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1. 发明申请

US20050104207A1 Corrosion-resistant bond pad and integrated device 审中-公开
公开(公告)号：US20050104207A1
公开(公告)日：2005-05-19
申请号：US10982432
申请日：2004-11-05
申请人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
发明人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
IPC分类号： H01L23/485 , H01L21/44 , H01L21/48
CPC分类号： H01L24/05 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/04042 , H01L2224/05644 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/8501 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/157 , H01L2924/16151 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/48744
摘要： The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.

2. 发明申请

US20050001324A1 Corrosion-resistant copper bond pad and integrated device 失效
标题翻译：耐腐蚀铜焊垫和集成器件
公开(公告)号：US20050001324A1
公开(公告)日：2005-01-06
申请号：US10610745
申请日：2003-07-01
申请人： Gregory Dunn , Owen Fay , Timothy Dean , Terance Blake , Remy Chelini , William Lytle , George Strumberger
发明人： Gregory Dunn , Owen Fay , Timothy Dean , Terance Blake , Remy Chelini , William Lytle , George Strumberger
IPC分类号： G01L9/00 , H01L21/60 , H01L23/485 , H01L23/498 , H01L23/48
CPC分类号： H01L24/12 , G01L19/0069 , G01L19/147 , H01L23/498 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/13099 , H01L2224/13109 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00012
摘要： The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.
摘要翻译：本发明提供了一种具有耐腐蚀的封盖铜焊盘的集成器件。封装的铜键合焊盘包括半导体衬底上的至少一个铜焊盘。包含浸渍钯，无电解钴或浸渍铯中的一种的活化层设置在铜键合焊盘上。化学镀镍 - 硼合金的第一中间层设置在活化层上。在第一中间层上设置包含非电解镍或无电解钯中的一种的第二中间层，在第二中间层上设置浸金层。还公开了封盖铜键合焊盘和形成封盖铜键合焊盘的方法。

3. 发明申请

US20060269728A1 Peelable circuit board foil 失效
标题翻译：可剥离电路板箔
公开(公告)号：US20060269728A1
公开(公告)日：2006-11-30
申请号：US11139056
申请日：2005-05-27
申请人： Gregory Dunn , Remy Chelini , Timothy Dean
发明人： Gregory Dunn , Remy Chelini , Timothy Dean
IPC分类号： B32B3/00
CPC分类号： H05K3/025 , B32B7/06 , B32B9/00 , B32B9/041 , B32B15/00 , B32B15/043 , B32B15/20 , B32B2264/102 , B32B2307/202 , B32B2307/204 , B32B2307/54 , B32B2307/546 , B32B2307/714 , B32B2457/08 , H05K3/384 , H05K2201/0175 , H05K2203/0264 , Y10T428/12493 , Y10T428/1259 , Y10T428/12611 , Y10T428/12667 , Y10T428/12875 , Y10T428/12882 , Y10T428/24917 , Y10T428/24926
摘要： In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.
摘要翻译：在一个实施例中，可剥离电路板箔（200）具有通过包含共沉积层（250）的无机高温释放结构（215）结合的金属支撑层（205）和导电金属箔层（210）和金属氧化物层（260）。共沉积层包含镍和硼，磷和铬中的一种或多种的混合物。在第二实施例中，可剥离印刷电路箔（200）具有设置在金属箔层上的结晶化电介质氧化物层（405）和设置在结晶化电介质氧化物层上的电极层（415），形成介电剥离电路板箔（400），其可以粘附到柔性或刚性电路板的层上，之后金属支撑层可以被剥离，留下包括金属箔层，结晶的电介质氧化物层和电极层的电容结构。

