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1. 发明授权

US07804165B2 Device comprising a sensor module 有权
标题翻译：装置包括传感器模块
公开(公告)号：US07804165B2
公开(公告)日：2010-09-28
申请号：US11913585
申请日：2006-04-27
申请人： Hans M. B. Boeve , Teunis J. Ikkink , Nicolaas J. A. Van Veen
发明人： Hans M. B. Boeve , Teunis J. Ikkink , Nicolaas J. A. Van Veen
IPC分类号： H01L23/12
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L2924/0002 , H01L2924/00
摘要： A device (1) comprising a sensor module (2) with a package (3) is produced at reduced costs by providing the package (3) with two or more substrates (4,5) each with a functional layer (14,15), at least one sensor (24,25) such as a magnetometer and/or an accelerometer being located in at least one functional layer (14,15), and by providing the package (3) with a system comprising solder bumps (7-12) for aligning the functional layers (14,15). The system either comprises a first number of solder bumps (7,8) for coupling the functional layers (14,15) electrically and mechanically to each other via first bonding elements (31) or comprises a third substrate (6) with a third functional layer (16) and a second number of solder bumps (9,10) for coupling the first and third functional layers (14,16) electrically and mechanically to each other via second bonding elements (32) and a third number of solder bumps (11,12) for coupling the second and third functional layers (15,16) electrically and mechanically to each other via third bonding elements (33). Mechanically and/or electrically dummy solder bumps improve the alignment of the functional layers (14,15).
摘要翻译：通过为封装（3）提供两个或多个具有功能层（14,15）的基板（4,5），以降低的成本制造包括具有封装（3）的传感器模块（2）的装置（1）至少一个传感器（24,25），例如磁力计和/或加速度计位于至少一个功能层（14,15）中，并且通过为包装（3）提供包括焊料凸块（7- 12），用于对准功能层（14,15）。该系统还包括第一数量的焊料凸块（7,8），用于通过第一接合元件（31）将功能层（14,15）电和机械地彼此耦合，或包括具有第三功能层层（16）和第二数量的焊料凸块（9,10），用于经由第二接合元件（32）和第三数量的焊料凸块（32）将第一和第三功能层（14,16）电和机械地彼此耦合 11,12），用于经由第三接合元件（33）将第二和第三功能层（15,16）电和机械地彼此耦合。机械和/或电虚拟焊料凸起改善了功能层（14,15）的对准。

2. 发明授权

US08237256B2 Integrated package 有权
标题翻译：集成包装
公开(公告)号：US08237256B2
公开(公告)日：2012-08-07
申请号：US12702041
申请日：2010-02-08
申请人： Fabrice Verjus , Jean-Marc Yan-Nou , David Chevrie , Francois LeCornec , Nicolaas J. A. Van Veen
发明人： Fabrice Verjus , Jean-Marc Yan-Nou , David Chevrie , Francois LeCornec , Nicolaas J. A. Van Veen
IPC分类号： H01L23/538
CPC分类号： H01L24/10 , H01L21/50 , H01L23/04 , H01L23/10 , H01L23/3114 , H01L23/315 , H01L24/13 , H01L24/48 , H01L25/165 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A device substrate has a device major surface, a semiconductor element on the device major surface, and electrically conductive device connectors extending across the device major surface. An interconnection substrate has an interconnection substrate having an interconnection major surface, the interconnection substrate defining at least one sealing recess recessed from the interconnection major surface, the sealing recess being surrounded by a sealing ring. The device substrate is mounted on the interconnection substrate with the interconnection major surface facing the device major surface, the sealing ring around the semiconductor element and with the device major surface sealed against the sealing ring so that the recess forms a sealed cavity containing the semiconductor element. Electrical interconnects extend across the interconnection major surface. Interconnection bumps are provided outside the sealing ring to electrically connect the device to the interconnect substrate.
摘要翻译：器件衬底具有器件主表面，器件主表面上的半导体元件和延伸穿过器件主表面的导电器件连接器。互连衬底具有互连主表面的互连衬底，所述互连衬底限定从互连主表面凹陷的至少一个密封凹槽，密封凹槽被密封环包围。器件基板安装在互连基板上，其互连主表面面向器件主表面，围绕半导体元件的密封环和器件主表面密封抵靠密封环，使得凹部形成包含半导体元件的密封腔。电互连延伸穿过互连主表面。互连凸块设置在密封环的外部，以将该装置电连接到互连基板。

