konrad Crämer , Olaf Kurtz , Ralph Herber , Wolfgang Friz , Carsten Schwiekendick , Oliver Ringtunatus , Christian Madry
IPC分类号： B23K31/02
CPC分类号： B23K1/20 , B23K1/0012 , B23K35/001 , B23K35/002 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/28 , B23K35/282 , B23K35/286 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/3066 , B23K35/36 , B23K2103/04 , B23K2103/10 , B23K2103/12 , F28F2260/02
摘要： A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.
摘要翻译：提供一种连接微结构化组分层的方法和用于制造微结构组分层和微结构组分层的方法。至少一个多功能阻挡涂层施加到用于微结构化组分层的基材层的接合表面。这些层由铝/铝合金和/或铜/铜合金和/或贵金属钢制成。至少一个焊料/钎焊涂层施加到每个阻挡涂层。包含组分层的被覆基材层被堆叠。堆叠的组件层通过焊接/钎焊加热连接。焊接/钎焊涂层的熔化温度比热熔接后高。

2. 发明授权

US08042726B2 Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method 有权
标题翻译：使用由镍 - 磷组成的接合层来接合由不锈钢，镍或镍合金制成的工件的方法，使用这种方法制造微结构部件的方法; 通过这种方法获得的微结构组分
公开(公告)号：US08042726B2
公开(公告)日：2011-10-25
申请号：US12307939
申请日：2007-08-02
申请人： Ralph Herber , Olaf Kurtz , Johannes Etzkorn , Christian Madry , Carsten Schwiekendick , Gerd Schafer
发明人： Ralph Herber , Olaf Kurtz , Johannes Etzkorn , Christian Madry , Carsten Schwiekendick , Gerd Schafer
IPC分类号： B23K31/02 , B23K35/24
CPC分类号： B23K20/233 , B23K20/023 , B23K20/227 , B23K2101/045 , B23K2101/14 , B23K2101/185 , B23K2103/05 , B23K2103/26 , B81C3/001 , B81C2203/035 , F28D9/00 , F28F2260/02 , Y10T428/12646
摘要： To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.
摘要翻译：为了形成适于生产由多个单独层制成的微结构部件的高性能接合连接，通过该步骤进行接合; 提供至少两个工件; 通过化学或电解金属电镀方法在所述至少两个工件中的至少一个的至少一侧上形成金属粘合层; 金属接合层是具有规定的磷含量和规定厚度的镍/磷合金; 形成包括所述工件的接合装置，使得在所述至少两个相应的工件之间存在至少一个金属结合层; 以规定的加热速度加热到高于接合层的熔融温度的温度; 通过施加规定范围内的接触压力来接合两个工件; 并以规定的速度冷却。

3. 发明申请

US20090202858A1 METHOD FOR BONDING WORK PIECES MADE OF STAINLESS STEEL, NICKEL OR NICKEL ALLOYS, USING A BONDING LAYER CONSISTING OF NICKEL-PHOSPHOROUS, METHOD FOR PRODUCING A MICRO-STRUCTURED COMPONENT USING SUCH METHOD; MICRO-STRUCTURED COMPONENT OBTAINED BY SUCH METHOD 有权
标题翻译：用不锈钢，镍或镍合金制作非金属粘结层的方法，使用这种方法生产微结构元件的方法; 通过这种方法获得的微结构组件
公开(公告)号：US20090202858A1
公开(公告)日：2009-08-13
申请号：US12307939
申请日：2007-08-02
申请人： Ralph Herber , Olaf Kurtz , Johannes Etzkorn , Christian Madry , Carsten Schwiekendick , Gerd Schäfer
发明人： Ralph Herber , Olaf Kurtz , Johannes Etzkorn , Christian Madry , Carsten Schwiekendick , Gerd Schäfer
IPC分类号： B32B15/18 , B23K31/02
CPC分类号： B23K20/233 , B23K20/023 , B23K20/227 , B23K2101/045 , B23K2101/14 , B23K2101/185 , B23K2103/05 , B23K2103/26 , B81C3/001 , B81C2203/035 , F28D9/00 , F28F2260/02 , Y10T428/12646
摘要： To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.
摘要翻译：为了形成适于生产由多个单独层制成的微结构部件的高性能接合连接，通过该步骤进行接合; 提供至少两个工件; 通过化学或电解金属电镀方法在所述至少两个工件中的至少一个的至少一侧上形成金属粘合层; 金属接合层是具有规定的磷含量和规定厚度的镍/磷合金; 形成包括所述工件的接合装置，使得在所述至少两个相应的工件之间存在至少一个金属结合层; 以规定的加热速度加热到高于接合层的熔融温度的温度; 通过施加规定范围内的接触压力来接合两个工件; 并以规定的速度冷却。

