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1. 发明授权

US08900893B2 Vertical LED chip package on TSV carrier 有权
标题翻译：垂直LED芯片封装在TSV载体上
公开(公告)号：US08900893B2
公开(公告)日：2014-12-02
申请号：US12704381
申请日：2010-02-11
申请人： Chung Yu Wang
发明人： Chung Yu Wang
IPC分类号： H01L29/72 , H01L33/62 , H01L23/00 , H01L33/00 , H01L33/54 , H01L23/48
CPC分类号： H01L33/647 , H01L23/481 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L24/94 , H01L24/97 , H01L27/15 , H01L33/0025 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2224/83815 , H01L2224/83895 , H01L2224/92247 , H01L2224/94 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01026 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2933/0066 , H01L2924/00014 , H01L2924/0781 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of forming a light-emitting device (LED) package component includes providing a substrate; forming an LED on the substrate; and lifting the LED off the substrate. A carrier wafer is provided, which includes a through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. The LED is bonded onto the carrier wafer, with the LED electrically connected to the TSV.
摘要翻译：一种形成发光器件（LED）封装部件的方法包括提供衬底; 在基板上形成LED; 并将LED从基板上提起。提供了载体晶片，其包括被构造成电连接载体晶片的相对侧上的特征的贯通基板通孔（TSV）。 LED结合到载体晶片上，LED与TSV电连接。

2. 发明授权

US08772929B2 Package for three dimensional integrated circuit 有权
标题翻译：三维集成电路封装
公开(公告)号：US08772929B2
公开(公告)日：2014-07-08
申请号：US13297992
申请日：2011-11-16
申请人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/563 , H01L21/561 , H01L21/78 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/131 , H01L2224/16225 , H01L2224/17181 , H01L2224/26145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83104 , H01L2224/9202 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2224/81 , H01L2224/32225 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2924/014 , H01L2924/0665
摘要： A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.
摘要翻译：晶片级封装包括结合在支撑晶片上的半导体管芯。半导体管芯在其衬底上至少有一个台阶凹槽。在半导体管芯和支撑晶片之间形成底部填充层。此外，底部填充层的高度受到台阶凹槽的限制。在晶片级封装的制造过程中，台阶凹槽有助于减小晶片级封装上的应力。

3. 发明授权

US08492263B2 Protected solder ball joints in wafer level chip-scale packaging 有权
公开(公告)号：US08492263B2
公开(公告)日：2013-07-23
申请号：US11941429
申请日：2007-11-16
申请人： Chung Yu Wang , Chien-Hsiun Lee , Pei-Haw Tsao , Kuo-Chin Chang , Chung-Yi Lin , Bill Kiang
发明人： Chung Yu Wang , Chien-Hsiun Lee , Pei-Haw Tsao , Kuo-Chin Chang , Chung-Yi Lin , Bill Kiang
IPC分类号： H01L21/44
CPC分类号： H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L2224/0231 , H01L2224/02313 , H01L2224/0401 , H01L2224/04042 , H01L2224/05008 , H01L2224/05569 , H01L2224/05571 , H01L2224/056 , H01L2224/05647 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/1148 , H01L2224/11901 , H01L2224/13005 , H01L2224/13022 , H01L2224/13023 , H01L2224/13027 , H01L2224/131 , H01L2224/16 , H01L2224/45144 , H01L2224/48647 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/207 , H01L2224/13099 , H01L2924/00 , H01L2224/05552
摘要： Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.

4. 发明申请

US20120225509A1 LED Flip-Chip Package Structure with Dummy Bumps 有权
标题翻译： LED倒装芯片封装结构，带有虚拟冲击
公开(公告)号：US20120225509A1
公开(公告)日：2012-09-06
申请号：US13474282
申请日：2012-05-17
申请人： Chung Yu Wang
发明人： Chung Yu Wang
IPC分类号： H01L33/58 , H01L33/08
CPC分类号： H01L33/62 , H01L24/17 , H01L33/486 , H01L33/54 , H01L33/642 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.
摘要翻译：发光器件（LED）封装部件包括具有第一有源接合焊盘和第二有源接合焊盘的LED芯片。载体芯片通过倒装芯片接合结合到LED芯片上。载体芯片包括分别连接到第一和第二有源接合焊盘的第一有源通过衬底通孔（TSV）和第二有源TSV。载体芯片还包括其中的虚拟TSV，其电耦合到第一有源接合焊盘，并且被配置为在电流流过LED芯片时不导通任何电流。

