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1. 发明申请

US20120097986A1 WAFER LEVEL REFLECTOR FOR LED PACKAGING 有权
标题翻译： LED包装用水平反射器
公开(公告)号：US20120097986A1
公开(公告)日：2012-04-26
申请号：US12910363
申请日：2010-10-22
申请人： Hao-Wei KU , Chung Yu WANG , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人： Hao-Wei KU , Chung Yu WANG , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号： H01L33/60 , H01L21/56
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译：通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

2. 发明授权

US08486724B2 Wafer level reflector for LED packaging 有权
标题翻译：晶圆级反射器用于LED封装
公开(公告)号：US08486724B2
公开(公告)日：2013-07-16
申请号：US12910363
申请日：2010-10-22
申请人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号： H01L21/00
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译：通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

3. 发明授权

US08497519B2 Batwing LED with remote phosphor configuration 有权
标题翻译：蝙蝠LED与远程荧光粉配置
公开(公告)号：US08497519B2
公开(公告)日：2013-07-30
申请号：US13114730
申请日：2011-05-24
申请人： Ching-Yi Chen , Yu-Sheng Tang , Hao-Yu Yang , Hsin-Hung Chen , Tzu-Wen Shih
发明人： Ching-Yi Chen , Yu-Sheng Tang , Hao-Yu Yang , Hsin-Hung Chen , Tzu-Wen Shih
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , F21K9/64 , F21V13/02 , F21V13/14 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2924/00 , H01L2924/00012
摘要： An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.
摘要翻译： LED发射器使用具有嵌入在周向沟槽中的磷光体材料的模制透镜来产生蝙蝠光束图案。在将透镜模制在其上具有连接的LED管的封装衬底上之后，将荧光体材料模制，注入或分配到周向沟槽中。模制的透镜被成形为使得由一个或多个LED管芯发射的大部分光被顶表面反射通过荧光体材料的侧表面。

4. 发明授权

US08759854B2 Bat-wing lens design with multi-die 有权
标题翻译：蝙蝠翼透镜设计与多模
公开(公告)号：US08759854B2
公开(公告)日：2014-06-24
申请号：US13114787
申请日：2011-05-24
申请人： Ching-Yi Chen , Hao-Yu Yang
发明人： Ching-Yi Chen , Hao-Yu Yang
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L25/0753 , H01L33/005 , H01L33/54 , H01L2224/48091 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2933/005 , H01L2924/00 , H01L2924/00012
摘要： A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.
摘要翻译：蝙蝠横梁是由封装基板上的多个LED管芯上的具有主要LED透镜的光发射器产生的。 LED透镜包括通过围绕光发射器的中心的抛物线弧的端部旋转抛物线形成的蝙蝠wing表面。每个LED管芯的中心围绕其圆弧形成蝙蝠翼表面的抛物线的焦点安装到封装基板，例如，距抛物线顶点的焦距的约0.5至1.5。蝙蝠槌表面通过全内反射（TIR）或通过反射性凝胶涂层反射来自LED管芯数量的光。

5. 发明授权

US08552456B1 Light-emitting diode packaging structure of low angular correlated color temperature deviation 有权
标题翻译：发光二极管封装结构的低角度相关色温偏差
公开(公告)号：US08552456B1
公开(公告)日：2013-10-08
申请号：US13491255
申请日：2012-06-07
申请人： Ching-Cherng Sun , Ching-Yi Chen , Chih-Yu Chiu
发明人： Ching-Cherng Sun , Ching-Yi Chen , Chih-Yu Chiu
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode (LED) packaging structure having low angular correlated color temperature deviation includes: a substrate, a LED chip, a phosphor body, and a transparent lens. The LED chip is disposed on the substrate, and the phosphor body includes a hemisphere body and an extension part extended from the bottom of the hemisphere body. The phosphor body is disposed on the substrate and covers the LED chip. Besides, the transparent lens is disposed outside the phosphor body to cover the phosphor body to increase light extraction efficiency. With the implementation of the present invention, the setup of the extension part makes a longer vertical distance between the LED chip and the top of the phosphor body, so that the light in the normal direction of the LED chip can have a longer optical length, thereby to reduce the angular correlated color temperature deviation.
摘要翻译：具有低角度相关色温偏差的发光二极管（LED）封装结构包括：基板，LED芯片，荧光体和透明透镜。 LED芯片设置在基板上，荧光体包括半球体和从半球体的底部延伸的延伸部。荧光体设置在基板上并覆盖LED芯片。此外，透明透镜设置在荧光体的外侧，以覆盖荧光体以提高光提取效率。通过本发明的实现，扩展部的设置使得LED芯片和荧光体的顶部之间的垂直距离更长，使得LED芯片的法线方向的光可以具有更长的光学长度，从而减小角度相关色温偏差。