4. 发明申请

US20090250379A1 Process for Manufacturing a Microreactor and Its Use as a Reformer 有权
标题翻译：制造微反应器的工艺及其作为改造者的使用
公开(公告)号：US20090250379A1
公开(公告)日：2009-10-08
申请号：US12085302
申请日：2007-02-22
申请人： Olaf Kurtz , Ralph Herber , Christian Madry , Gerd Schäfer
发明人： Olaf Kurtz , Ralph Herber , Christian Madry , Gerd Schäfer
IPC分类号： F01N7/18 , C23F1/04 , B01J35/02 , C10G35/04
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00804 , B01J2219/00822 , B01J2219/00835 , B01J2219/0086 , Y10T29/49345
摘要： For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.
摘要翻译：为了制造具有使用预涂层法的装有催化剂的通道的微结构反应器，提供了一种方法，其包括以下方法步骤：a）制备具有结合区域的反应器层以及形成通道的通道区域，b ）在接合区域中将至少一个粘合层施加到反应器层上，c）用催化剂将反应器层装载在通道区域中，以及d）粘结反应器层，在加载反应器层之前施加和掩蔽粘合层与催化剂。结果确保了在制造时不会影响催化剂的效率。反应器特别可用作甲烷和甲醇重整器。

5. 发明授权

US07909987B2 Process for manufacturing a microreactor and its use as a reformer 有权
标题翻译：制造微反应器的方法及其作为重整器的用途
公开(公告)号：US07909987B2
公开(公告)日：2011-03-22
申请号：US12085302
申请日：2007-02-22
申请人： Olaf Kurtz , Ralph Herber , Christian Madry , Gerd Schäfer
发明人： Olaf Kurtz , Ralph Herber , Christian Madry , Gerd Schäfer
IPC分类号： C01G35/04 , B21D51/16 , B01J8/02 , H01M8/06
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00804 , B01J2219/00822 , B01J2219/00835 , B01J2219/0086 , Y10T29/49345
摘要： For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.
摘要翻译：为了制造具有使用预涂层法的装有催化剂的通道的微结构反应器，提供了一种方法，其包括以下方法步骤：a）制备具有结合区域的反应器层以及形成通道的通道区域，b ）在接合区域中将至少一个粘合层施加到反应器层上，c）用催化剂将反应器层装载在通道区域中，以及d）粘结反应器层，在加载反应器层之前施加和掩蔽粘合层与催化剂。结果确保了在制造时不会影响催化剂的效率。反应器特别可用作甲烷和甲醇重整器。

6. 发明申请

US20080217381A1 Method for Bonding Work pieces and Micro-Structured Component 审中-公开
标题翻译：粘结工件和微结构件的方法
公开(公告)号：US20080217381A1
公开(公告)日：2008-09-11
申请号：US11994583
申请日：2006-06-28
申请人： Heinrich Meyer , Olaf Kurtz , Ralph Herber , Chirstian Madry , Johannes Etzkorn , Thomas Vago
发明人： Heinrich Meyer , Olaf Kurtz , Ralph Herber , Chirstian Madry , Johannes Etzkorn , Thomas Vago
IPC分类号： B23K20/16
CPC分类号： B23K20/023 , F28F2260/00 , F28F2260/02 , F28F2275/04
摘要： For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.
摘要翻译：为了形成适合于制造由多个单独层组成的微结构部件的非常牢固的接合接头，提出了一种接合方法，通过该接合方法形成工件的接合装置，其包括插入其间的至少一个金属接合层，由此将接合装置加热到低于至少一个接合层的熔融温度的接合温度。根据本发明，使用化学或电解方法沉积至少一个结合层。

7. 发明授权

US06865081B2 Microstructure cooler and use thereof 失效
标题翻译：微结构冷却器及其用途
公开(公告)号：US06865081B2
公开(公告)日：2005-03-08
申请号：US10394356
申请日：2003-03-21
申请人： Heinrich Meyer , Konrad Cramer , Olaf Kurtz , Peter Prechtl , Sven Theisen , Markus Hohn , Ralph Herber
发明人： Heinrich Meyer , Konrad Cramer , Olaf Kurtz , Peter Prechtl , Sven Theisen , Markus Hohn , Ralph Herber
IPC分类号： F25D9/00 , F28F3/12 , H01L23/473 , H05K7/20
CPC分类号： F28F3/12 , F28F9/0253 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 μm, a depth in the range of 25 to 1,000 μm, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 μm, and the base plate 5 has a thickness in the range of 200 to 2,000 μm.
摘要翻译：本发明涉及一种用于待冷却的物品4的微结构冷却器3，由此冷却器3包括至少两个金属膜1和一个基板5的叠层，该底板5可经由热接触表面6与热接触表面6 如图4所示，金属膜1和基板5以材料配合相互接合，存在于金属膜1中的是用于冷却介质的通道2，通道2的宽度在100〜2000μm的范围内，深度为25〜1000μm，平均间隔为50〜1000，金属膜1中的通道2产生的残留膜厚度在50〜300μm的范围内，基底板5的厚度在200至2,000μm的范围内。