3. 发明授权

US06337790B1 Thin-film capacitor 失效
标题翻译：薄膜电容器
公开(公告)号：US06337790B1
公开(公告)日：2002-01-08
申请号：US09385279
申请日：1999-08-30
申请人： Antonius J. M. Nellissen , Paul Van Oppen , Hans P. Lobl , Mareike K. Klee , Wilhelm A. Groen , Nicolaas J. A. Van Veen
发明人： Antonius J. M. Nellissen , Paul Van Oppen , Hans P. Lobl , Mareike K. Klee , Wilhelm A. Groen , Nicolaas J. A. Van Veen
IPC分类号： H01G4228
CPC分类号： H01G2/20 , H01G2/14
摘要： The present invention provides a new type of thin-film capacitor which is insensitive to breakdown voltages during its mounting on a printed circuit board. Said capacitor has an insulating substrate having at least two internal electrode layers which are mutually separated by means of a dielectric layer. The substrate also has two end contacts each of which are electroconductively connected to one of said internal electrode layers. According to the invention, the capacitor also has breakable electrically conductive means, preferably formed as a metal layer, which means are electrically connected to said end contacts. The presence of said breakable electrically conductive means between said end contacts prevents damage due to electrical storage which can arise during the mounting of the capacitor on a printed circuit board.
摘要翻译：本发明提供了一种新型薄膜电容器，其在其安装在印刷电路板上时对击穿电压不敏感。所述电容器具有绝缘基板，该绝缘基板具有至少两个通过介电层相互分离的内部电极层。基板还具有两个端部触头，每个触头都与所述内部电极层中的一个导电连接。根据本发明，电容器还具有可破坏的导电装置，优选地形成为金属层，该装置电连接到所述端触点。在所述端部触点之间存在所述可破坏的导电装置可以防止由于在将电容器安装在印刷电路板上时可能引起的电存储的损坏。

4. 发明授权

US5656339A Method of and arrangement for applying a fluid to a surface using a vibrating needle 失效
标题翻译：使用振动针将流体施加到表面的方法和布置
公开(公告)号：US5656339A
公开(公告)日：1997-08-12
申请号：US492830
申请日：1995-06-20
申请人： Wessel J. Wesseling , Nicolaas J. A. Van Veen
发明人： Wessel J. Wesseling , Nicolaas J. A. Van Veen
IPC分类号： B05C5/02 , B05C11/10 , B23K3/06 , H01L21/00 , B06B1/06
CPC分类号： H01L21/6715 , B05C11/10 , B05C5/02 , B23K3/0607
摘要： The invention relates to a method of applying a fluid (12) to a surface (13), the pressurised fluid being applied from a container (1) to the surface via a hollow needle (7). In order to preclude clogging of the needle the needle is subjected to a longitudinal vibration during the application of fluid. The invention also relates to an arrangement for carrying out the method, the arrangement comprising a vibration device (3), such as a piezoelectric transducer, which can be coupled to the needle (7) to set the needle into longitudinal vibration. The fluid may be, for example, a solder paste or an adhesive.
摘要翻译：本发明涉及一种将流体（12）施加到表面（13）的方法，所述加压流体通过中空针（7）从容器（1）施加到表面。为了防止针头的堵塞，在施加流体期间针头受到纵向振动。本发明还涉及一种用于执行该方法的装置，该装置包括可耦合到针（7）以将针设置成纵向振动的振动装置（3），例如压电换能器。流体可以是例如焊膏或粘合剂。

