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    • 3. 发明授权
    • Electronic part test apparatus
    • 电子零件测试仪器
    • US07298156B2
    • 2007-11-20
    • US10505959
    • 2002-12-03
    • Hiroshi OkudaToshiyuki KiyokawaHaruki Nakajima
    • Hiroshi OkudaToshiyuki KiyokawaHaruki Nakajima
    • G01R31/26G01R31/02
    • G01R31/01G01R31/2851G01R31/2886G01R31/2887G01R31/2893
    • A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.
    • 用于保持待测试的IC的保持侧接触臂(317)位于对准装置(320)的对准CCD照相机(326)的光轴(OP)上,待测试的IC被插入到第一 形成在对准可动部(321)上的开口(321a)和保持侧接触臂(317)的接触部件(317d)与对准可动部(321)接触。 然后,通过摄像机(326)拍摄图像并进行图像处理来计算用于校正待测试IC的位置的对准量。 设置到第一接触臂(315a,1N)的无锁装置(318)被制成处于非限制状态,可动部分驱动装置(322)被驱动为基于 并且与对准可动部(321)接触的保持侧接触臂(317)相对于根侧接触臂(316)移动,从而进行被测试IC的位置的对准 。
    • 5. 发明申请
    • Electronic part test apparatus
    • 电子零件测试仪器
    • US20050151551A1
    • 2005-07-14
    • US10505959
    • 2002-12-03
    • Hiroshi OkudaToshiyuki KiyokawaHaruki Nakajima
    • Hiroshi OkudaToshiyuki KiyokawaHaruki Nakajima
    • G01R31/26G01R31/01H01L21/66G01R31/02
    • G01R31/01G01R31/2851G01R31/2886G01R31/2887G01R31/2893
    • A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.
    • 用于保持待测试的IC的保持侧接触臂(317)位于对准装置(320)的对准CCD照相机(326)的光轴(OP)上,待测试的IC被插入到第一 形成在对准可动部(321)上的开口(321a)和保持侧接触臂(317)的接触部件(317d)与对准可动部(321)接触。 然后,通过摄像机(326)拍摄图像并进行图像处理来计算用于校正待测试IC的位置的对准量。 设置到第一接触臂(315a,1N)的无锁装置(318)被制成处于非限制状态,可动部分驱动装置(322)被驱动为基于 并且与对准可动部(321)接触的保持侧接触臂(317)相对于根侧接触臂(316)移动,从而进行被测试IC的位置的对准 。