6. 发明申请

US20130069522A1 WAY OF REDUCING LED'S COLOR TEMPERATURE AND COLOR COORDINATES DRIFTING 审中-公开
标题翻译：降低LED颜色温度和颜色坐标的方法
公开(公告)号：US20130069522A1
公开(公告)日：2013-03-21
申请号：US13233779
申请日：2011-09-15
申请人： Ching-Cherng Sun , Ching-Yi Chen , Hsin-Mei Wu , Cheng-Chien Chen
发明人： Ching-Cherng Sun , Ching-Yi Chen , Hsin-Mei Wu , Cheng-Chien Chen
IPC分类号： H01J1/63
CPC分类号： H01L33/502
摘要： The present invention relates to a way of reducing LED's color temperature and color coordinates drifting, more particularly to a phosphor-converted LED with blue ray light emitting body so that the influence of LED's heat dissipation on color performance can be minimized.
摘要翻译：本发明涉及一种降低LED的色温和色坐标偏移的方法，更具体地说，涉及一种具有蓝光发射体的磷光体转换的LED，从而可以使LED的散热对颜色性能的影响最小化。

7. 发明申请

US20110027955A1 Source/Drain Carbon Implant and RTA Anneal, Pre-SiGe Deposition 有权
标题翻译：来源/排水碳植入物和RTA退火，前SiGe沉积
公开(公告)号：US20110027955A1
公开(公告)日：2011-02-03
申请号：US12904878
申请日：2010-10-14
申请人： Wei-Yen Woon , Chun-Feng Nieh , Ching-Yi Chen , Hsun Chang , Chung-Ru Yang , Li-Te S. Lin
发明人： Wei-Yen Woon , Chun-Feng Nieh , Ching-Yi Chen , Hsun Chang , Chung-Ru Yang , Li-Te S. Lin
IPC分类号： H01L21/336
CPC分类号： H01L21/26586 , H01L21/26506 , H01L29/165 , H01L29/6653 , H01L29/66636 , H01L29/7848
摘要： A semiconductor device system, structure, and method of manufacture of a source/drain to retard dopant out-diffusion from a stressor are disclosed. An illustrative embodiment comprises a semiconductor substrate, device, and method to retard sidewall dopant out-diffusion in source/drain regions. A semiconductor substrate is provided with a gate structure, and a source and drain on opposing sides of the gate structure. Recessed regions are etched in a portion of the source and drain. Doped stressors are embedded into the recessed regions. A barrier dopant is incorporated into a remaining portion of the source and drain.
摘要翻译：公开了一种半导体器件系统，结构和制造源极/漏极的方法，以阻止掺杂剂从胁迫源向外扩散。示例性实施例包括半导体衬底，器件和方法，用于延迟源极/漏极区域中的侧向掺杂剂扩散。半导体衬底设置有栅极结构，栅极结构的相对侧上具有源极和漏极。在源极和漏极的一部分中蚀刻凹入的区域。掺杂的应激物嵌入到凹陷区域中。势垒掺杂剂掺入源极和漏极的剩余部分中。