5. 发明授权

US5421506A Method of positioning an object on a carrier 失效
标题翻译：将对象放置在载体上的方法
公开(公告)号：US5421506A
公开(公告)日：1995-06-06
申请号：US46826
申请日：1993-04-13
申请人： Cornelis S. Kooijman , Nicolaas J. A. Van Veen , Antonius C. M. Gieles , Wessel J. Wesseling
发明人： Cornelis S. Kooijman , Nicolaas J. A. Van Veen , Antonius C. M. Gieles , Wessel J. Wesseling
IPC分类号： B23K1/00 , B23K1/005 , B23K3/00 , B23K26/03 , B23K26/04 , G01H1/00 , H05K3/34 , H05K13/04 , B23K37/04 , B23K26/02
CPC分类号： H05K13/0465 , B23K1/0056 , B23K26/03 , B23K26/0342 , B23K26/04 , B23K26/0648 , B23K26/0665 , G01H1/00 , H05K3/3421 , H05K3/3494
摘要： Method of positioning an object on a carrier, device suitable for carrying out this method, and suction tube suitable for use in the device.The method is for laser soldering of an electronic component (7) on a pc-board (1). The component is positioned on a contact face (3) of the pc-board (1) by a device comprising a vibration transducer (53, 69, 85) which is brought into mechanical hard contact with the component (7) while the component is held against the pc-board. Subsequently, a laser (205, 207) heats solder present on the contact face and vibrations generated by the laser in the solder are passed on to the vibration transducer while the mechanical hard contact is being maintained. The vibration transducer then checks for the presence of mechanical contact between the object and the carrier and/or the melting of the solder from a comparatively strong decrease in the vibration amplitude during melting of the solder.
摘要翻译：将物体定位在载体上的方法，适于实施该方法的装置以及适用于该装置的吸管。该方法是将电子部件（7）激光焊接在印刷电路板（1）上。所述部件通过包括振动传感器（53,69,85）的装置定位在所述印刷电路板（1）的接触面（3）上，该振动传感器与所述部件（7）机械硬接触，而所述部件是针对印刷电路板。随后，激光器（205,207）加热存在于接触面上的焊料，并且在保持机械硬接触的同时将焊料中的激光产生的振动传递到振动传感器。振动传感器然后在焊料熔化期间从振动幅度的相对较大的降低来检查物体和载体之间的机械接触的存在和/或焊料的熔化。

6. 发明申请

US20100044853A1 SYSTEM-IN-PACKAGE WITH THROUGH SUBSTRATE VIA HOLES 审中-公开
标题翻译：通过底座的系统包装
公开(公告)号：US20100044853A1
公开(公告)日：2010-02-25
申请号：US12523053
申请日：2008-01-14
申请人： Ronald Dekker , Jean-Marc Yannou , Nicolaas J. A. Van Veen
发明人： Ronald Dekker , Jean-Marc Yannou , Nicolaas J. A. Van Veen
IPC分类号： H01L23/538 , H01L21/50 , H05K1/11
CPC分类号： H01L23/49827 , B81C1/00087 , B81C1/00238 , H01L23/13 , H01L23/481 , H01L23/49833 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06572 , H01L2924/00014 , H01L2924/1461 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention relates to a system-in-package that comprises an integration substrate with a thickness of less than 100 micrometer and a plurality of through-substrate vias, which have an aspect ratio larger than 5. A first chip is attached to the integration substrate and arranged between the integration substrate and a support, which is suitable for mechanically supporting the integration substrate during processing and handling. The system-in-package can be fabricated according to the invention without a through-substrate-hole etching step. The large aspect ratio implies reduced lateral extensions, which allow increasing the integration density and decreasing lead inductances.
摘要翻译：本发明涉及一种包括厚度小于100微米的整合衬底和多个贯穿衬底通孔的系统级封装，其具有大于5的长宽比。第一芯片附接到集成基板并且布置在整合基板和支撑件之间，该支撑件适用于在加工和处理期间机械地支撑整合基板。根据本发明，可以制造系统级封装，而无需通过基板孔蚀刻步骤。大的纵横比意味着减小的横向延伸，这允许增加积分密度并减少引线电感。

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