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    • 2. 发明授权
    • Test handler having turn table
    • 测试处理机具有转台
    • US5894217A
    • 1999-04-13
    • US635411
    • 1996-04-26
    • Noriyuki IgarashiKenpei Suzuki
    • Noriyuki IgarashiKenpei Suzuki
    • G01R31/26G01R1/04G01R31/28G01R31/02
    • G01R1/0408G01R31/2851G01R31/2893G01R31/2887
    • A test handler decreases an index time in testing IC devices and improves a positioning accuracy for placing the IC devices on a test position of an IC tester. The test handler includes a turn table having a plurality of openings each of which is equally distanced from the other, and at least one of the openings is positioned right above a test socket provided on the IC tester, a plurality of carrier modules attached to the corresponding openings of the turn table where each of the carrier modules has a center opening to receive an IC device to be tested, and a press mechanism provided above the test socket of the IC tester to press the IC device in the carrier module downward so that pins of the IC device contact the test socket. The center opening of the carrier module has tapered walls at the periphery thereof where an upper portion of the center opening is wider than a lower portion of the center opening, and a plurality of guide slits are provided on the tapered walls of the center opening for guiding the pins of the IC device therethrough when the IC device is pressed by the press mechanism.
    • 测试处理器降低了测试IC器件的索引时间,并提高了将IC器件放置在IC测试仪的测试位置的定位精度。 测试处理器包括具有多个开口的转台,每个开口彼此相距离,并且至少一个开口位于设置在IC测试器上的测试插座的正上方,多个载体模块附接到 转台的对应开口,其中每个托架模块具有用于接收要测试的IC装置的中心开口,以及设置在IC测试器的测试插座上方的按压机构,以向下按压载体模块中的IC装置,使得 IC器件的引脚接触测试插座。 载体模块的中心开口在其周边处具有锥形壁,其中心开口的上部比中心开口的下部宽,并且在中心开口的锥形壁上设置有多个引导狭缝, 当IC器件被按压机构按压时,引导IC器件的引脚穿过其中。
    • 3. 发明授权
    • Transport mechanism for IC handlers
    • IC处理程序的运输机制
    • US5469953A
    • 1995-11-28
    • US197190
    • 1994-02-16
    • Noriyuki IgarashiKeiichi Fukumoto
    • Noriyuki IgarashiKeiichi Fukumoto
    • B25J15/06G01R31/26H01L21/677H05K13/04B65G47/00
    • H05K13/0408
    • transport mechanism for integrated circuit (IC) handlers with four transport stations spaced 90.degree. apart on one circumference are supported by a cross-shaped contact arm, and below the circumference, contact-in, contact or test and contact-out stages are provided at intervals of 90.degree.. Each transport station has a vertically movable air chuck unit and an air chuck driving mechanism for driving the air chuck unit vertically and holding by suction and releasing devices under test. The transport station that has reached a predetermined position above the contact-in stage presses the air chuck unit down with the air chuck driving mechanism and suck and lifts the devices to be tested off the contact-in stage. In parallel with the operation at the contact-in stage, the transport station, staying above the contact or test stage, lowers the air chuck unit which holds devices to be tested and fixes them onto the contact or test stage to start testing them, and the transport station above the contact-out stage lowers the air chuck unit holding tested devices and releases them onto the contact-out stage, thereafter raising the empty air chuck unit. Each time the contact arm is turned 90.degree., these operations are repeated.
