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    • 1. 发明申请
    • METHODS OF MANUFACTURING CHARGE TRAP-TYPE NON-VOLATILE MEMORY DEVICES
    • 制造电荷陷波型非易失性存储器件的方法
    • US20100173469A1
    • 2010-07-08
    • US12651781
    • 2010-01-04
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • H01L21/76
    • H01L27/11568
    • Some methods are directed to manufacturing charge trap-type non-volatile memory devices. An isolation layer pattern can be formed that extends in a first direction in a substrate. A recess unit is formed in the substrate by recessing an exposed surface of the substrate adjacent to the isolation layer pattern. A tunnel insulating layer and a charge trap layer are sequentially formed on the substrate. The tunnel insulating layer and the charge trap layer are patterned to form an isolated island-shaped tunnel insulating layer pattern and an isolated island-shaped charge trap layer pattern by etching defined regions of the substrate, the isolation layer pattern, the tunnel insulating layer, and the charge trap layer until a top surface of the charge trap layer that is disposed on a bottom surface of the recess unit is aligned with a top surface of the isolation layer pattern. A blocking insulating layer is formed that covers the charge trap layer pattern, the isolation layer pattern, and a defined region of the substrate interposed between the charge trap patterns. A gate electrode pattern is formed on the blocking insulating layer to face the charge trap layer pattern. This manufacturing process may reduce charge spreading between unit memory cells and/or may prevent/avoid reduction in the breakdown voltage of the blocking insulating layer.
    • 一些方法涉及制造电荷陷阱型非易失性存储器件。 可以形成在衬底中沿第一方向延伸的隔离层图案。 通过使邻近隔离层图案的基板的暴露表面凹陷而在基板中形成凹部单元。 隧道绝缘层和电荷陷阱层依次形成在基板上。 图案化隧道绝缘层和电荷陷阱层,通过蚀刻衬底的限定区域,隔离层图案,隧道绝缘层,隔离层状图案,隔离层状图案,隧道绝缘层, 并且电荷陷阱层直到设置在凹陷单元的底表面上的电荷陷阱层的顶表面与隔离层图案的顶表面对准。 形成了覆盖电荷陷阱层图案,隔离层图案和插入在电荷阱图案之间的基板的限定区域的阻挡绝缘层。 在阻挡绝缘层上形成面对电荷陷阱层图案的栅电极图案。 该制造过程可以减小单元存储单元之间的电荷扩展和/或可以防止/避免阻塞绝缘层的击穿电压的降低。
    • 2. 发明授权
    • Methods of manufacturing charge trap-type non-volatile memory devices
    • 制造电荷陷阱型非易失性存储器件的方法
    • US08178408B2
    • 2012-05-15
    • US12651781
    • 2010-01-04
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • H01L21/336H01L21/3205
    • H01L27/11568
    • Some methods are directed to manufacturing charge trap-type non-volatile memory devices. An isolation layer pattern can be formed that extends in a first direction in a substrate. A recess unit is formed in the substrate by recessing an exposed surface of the substrate adjacent to the isolation layer pattern. A tunnel insulating layer and a charge trap layer are sequentially formed on the substrate. The tunnel insulating layer and the charge trap layer are patterned to form an isolated island-shaped tunnel insulating layer pattern and an isolated island-shaped charge trap layer pattern by etching defined regions of the substrate, the isolation layer pattern, the tunnel insulating layer, and the charge trap layer until a top surface of the charge trap layer that is disposed on a bottom surface of the recess unit is aligned with a top surface of the isolation layer pattern. A blocking insulating layer is formed that covers the charge trap layer pattern, the isolation layer pattern, and a defined region of the substrate interposed between the charge trap patterns. A gate electrode pattern is formed on the blocking insulating layer to face the charge trap layer pattern. This manufacturing process may reduce charge spreading between unit memory cells and/or may prevent/avoid reduction in the breakdown voltage of the blocking insulating layer.
    • 一些方法涉及制造电荷陷阱型非易失性存储器件。 可以形成在衬底中沿第一方向延伸的隔离层图案。 通过使邻近隔离层图案的基板的暴露表面凹陷而在基板中形成凹部单元。 隧道绝缘层和电荷陷阱层依次形成在基板上。 图案化隧道绝缘层和电荷陷阱层,通过蚀刻衬底的限定区域,隔离层图案,隧道绝缘层,隔离层状图案,隔离层状图案,隧道绝缘层, 并且电荷陷阱层直到设置在凹陷单元的底表面上的电荷陷阱层的顶表面与隔离层图案的顶表面对准。 形成了覆盖电荷陷阱层图案,隔离层图案和插入在电荷阱图案之间的基板的限定区域的阻挡绝缘层。 在阻挡绝缘层上形成面对电荷陷阱层图案的栅电极图案。 该制造过程可以减小单元存储单元之间的电荷扩展和/或可以防止/避免阻塞绝缘层的击穿电压的降低。
    • 4. 发明授权
    • Synchronous pulse plasma etching equipment and method of fabricating a semiconductor device
    • 同步脉冲等离子体蚀刻设备及制造半导体器件的方法
    • US08460508B2
    • 2013-06-11
    • US12591602
    • 2009-11-24
    • Ken TokashikiHong ChoJeong-Dong Choe
    • Ken TokashikiHong ChoJeong-Dong Choe
    • H01L21/3065H01L21/302C23C16/00C23C16/50C23C16/52
    • H01J37/32165H01J37/32082H01J37/32174
    • Synchronous pulse plasma etching equipment includes a first electrode and one or more second electrodes configured to generate plasma in a plasma etching chamber. A first radio frequency power output unit is configured to apply a first radio frequency power having a first frequency and a first duty ratio to the first electrode, and to output a control signal including information about a phase of the first radio frequency power. At least one second radio frequency power output unit is configured to apply a second radio frequency power having a second frequency and a second duty ratio to a corresponding second electrode among the second electrodes. The second radio frequency power output unit is configured to control the second radio frequency power to be synchronized with the first radio frequency power or to have a phase difference from the first radio frequency power in response to the control signal.
    • 同步脉冲等离子体蚀刻设备包括第一电极和被配置为在等离子体蚀刻室中产生等离子体的一个或多个第二电极。 第一射频功率输出单元被配置为向第一电极施加具有第一频率和第一占空比的第一射频功率,并且输出包括关于第一射频功率的相位的信息的控制信号。 至少一个第二射频功率输出单元被配置为将具有第二频率和第二占空比的第二射频功率应用于第二电极中的对应的第二电极。 第二射频功率输出单元被配置为响应于控制信号控制与第一射频功率同步的第二射频功率或者与第一射频功率相位差。