8. 发明申请

US20100257467A1 REAL-TIME INSTRUCTION DEVICE 审中-公开
标题翻译：实时指令设备
公开(公告)号：US20100257467A1
公开(公告)日：2010-10-07
申请号：US12631472
申请日：2009-12-04
申请人： Chia-Lin Lu , Ya-Pei Chen , Tzu-Yin Lu , Shu-Ching Wang , Ho-Yun Shih , Huei-Chuan Cho , Ching-Yi Chen , Hsueh-Ping Yu , Tzu-Hui Wu , Ping-Kuang Tsai , Yi-Chuan Fang
发明人： Chia-Lin Lu , Ya-Pei Chen , Tzu-Yin Lu , Shu-Ching Wang , Ho-Yun Shih , Huei-Chuan Cho , Ching-Yi Chen , Hsueh-Ping Yu , Tzu-Hui Wu , Ping-Kuang Tsai , Yi-Chuan Fang
IPC分类号： G06F3/048 , G06F3/01
CPC分类号： G06F3/0483 , G09B5/06
摘要： A real-time instruction device in accordance with the present invention comprises a database, a selecting module and a GUI. The database comprises at least multiple classifications and multiple Flash components corresponding to the classifications. The selecting interface allows a teacher to select a classification from the database. The GUI virtually simulates a white board that allows the teacher to dynamically drag a selected Flash component for real-time instruction with boundless space for teaching.
摘要翻译：根据本发明的实时指令装置包括数据库，选择模块和GUI。数据库至少包含多个分类和与分类对应的多个Flash组件。选择界面允许教师从数据库中选择分类。 GUI实际上模拟了一个白板，允许老师动态地拖动一个选定的Flash组件进行实时教学，无限空间进行教学。

9. 发明申请

US20080251497A1 Method of fabricating hollow waveguide having cyclic geometric structure 有权
标题翻译：制造具有循环几何结构的中空波导的方法
公开(公告)号：US20080251497A1
公开(公告)日：2008-10-16
申请号：US11808134
申请日：2007-06-06
申请人： Chii-Chang Chen , Ya-Lun Tsai , Ching-Yi Chen , Jenq-Yang Chang
发明人： Chii-Chang Chen , Ya-Lun Tsai , Ching-Yi Chen , Jenq-Yang Chang
IPC分类号： B29D11/00
CPC分类号： B29D11/00663 , G02B6/00
摘要： A waveguide has a hollow center. The waveguide has dielectric tubes which have a geometric arrangement, like a triangle-lattice arrangement. A laser transmitted in the waveguide is confined and is emitted out with a narrow expending angle. Hence, the laser is emitted straightly forwarded and has a low power loss. The present invention is suitable for using in a high-power laser and obtaining a directive microwave.
摘要翻译：波导具有中空的中心。波导具有具有几何布置的电介质管，如三角形 - 格子布置。在波导中传输的激光器被限制并以窄的扩展角度发射出去。因此，激光被直接发射并具有低功率损耗。本发明适用于大功率激光器和获得微波指令。

10. 发明授权

US07121443B2 Electric nailing apparatus 失效
标题翻译：电动打钉机
公开(公告)号：US07121443B2
公开(公告)日：2006-10-17
申请号：US11070861
申请日：2005-03-02
申请人： Pei-Li Sun , Ching-Yi Chen
发明人： Pei-Li Sun , Ching-Yi Chen
IPC分类号： B25C1/06
CPC分类号： B25C1/06
摘要： An electric nailing apparatus includes a triggering member, a rotatable rod member including first and second sustaining structures, a transmission rod having a first protrusion structure, a motor member and a ram block sustained against a fixture element via a resilience element. In response to a rotation of a gear member, the ram block glides to compress the resilience element and then touch the first protrusion structure. In response to an external force, the triggering member moves to have the first sustaining structure touch a first switch device to start the motor member. After the ram block touches the first protrusion structure, the second sustaining structure is simultaneously stirred by the transmission rod to have the first sustaining structure detached from the first switch device, thereby stopping the motor member and providing a nailing energy to the ram block in response to a recovery force of the resilience element.
摘要翻译：电动打钉装置包括触发构件，包括第一和第二维持结构的可旋转杆构件，具有第一突出结构的传动杆，马达构件和通过弹性元件抵靠固定件的冲头块。响应于齿轮构件的旋转，压头块滑动以压缩弹性元件，然后接触第一突起结构。响应于外力，触发构件移动以使第一维持结构接触第一开关装置以起动电动机构件。在压头块接触第一突起结构之后，第二维持结构被传动杆同时搅动以使第一维持结构与第一开关装置分离，从而停止电动机构件并响应于冲压块提供钉扎能量到弹性元件的恢复力。

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