8. 发明申请

US20080196875A1 Micro-Structured Cooler and Use Thereof 有权
公开(公告)号：US20080196875A1
公开(公告)日：2008-08-21
申请号：US11995221
申请日：2006-07-12
申请人： Olaf Kurtz , Ralph Herber , Peter Prechtl , Sven Theisen , Markus Hohn
发明人： Olaf Kurtz , Ralph Herber , Peter Prechtl , Sven Theisen , Markus Hohn
IPC分类号： F28F3/08
CPC分类号： H01L23/473 , F28F3/048 , F28F3/086 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 μm, a depth t ranging from 30 to 150 μm, a mean spacing s ranging from 30 to 300 μm, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 μm and said base plate (5) having a thickness g ranging from 100 to 1,000 μm, said cooler further having at least one splitting chamber (10) traversing the metal foils (1) approximately in the region of the thermal contact surface (6), said chamber communicating with a respective inlet-side end of all or of the selected channels (2) through channel inlet ports, at least one inlet chamber (20) for admission of coolant into the cooler (3), said chamber communicating with the at least one splitting chamber (10), at least one collecting chamber (11) traversing the metal foils (1) and communicating with a respective outlet-side end of all or selected channels (2) through channel outlet ports and at least one outlet chamber (21) for discharging coolant from said cooler (3), said chamber communicating with said at least one collecting chamber (11), the depth of said channels (2) in a channel layer adjacent said base plate (5) being greater than the depth of the channels (2) in a channel layer located in the stack on the side opposite said base plate (5).

9. 发明授权

US07987899B2 Micro-structured cooler and use thereof 有权
标题翻译：微结构冷却器及其用途
公开(公告)号：US07987899B2
公开(公告)日：2011-08-02
申请号：US11995221
申请日：2006-07-12
申请人： Olaf Kurtz , Ralph Herber , Peter Prechtl , Sven Theisen , Markus Höhn
发明人： Olaf Kurtz , Ralph Herber , Peter Prechtl , Sven Theisen , Markus Höhn
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/048 , F28F3/086 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 μm, a depth t ranging from 30 to 150 μm, a mean spacing s ranging from 30 to 300 μm, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 μm and said base plate (5) having a thickness g ranging from 100 to 1,000 μm.
摘要翻译：为了提供更具体地用于冷却电子部件的特别有效的微结构冷却器，建议以如下方式进行构建该冷却器：提供至少两个金属箔（1）的堆叠，包括用于冷却剂的通道（2）以及适于通过热接触表面（6）与所述电子部件（4）热接触的一个基板（5），所述金属箔（1）和所述基板（5）接合在一起以形成所述通道（2）具有100至350μm的宽度b，深度t在30至150μm之间，平均间距s在30至300μm之间，剩余的箔厚度r在形成之后残留的金属箔（1）中的通道（2）的范围为30〜300μm，所述基板（5）的厚度g为100〜1000μm。

10. 发明申请

US20110281124A1 SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION RESISTANCE OF A METAL OR METAL ALLOY SURFACE 有权
标题翻译：提高金属或金属合金表面的焊接性和耐腐蚀性的方法和工艺
公开(公告)号：US20110281124A1
公开(公告)日：2011-11-17
申请号：US13143222
申请日：2010-01-13
申请人： Jürgen Barthelmes , Robert Ruether , Olaf Kurtz , Jana Breitfelder
发明人： Jürgen Barthelmes , Robert Ruether , Olaf Kurtz , Jana Breitfelder
IPC分类号： B32B15/04 , B23K1/20 , H05K1/03 , C09D5/00
CPC分类号： C23C22/58 , C23C22/06 , C23C22/74 , C23F11/1676 , C25D5/48 , H01L21/4835 , H05K3/282 , H05K2203/122 , Y10T428/31678
摘要： Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
摘要翻译：描述了一种新的溶液，其包含磷化合物和任选的可焊性增强化合物及其在增加金属或金属合金表面的可焊性和耐腐蚀性的方法中的用途。

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