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1. 发明申请

US20120321781A1 PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING 审中-公开
标题翻译：电镀镍镀层预处理工艺
公开(公告)号：US20120321781A1
公开(公告)日：2012-12-20
申请号：US13254239
申请日：2010-03-12
申请人： Elisabeth Zettelmeyer
发明人： Elisabeth Zettelmeyer
IPC分类号： H05K3/00
CPC分类号： C23C18/1841 , C23C18/1607 , C23C18/1608 , C23C18/1637 , H05K3/244 , H05K2203/0716 , H05K2203/072
摘要： The present invention discloses a process for electroless plating of nickel onto copper features of a printed circuit board which suppresses extraneous nickel plating. The process comprises the steps i) activation of the copper features with palladium ions; ii) removal of excessive palladium ions or precipitates formed thereof with a pre-treatment composition comprising at least two different types of acids wherein one type is an organic amino carboxylic acid and iii) electroless plating of nickel.
摘要翻译：本发明公开了一种用于无电镀镍到印刷电路板的铜特征的方法，其抑制了外部镀镍。该方法包括以下步骤：i）用钯离子激活铜的特征; ii）用包含至少两种不同类型的酸的预处理组合物除去过量的钯离子或其形成的沉淀，其中一种是有机氨基羧酸，和iii）无电镀镍。

2. 发明授权

US5503877A Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate 失效
标题翻译：用于在基底上产生金属种子的复合低聚物或聚合物
公开(公告)号：US5503877A
公开(公告)日：1996-04-02
申请号：US337669
申请日：1994-11-10
申请人： Lutz Stamp , Elisabeth Zettelmeyer , Heinrich Meyer , Gonzalo U. Desmaison
发明人： Lutz Stamp , Elisabeth Zettelmeyer , Heinrich Meyer , Gonzalo U. Desmaison
IPC分类号： C08G85/00 , C23C18/30 , B05D3/00 , B05D3/12
CPC分类号： C08G85/00 , C23C18/30
摘要： Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N or O atom, or a multiple bond, or several of these elements. The complex compounds are useful for the generation of metal seeds on a non-metallic substrate.
摘要翻译：公开了包含周期表第8至第11组的金属与至少一种有机配体的复合化合物，其中络合物以低聚或聚合形式存在，有机配体优选含有至少一个N或O原子，或多重键或这些元素中的几个。复合化合物可用于在非金属基底上产生金属种子。

3. 发明授权

US5421989A Process for the metallization of nonconductive substrates with elimination of electroless metallization 失效
标题翻译：无电金属化消除非金属化非金属基板的工艺
公开(公告)号：US5421989A
公开(公告)日：1995-06-06
申请号：US116535
申请日：1993-09-03
申请人： Lutz Stamp , Elisabeth Zettelmeyer-Decker , Norbert Tiemann
发明人： Lutz Stamp , Elisabeth Zettelmeyer-Decker , Norbert Tiemann
IPC分类号： C25D5/54 , H05K3/18
CPC分类号： C25D5/54 , H05K3/188
摘要： A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:(a) contacting the substrate with a suspension comprising a noble metal colloid suspended in a polymer matrix to obtain a coated substrate;(b) optionally removing at least part or substantially all of the polymer matrix from said coated substrate;(c) electrolytically coating the substrate obtained after step (a) or (b) with a solution of the principal metal coating. The polymer matrix is selected to combine with the metal of the noble metal coating or principal metal or both. Prior to contacting the substrate with the suspension, it may be contacted with a conditioner that will combine with the noble metal or principal metal or both to obtain a conditioned substrate. The conditioned substrate is then contacted with the suspension. A sufficient amount of the polymer matrix may be removed so that the residue of the polymer matrix will combine with the principal metal and the outer surface of the principal metal coating will be substantially free of the polymer matrix.
摘要翻译：公开了一种用于将主要金属涂层施加到非导电基底上而不使用无电镀涂层的方法，其包括：（a）使基底与悬浮在聚合物基体中的贵金属胶体的悬浮液接触以获得涂覆的基底; （b）任选地从所述涂覆的基底上除去至少部分或基本上全部的聚合物基质; （c）用主要金属涂层的溶液电解涂覆在步骤（a）或（b）之后获得的基材。选择聚合物基体与贵金属涂层或主要金属的金属或两者结合。在使基材与悬浮液接触之前，可以将其与将与贵金属或主要金属或两者结合的调理剂接触以获得调理的基材。然后将经调理的基底与悬浮液接触。可以除去足够量的聚合物基质，使得聚合物基质的残余物将与主要金属组合，并且主要金属涂层的外表面将基本上不含聚合物基质。

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