    • 具有在一个圆周上间隔90度的四个运输站的集成电路(IC)处理器的传送机构由十字形接触臂支撑,并且在圆周下方,提供接触,接触或测试和接触阶段 间隔90度。 每个运送站具有垂直移动的空气卡盘单元和用于垂直驱动空气卡盘单元并通过被测试的抽吸和释放装置保持的空气卡盘驱动机构。 已经到达接触阶段以上的预定位置的运送站用空气卡盘驱动机构向下压空气卡盘单元,并将待测试的装置从接合阶段抽吸。 与接触阶段的操作并行,运输站停留在接触或测试阶段以上,降低了保持要测试设备的空气卡盘单元,并将其固定在接触或测试台上以开始测试, 接触台以上的运送站降低了保持测试装置的空气卡盘单元并将其释放到接触阶段,然后升高空气卡盘单元。 每当接触臂转90°时,重复这些操作。
    • 4. 发明授权
    • IC test equipment
    • IC测试设备
    • US4691831A
    • 1987-09-08
    • US747560
    • 1985-06-21
    • Kempei SuzukiYushi IwanagaHiroshi SatoKohei SatoNoriyuki IgarashiShinichi Koya
    • Kempei SuzukiYushi IwanagaHiroshi SatoKohei SatoNoriyuki IgarashiShinichi Koya
    • G01R31/28H01L21/00B07C5/344
    • H01L21/67271G01R31/2851G01R31/2893
    • An IC element supplied to a testing station is guided by a rail and a guide member to move by its own weight. At least one of the rail and guide member has built therein plate-shaped ceramic heater or plate-shaped silicone rubber heater. The guide member urges the IC element against the rail to heat the IC element. An auxiliary stopper is provided opposite but aslant to the IC element sliding surface of the rail. The IC element moving on the rail is yieldingly urged by the auxiliary stopper against the sliding surface of the rail, braked and engages an engaging piece at the lower end of the auxiliary stopper. The IC element is disengaged from the engaging piece to slightly move and stopped by a main stopper, where the IC element is tested. A plurality of such testing passages are provided, and IC elements simultaneously tested in the testing passage are fed to discharge rails respectively corresponding thereto. A plurality of sorting rails are provided in a manner to be movable in the direction of arrangement of the discharge rails, and the spacing of the discharge rails and the spacing of the sorting rails are selected equal to each other so that the IC elements on the discharge rails are simultaneously transferred to the sorting rails. The sorting rails move in a direction in which a plurality of receiving passages of an unloader are arranged at intervals different from those of the sorting rails. One of the sorting rails is selectively connected to one of the receiving passages according to the test results, feeding the IC element on the rail to the unloader.
    • 提供给测试台的IC元件由轨道和引导构件引导,以通过其自重移动。 轨道和导向件中的至少一个内置有板状陶瓷加热器或板状硅橡胶加热器。 引导构件将IC元件推靠在导轨上以加热IC元件。 辅助止动件与轨道的IC元件滑动表面相对地设置成倾斜的。 在轨道上移动的IC元件被辅助挡块抵靠着轨道的滑动表面有力地推动,制动并与辅助挡块的下端处的接合件接合。 IC元件从接合件脱离,以便通过测试IC元件的主挡块稍微移动和停止。 提供多个这样的测试通道,并且在测试通道中同时测试的IC元件被馈送到分别对应于其的排出轨道。 以排列轨道的排列方向可移动的方式设置多个分拣轨道,并且排出轨道的间隔和分拣轨道的间隔被选择为彼此相等,使得IC元件 排放轨道同时传送到分拣轨道。 分拣轨道沿着与分拣轨道的间隔不同的方式配置卸载机的多个接收通道的方向。 根据测试结果,其中一个分拣轨道选择性地连接到一个接收通道,将该导轨上的IC元件馈送到卸载机。
    • 8. 发明授权
    • Spacing frame structure for IC handler
    • IC处理程序的间隔框架结构
    • US5528160A
    • 1996-06-18
    • US296227
    • 1994-08-25
    • Keiichi FukumotoNoriyuki Igarashi
    • Keiichi FukumotoNoriyuki Igarashi
    • G01R31/26G01R1/073H01L21/66G01R31/02
    • G01R1/07314G01R31/2893
    • An improved structure for a spacing frame for interfacing a test head of an IC tester and an IC handler wherein the spacing frame can be changed in a short period of time without moving the test head of the IC tester or the IC handler. The spacing frame and the temperature chamber provide a unique structure which is capable of inserting and replacing the spacing frame within a vertical space in the chamber and locking the spacing frame in the predetermined position in the chamber. The spacing frame structure includes a spacing frame body to interface the IC handler and the IC tester which has a socket guide at its top which is horizontally extended from the body and a flange at its middle portion, a temperature chamber having an opening for receiving said spacing frame body therein, a performance board connected to a bottom of the spacing frame body for providing electric signals from the IC device to be tested to the IC tester, an IC socket for receiving the IC device to be tested therein, and a locking mechanism to provide a vertical movement to the spacing frame body such that the spacing frame body is free when it is in an upper position and is locked when it is in a lower position.
    • 用于连接IC测试仪的测试头和IC处理器的间隔框架的改进结构,其中间隔框架可以在短时间内改变,而不移动IC测试仪或IC处理器的测试头。 间隔框架和温度室提供了独特的结构,其能够插入和更换腔室中的垂直空间内的间隔框架,并将间隔框架锁定在腔室中的预定位置。 间隔框架结构包括间隔框架主体,用于连接IC处理器和IC测试器,IC测试器在其顶部具有水平延伸的插座引导件和在其中间部分处的凸缘,温度室具有用于接收所述 间隔框架主体,连接到间隔框体的底部的性能板,用于从IC测试仪提供待测试的IC装置的电信号; IC卡插座,用于接收要测试的IC器件;以及锁定机构 以向间隔框架体提供垂直运动,使得间隔框架主体在其处于上部位置时是自由的,并且当其处于较低位置时被锁定。