5. 发明授权

US08183579B2 LED flip-chip package structure with dummy bumps 有权
标题翻译： LED倒装芯片封装结构，带虚拟凸块
公开(公告)号：US08183579B2
公开(公告)日：2012-05-22
申请号：US12715838
申请日：2010-03-02
申请人： Chung Yu Wang
发明人： Chung Yu Wang
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L24/17 , H01L33/486 , H01L33/54 , H01L33/642 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.
摘要翻译：发光器件（LED）封装部件包括具有第一有源接合焊盘和第二有源接合焊盘的LED芯片。载体芯片通过倒装芯片接合结合到LED芯片上。载体芯片包括分别连接到第一和第二有源接合焊盘的第一有源通过衬底通孔（TSV）和第二有源TSV。载体芯片还包括其中的虚拟TSV，其电耦合到第一有源接合焊盘，并且被配置为在电流流过LED芯片时不导通任何电流。

6. 发明申请

US20110317409A1 Structure of lighting device 审中-公开
标题翻译：照明装置结构
公开(公告)号：US20110317409A1
公开(公告)日：2011-12-29
申请号：US12801729
申请日：2010-06-23
申请人： Chih-Hsien Wu , Chung-Yu Wang , Meng-Chieh Chou
发明人： Chih-Hsien Wu , Chung-Yu Wang , Meng-Chieh Chou
IPC分类号： F21V29/00
CPC分类号： F21K9/27 , F21Y2103/10 , F21Y2115/10
摘要： A structure of lighting device includes a heat dissipater having opposite edges respectively forming a guide slot and a groove. A substrate board has an edge received and retained in the guide slot and an opposite edge forming a mounting hole. A fastener is received through the mounting hole to tightly engage the groove so as to fix the substrate board to the heat dissipater. No pre-machining of thread tapping is needed to form inner-threaded holes first. The structure of lighting device offers advantages in respect of simple structural arrangement, efficient manufacturing and production, reduced labor and material used, and lowering of costs.
摘要翻译：照明装置的结构包括具有分别形成引导槽和凹槽的相对边缘的散热器。基板具有接收并保持在引导槽中的边缘和形成安装孔的相对边缘。紧固件通过安装孔被接收以紧密地接合槽，以将基板固定到散热器上。首先需要进行螺纹孔的预加工，以形成内螺纹孔。照明装置的结构在简单的结构布置，高效的制造和生产，减少劳动力和使用的材料以及降低成本方面提供了优点。

7. 发明申请

US20110230043A1 TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING 有权
标题翻译：后退磨砂后的带状残留无刷区域
公开(公告)号：US20110230043A1
公开(公告)日：2011-09-22
申请号：US12726317
申请日：2010-03-17
申请人： Chung Yu WANG , Jiann-Jong WANG
发明人： Chung Yu WANG , Jiann-Jong WANG
IPC分类号： H01L21/60
CPC分类号： H01L21/6836 , H01L23/3114 , H01L24/13 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/0401 , H01L2224/05624 , H01L2224/05655 , H01L2224/0568 , H01L2224/1132 , H01L2224/1146 , H01L2224/11849 , H01L2224/13099 , H01L2224/13111 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer.
摘要翻译：有机胶带通常用于在凸块形成后的晶片加工过程中固定和保护凸块。虽然残留的有机粘合带可能在胶带去层压之后残留在晶片上，但是在层压胶带之前在凸块上施加凸块模板层可以使之后去除任何残留物，并产生无残留的晶片。

