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1. 发明授权

US5183552A Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces 失效
标题翻译：非导体表面的金属化工艺，特别是在具有预先存在的铜表面的电路板上
公开(公告)号：US5183552A
公开(公告)日：1993-02-02
申请号：US655789
申请日：1991-02-14
申请人： Burkhard Bressel , Heinrich Meyer , Walter Meyer , Klaus Gedrat
发明人： Burkhard Bressel , Heinrich Meyer , Walter Meyer , Klaus Gedrat
IPC分类号： C08G61/12 , C25D5/56 , H05K3/18
CPC分类号： H05K3/188 , C08G61/123 , C25D5/56 , H05K2201/0329 , H05K2203/0796 , Y10S205/92
摘要： The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.
摘要翻译：用于直接金属化具有非导体表面的电路板的方法包括使非导体表面与碱性高锰酸盐溶液反应以形成化学吸附在非导体表面上的二氧化锰; 形成具有酸解离常数的弱酸的水溶液，水溶液中的质子损失为0.1〜0.01，以及吡咯或吡咯衍生物及其可溶性低聚物; 使含有吡咯单体及其低聚物的水溶液与其上具有化学吸附的二氧化锰的非导体表面接触，以在非导体表面上沉积粘附的导电不溶性聚合物产物; 并在其上形成有不溶性粘附聚合物产物的非导体表面上直接电沉积金属。低聚物有利地在室温至溶液凝固点之间的温度下形成含有0.1至200g / l吡咯单体的水溶液。

2. 发明授权

US5112513A Solution and process for etching and activating surfaces of a nonconductive substrate 失效
标题翻译：用于蚀刻和激活非导电基板的表面的方法和方法
公开(公告)号：US5112513A
公开(公告)日：1992-05-12
申请号：US349700
申请日：1989-05-10
申请人： Burkhard Bressel , Hans-Joachim Grapentin , Detlef Tessmann
发明人： Burkhard Bressel , Hans-Joachim Grapentin , Detlef Tessmann
IPC分类号： C23C18/22 , C23C18/28 , C23C18/30 , H05K3/38
CPC分类号： H05K3/381 , C23C18/28
摘要： An aqueous solution for etching and activating a surface of a nonconductive substrate for subsequent chemical and, if necessary, electrochemical deposition of a metal coating containing both an activator and an etching agent. The activator is a salt or complex compound containing a metal selected from group Ib or group VIII of the periodic table. The etching agent is manganate or permanganate ion. This solution can be used in a shortened process for metallizing isolated surfaces, especially as a part of a process for making electrical connecting elements and circuit boards.
摘要翻译：一种水溶液，用于蚀刻和活化非导电基材的表面，用于随后的化学和必要时电化学沉积含有活化剂和蚀刻剂的金属涂层。活化剂是含有选自周期表第Ib族或第VIII族金属的盐或络合物。蚀刻剂是锰酸盐或高锰酸盐离子。该解决方案可用于金属化隔离表面的缩短工艺，特别是作为制造电连接元件和电路板的工艺的一部分。

3. 发明授权

US5693209A Process for metallization of a nonconductor surface 失效
标题翻译：非导体表面的金属化工艺
公开(公告)号：US5693209A
公开(公告)日：1997-12-02
申请号：US518575
申请日：1995-08-23
申请人： Burkhard Bressel , Heinrich Meyer , Walter Meyer , Klaus Gedrat
发明人： Burkhard Bressel , Heinrich Meyer , Walter Meyer , Klaus Gedrat
IPC分类号： C08G61/12 , C25D5/56 , H05K3/18
CPC分类号： H05K3/188 , C08G61/123 , C25D5/56 , H05K2203/0796 , Y10S205/92
摘要： The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.
摘要翻译：用于直接金属化具有非导体表面的电路板的方法包括使非导体表面与碱性高锰酸盐溶液反应以形成化学吸附在非导体表面上的二氧化锰; 形成弱酸和吡咯或吡咯衍生物及其可溶性低聚物的水溶液; 使含有吡咯单体及其低聚物的水溶液与其上具有化学吸附的二氧化锰的非导体表面接触，以在非导体表面上沉积粘附的导电不溶性聚合物产物; 并在其上形成有不溶性粘附聚合物产物的非导体表面上直接电沉积金属。低聚物有利地在室温至溶液凝固点之间的温度下形成含有0.1至200g / l吡咯单体的水溶液。

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