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1. 发明授权

US6005224A Method of soldering components to at least one carrier 失效
标题翻译：将组件焊接到至少一个载体的方法
公开(公告)号：US6005224A
公开(公告)日：1999-12-21
申请号：US102478
申请日：1998-06-22
申请人： Wessel J. Wesseling , Otto Nienhuis
发明人： Wessel J. Wesseling , Otto Nienhuis
IPC分类号： B23K1/00 , B23K1/008 , B23K3/04 , H05K1/18 , H05K3/34 , H05K13/04 , B23K1/012 , B23K31/02
CPC分类号： B23K1/008 , H05K3/3494 , B23K2201/40 , H05K1/189 , H05K2203/087 , H05K2203/1545
摘要： The invention relates to a method of connecting components (12) to at least one carrier (11), for example by soldering or gluing. Such a method is carried out in an oven (1) through which carriers are moved. Preferably, the carrier is a flexible foil. The carrier separates the oven into an upper part (2) and a lower part (3). In both parts a hot air stream (14) is created and directed toward the carrier. Owing to the separation by the foil the hot air stream in the upper part cannot reach the lower part and vice versa. The temperature of the hot air stream in the upper part differs from that (is, for example, higher than) in the lower part. The heating elements in the upper part of the oven may all have the same high temperature (for example, 240.degree. C.) and the heating elements in the lower part may all have the same low temperature (for example, 60.degree. C.). By adjusting at least one air stream the desired temperature at the location of the carriers (for example, at solder lands 17) can be obtained very rapidly (comparable with a hot/cold water mixing tap).
摘要翻译：本发明涉及一种将部件（12）连接至至少一个载体（11）的方法，例如通过焊接或胶合。这种方法在通过其移动载体的烘箱（1）中进行。优选地，载体是柔性箔。载体将烤箱分离成上部（2）和下部（3）。在两部分中，产生热空气流（14）并将其指向载体。由于箔的分离，上部的热空气流不能到达下部，反之亦然。上部热空气流的温度与下部不同（例如高于）。烘箱上部的加热元件全部可以具有相同的高温（例如240℃），下部的加热元件也可以具有相同的低温（例如60℃）。通过调节至少一个空气流，可以非常快速地获得载体（例如，在焊接区域17）位置处的期望温度（与热/冷水混合水龙头相当）。

2. 发明授权

US06324752B1 Component placement machine 失效
标题翻译：元件贴装机
公开(公告)号：US06324752B1
公开(公告)日：2001-12-04
申请号：US09571670
申请日：2000-05-15
申请人： Wessel J. Wesseling , Gerardus L. J. Reuvers
发明人： Wessel J. Wesseling , Gerardus L. J. Reuvers
IPC分类号： H05K330
CPC分类号： H05K13/0061 , Y10T29/4913 , Y10T29/5136 , Y10T29/53178 , Y10T29/53191
摘要： Component placement machine with a frame (1) and a transport device (2) for transporting printed circuit boards (3) in an X-direction, which transport device is provided with a transport belt (9) having an outer surface (13) on which printed circuit boards (3) are positioned. During the transport of printed circuit boards (3) as well as during the placement of components (6) on the printed circuit boards (3) an edge portion (12) of the printed circuit board which extends in the X-direction is retained between the outer surface (13) of the transport belt (9) and a contact surface (11) of the frame (1). The outer surface (13) of the transport belt has a relatively high coefficient of friction in contact with said edge portion (12) of the printed circuit board, whereas said contact surface (11) of the frame has a relatively low coefficient of friction in contact with said edge portion (12) of the printed circuit board.
摘要翻译：具有框架（1）和用于在X方向上传送印刷电路板（3）的传送装置（2）的组件放置机器，该传送装置设置有具有外表面（13）的传送带（9）哪个印刷电路板（3）被定位。在印刷电路板（3）的运输期间以及在印刷电路板（3）上放置部件（6）期间，沿X方向延伸的印刷电路板的边缘部分（12）保持在传送带（9）的外表面（13）和框架（1）的接触表面（11）。传送带的外表面（13）具有与印刷电路板的所述边缘部分（12）接触的相对较高的摩擦系数，而框架的所述接触表面（11）具有相对较低的摩擦系数与印刷电路板的所述边缘部分（12）接触。

