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    • 2. 发明授权
    • Apparatus and methods for electrochemical processing of microelectronic workpieces
    • 微电子工件电化学处理的装置和方法
    • US07264698B2
    • 2007-09-04
    • US09872151
    • 2001-05-31
    • Kyle M. HansonThomas L. RitzdorfGregory J. WilsonPaul R. McHugh
    • Kyle M. HansonThomas L. RitzdorfGregory J. WilsonPaul R. McHugh
    • C25D17/00C25D17/02C25D7/12
    • H01L21/6719C25D7/123C25D17/001H01L21/67103H01L21/6723
    • An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.
    • 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中,反应容器包括:具有外壁的外容器; 分配器,其耦合到所述外部容器,所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流,所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分,以及 所述场成形单元具有至少一个电极室,所述二次流可以通过所述至少一个电极室,而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件,所述界面构件与所述电极室中的所述次流体流体连通,并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。
    • 3. 发明授权
    • Flow battery systems
    • 流动电池系统
    • US08808888B2
    • 2014-08-19
    • US12868489
    • 2010-08-25
    • Gregory J. WilsonKyle M. Hanson
    • Gregory J. WilsonKyle M. Hanson
    • H01M2/36
    • H01M8/186H01M4/42H01M8/0232H01M8/0245H01M8/188H01M8/20H01M12/08H01M2250/00Y02E60/528
    • Embodiments of the invention generally provide for flow battery cells and systems containing a plurality of flow battery cells, and methods for improving metal plating within the flow battery cell, such as by flowing and exposing the catholyte to various types of cathodes. In one embodiment, a flow battery cell is provided which includes a cathodic half cell and an anodic half cell separated by an electrolyte membrane, wherein the cathodic half cell contains a plurality of cathodic wires extending perpendicular or substantially perpendicular to and within the catholyte pathway and in contact with the catholyte, and each of the cathodic wires extends parallel or substantially parallel to each other. In some examples, the plurality of cathodic wires may have at least two arrays of cathodic wires, each array contains at least one row of cathodic wires, and each row extends along the catholyte pathway.
    • 本发明的实施例通常提供了包含多个流动电池单元的流动电池单元和系统,以及用于改善流动电池单元内的金属电镀的方法,例如通过将阴极电解液流过和暴露于各种类型的阴极。 在一个实施例中,提供了流动电池单元,其包括阴极半电池和由电解质膜分离的阳极半电池,其中阴极半电池包含垂直于或基本垂直于阴极电解液通道延伸的多个阴极线, 与阴极电解液接触,并且每个阴极线彼此平行或基本平行延伸。 在一些示例中,多个阴极线可以具有至少两个阴极线阵列,每个阵列包含至少一排阴极线,并且每排沿着阴极电解液通道延伸。
    • 5. 发明授权
    • Apparatus and methods for electrochemical processing of microelectronic workpieces
    • 微电子工件电化学处理的装置和方法
    • US07438788B2
    • 2008-10-21
    • US11096477
    • 2005-03-29
    • Kyle M. HansonThomas L. RitzdorfGregory J. WilsonPaul R. McHugh
    • Kyle M. HansonThomas L. RitzdorfGregory J. WilsonPaul R. McHugh
    • C25D17/02C25D7/12
    • C25D17/001C25D5/18C25D7/123C25D17/10
    • An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.
    • 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中,反应容器包括:具有外壁的外容器; 分配器,其耦合到所述外部容器,所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流,所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分,以及 所述场成形单元具有至少一个电极室,所述二次流可以通过所述至少一个电极室,而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件,所述界面构件与所述电极室中的所述次流体流体连通,并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。
    • 7. 发明授权
    • Workpiece processor having processing chamber with improved processing fluid flow
    • 具有处理室的工件处理器具有改善的处理流体流动
    • US07267749B2
    • 2007-09-11
    • US10400186
    • 2003-03-26
    • Gregory J. WilsonPaul R. McHughKyle M. Hanson
    • Gregory J. WilsonPaul R. McHughKyle M. Hanson
    • C25D5/08C25D17/06C25B9/12C25D3/38
    • C25D17/02C25D5/08C25D17/001Y10S204/07
    • A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.
    • 阐述了用于在微电子工件的至少一个表面的浸入处理期间提供处理流体流的处理容器(610)。 处理容器包括主流体流动室(505),其向工件的至少一个表面提供处理流体流,以及设置成向主流体流动室提供处理流体流的多个喷嘴(535)。 多个喷嘴被布置和引导以提供垂直和径向的流体流动分量,其组合以在工件的表面上径向产生基本上均匀的正常流动分量。 还提出了使用这种处理容器的示例性装置,其特别适用于进行电镀工艺。 根据本公开的另一方面,提供改进的流体移除路径(640),用于在微电子工件的浸没处理期间从主流体流动室中移除流体。