8. 发明申请

US20110215361A1 Thermally-Enhanced Hybrid LED Package Components 有权
标题翻译：热增强型混合LED封装组件
公开(公告)号：US20110215361A1
公开(公告)日：2011-09-08
申请号：US12715872
申请日：2010-03-02
申请人： Chung Yu Wang
发明人： Chung Yu Wang
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48464 , H01L2224/49107 , H01L2224/73265 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads.
摘要翻译：发光器件（LED）封装部件包括LED芯片和载体芯片。载体芯片包括在载体芯片的表面上的第一接合焊盘和第二接合焊盘，并通过倒装芯片接合结合到LED芯片上，以及在载体芯片的表面上的第三接合焊盘和第四接合焊盘，电连接到第一接合焊盘和第二接合焊盘。第一接合焊盘和第二接合焊盘位于与芯片相对的载体芯片的同一侧。载体芯片还包括连接到第一和第二接合焊盘的至少一个贯穿衬底通孔（TSV）。

9. 发明申请

US20110215354A1 Double Flip-Chip LED Package Components 有权
标题翻译：双倒装LED封装组件
公开(公告)号：US20110215354A1
公开(公告)日：2011-09-08
申请号：US12715795
申请日：2010-03-02
申请人： Chung Yu Wang
发明人： Chung Yu Wang
IPC分类号： H01L33/58
CPC分类号： H01L33/58 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/8592 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a fourth bond pad on the surface of the carrier chip and electrically connected to the first and the second bond pads, respectively. The first, the second, the third, and the fourth bond pads are on a same surface of the carrier chip. The LED package component further includes a first and a second metal bump bonding the first and the second bond pads, respectively, onto the LED chip through flip-chip bonding; and a window-type module substrate bonded onto the third and the fourth bond pads through flip-chip bonding. The window-type module substrate includes a window, with the LED chip configured to emit light toward the window.
摘要翻译：发光器件（LED）封装部件包括LED芯片和载体芯片。载体芯片包括在载体芯片的表面上的第一和第二接合焊盘; 以及在载体芯片的表面上分别电连接到第一和第二接合焊盘的第三和第四接合焊盘。第一，第二，第三和第四接合焊盘位于载体芯片的相同表面上。 LED封装部件还包括通过倒装芯片焊接将第一和第二接合焊盘分别结合到LED芯片上的第一和第二金属凸块; 以及通过倒装芯片接合键合到第三和第四接合焊盘上的窗型模块衬底。窗型模块基板包括窗口，其中LED芯片配置成向窗口发射光。

10. 发明申请

US20090130840A1 Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging 有权
标题翻译：晶圆级芯片级封装保护焊球接头
公开(公告)号：US20090130840A1
公开(公告)日：2009-05-21
申请号：US11941429
申请日：2007-11-16
申请人： Chung Yu Wang , Chien-Hsiun Lee , Pei-Haw Tsao , Kuo-Chin Chang , Chung-Yi Lin , Bill Kiang
发明人： Chung Yu Wang , Chien-Hsiun Lee , Pei-Haw Tsao , Kuo-Chin Chang , Chung-Yi Lin , Bill Kiang
IPC分类号： H01L21/441
CPC分类号： H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L2224/0231 , H01L2224/02313 , H01L2224/0401 , H01L2224/04042 , H01L2224/05008 , H01L2224/05569 , H01L2224/05571 , H01L2224/056 , H01L2224/05647 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/1148 , H01L2224/11901 , H01L2224/13005 , H01L2224/13022 , H01L2224/13023 , H01L2224/13027 , H01L2224/131 , H01L2224/16 , H01L2224/45144 , H01L2224/48647 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/207 , H01L2224/13099 , H01L2924/00 , H01L2224/05552
摘要： Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.
摘要翻译：公开了焊球接头的保护，其中焊球接头位于封装缓冲层的表面水平以下。蚀刻缓冲层以露出一个或多个电极柱，每个电极柱可以由单个柱或多个柱组成。由顶部导电盖或电极柱周围的镀层产生的顶层也位于缓冲层的下方。当焊球放置在柱上时，焊料/球窝接头被保护在缓冲层表面下方的位置，同时仍然保持各种焊球之间的电连接及其相关或封盖/电镀材料，电极柱，布线层和电路层。因此，保护整个球窝接头免受直接的压力。

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