3. 发明授权

US5656339A Method of and arrangement for applying a fluid to a surface using a vibrating needle 失效
标题翻译：使用振动针将流体施加到表面的方法和布置
公开(公告)号：US5656339A
公开(公告)日：1997-08-12
申请号：US492830
申请日：1995-06-20
申请人： Wessel J. Wesseling , Nicolaas J. A. Van Veen
发明人： Wessel J. Wesseling , Nicolaas J. A. Van Veen
IPC分类号： B05C5/02 , B05C11/10 , B23K3/06 , H01L21/00 , B06B1/06
CPC分类号： H01L21/6715 , B05C11/10 , B05C5/02 , B23K3/0607
摘要： The invention relates to a method of applying a fluid (12) to a surface (13), the pressurised fluid being applied from a container (1) to the surface via a hollow needle (7). In order to preclude clogging of the needle the needle is subjected to a longitudinal vibration during the application of fluid. The invention also relates to an arrangement for carrying out the method, the arrangement comprising a vibration device (3), such as a piezoelectric transducer, which can be coupled to the needle (7) to set the needle into longitudinal vibration. The fluid may be, for example, a solder paste or an adhesive.
摘要翻译：本发明涉及一种将流体（12）施加到表面（13）的方法，所述加压流体通过中空针（7）从容器（1）施加到表面。为了防止针头的堵塞，在施加流体期间针头受到纵向振动。本发明还涉及一种用于执行该方法的装置，该装置包括可耦合到针（7）以将针设置成纵向振动的振动装置（3），例如压电换能器。流体可以是例如焊膏或粘合剂。

4. 发明授权

US5421506A Method of positioning an object on a carrier 失效
标题翻译：将对象放置在载体上的方法
公开(公告)号：US5421506A
公开(公告)日：1995-06-06
申请号：US46826
申请日：1993-04-13
申请人： Cornelis S. Kooijman , Nicolaas J. A. Van Veen , Antonius C. M. Gieles , Wessel J. Wesseling
发明人： Cornelis S. Kooijman , Nicolaas J. A. Van Veen , Antonius C. M. Gieles , Wessel J. Wesseling
IPC分类号： B23K1/00 , B23K1/005 , B23K3/00 , B23K26/03 , B23K26/04 , G01H1/00 , H05K3/34 , H05K13/04 , B23K37/04 , B23K26/02
CPC分类号： H05K13/0465 , B23K1/0056 , B23K26/03 , B23K26/0342 , B23K26/04 , B23K26/0648 , B23K26/0665 , G01H1/00 , H05K3/3421 , H05K3/3494
摘要： Method of positioning an object on a carrier, device suitable for carrying out this method, and suction tube suitable for use in the device.The method is for laser soldering of an electronic component (7) on a pc-board (1). The component is positioned on a contact face (3) of the pc-board (1) by a device comprising a vibration transducer (53, 69, 85) which is brought into mechanical hard contact with the component (7) while the component is held against the pc-board. Subsequently, a laser (205, 207) heats solder present on the contact face and vibrations generated by the laser in the solder are passed on to the vibration transducer while the mechanical hard contact is being maintained. The vibration transducer then checks for the presence of mechanical contact between the object and the carrier and/or the melting of the solder from a comparatively strong decrease in the vibration amplitude during melting of the solder.
摘要翻译：将物体定位在载体上的方法，适于实施该方法的装置以及适用于该装置的吸管。该方法是将电子部件（7）激光焊接在印刷电路板（1）上。所述部件通过包括振动传感器（53,69,85）的装置定位在所述印刷电路板（1）的接触面（3）上，该振动传感器与所述部件（7）机械硬接触，而所述部件是针对印刷电路板。随后，激光器（205,207）加热存在于接触面上的焊料，并且在保持机械硬接触的同时将焊料中的激光产生的振动传递到振动传感器。振动传感器然后在焊料熔化期间从振动幅度的相对较大的降低来检查物体和载体之间的机械接触的存在和/或焊料的熔化。

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