4. 发明申请

US20050001316A1 Corrosion-resistant bond pad and integrated device 审中-公开
标题翻译：耐腐蚀焊盘和集成器件
公开(公告)号：US20050001316A1
公开(公告)日：2005-01-06
申请号：US10612590
申请日：2003-07-01
申请人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
发明人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
IPC分类号： H01L23/485 , H01L23/48 , H01L21/44 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/04042 , H01L2224/05644 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/8501 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/157 , H01L2924/16151 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/48744
摘要： The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.
摘要翻译：本发明提供了一种具有耐腐蚀的封盖焊盘的集成器件。封装的接合焊盘包括半导体衬底上的至少一个铝接合焊盘。在铝合金焊盘上设置一层无电镀镍。在化学镀镍上设置一层无电镀钯，并在无电镀钯上设置一层浸金。还公开了一种封盖接合焊盘和形成封盖接合焊盘的方法。

5. 发明申请

US20050135074A1 Printed circuit dielectric foil and embedded capacitors 失效
标题翻译：印刷电路介质箔和嵌入式电容器
公开(公告)号：US20050135074A1
公开(公告)日：2005-06-23
申请号：US10744695
申请日：2003-12-23
申请人： Gregory Dunn , Remy Chelini , Robert Croswell , Timothy Dean , Claudia Gamboa , Jovica Savic
发明人： Gregory Dunn , Remy Chelini , Robert Croswell , Timothy Dean , Claudia Gamboa , Jovica Savic
IPC分类号： H05K1/16 , H05K3/02 , H05K3/42
CPC分类号： H05K1/162 , H05K3/025 , H05K3/429 , H05K2201/0175 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718
摘要： A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm2).
摘要翻译：电介质电路板箔（400,600）包括导电金属箔层（210,660），邻近导电金属箔层的第一表面设置的结晶介电氧化物层（405,655），镍酸镧层（414），664）和基本上由设置在镍酸镧层上的一种或多种贱金属制成的电极层（415,665）。箔（400,600）可以粘附到印刷电路板子结构（700）上，并用于经济地制造多个嵌入式电容器，包括具有大电容密度（> 1000pf / mm 2）的隔离电容器， / SUP>）。

6. 发明申请

US20050079375A1 PEELABLE CIRCUIT BOARD FOIL 失效
标题翻译：可剥线电路板
公开(公告)号：US20050079375A1
公开(公告)日：2005-04-14
申请号：US10682557
申请日：2003-10-09
申请人： Timothy Dean , Gregory Dunn , Remy Chelini , Claudia Gamboa
发明人： Timothy Dean , Gregory Dunn , Remy Chelini , Claudia Gamboa
IPC分类号： H05K1/16 , H05K3/02 , H05K3/38 , B32B3/00 , B32B15/00
CPC分类号： H05K1/162 , H05K3/025 , H05K3/384 , H05K2201/0175 , H05K2201/0179 , H05K2201/0355 , Y10T428/12493 , Y10T428/1259 , Y10T428/12611 , Y10T428/12667 , Y10T428/12875 , Y10T428/12882 , Y10T428/24917
摘要： In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.
摘要翻译：在一个实施例中，可剥离电路板箔（200）具有通过无机剥离材料（215）粘合的金属支撑层（205）和导电金属箔层（210）。导电金属箔层具有涂覆有高温抗氧化剂屏障（220）并具有小于0.05微米RMS的粗糙度的暴露表面（212）。在第二实施例中，可剥离印刷电路箔（200）具有设置在导电金属箔层的暴露表面上的结晶的电介质氧化物层（405）和设置在结晶的电介质氧化物层上的电极层（415），形成可以粘附到柔性或刚性电路板的层的介电可剥离电路板箔（400），之后金属支撑层可以被剥离，留下包括金属箔层，结晶化电介质氧化物层，和电极层。

7. 发明申请

US20070139864A1 Embedded capacitors and methods for their fabrication and connection 失效
标题翻译：嵌入式电容器及其制造和连接方法
公开(公告)号：US20070139864A1
公开(公告)日：2007-06-21
申请号：US11316087
申请日：2005-12-21
申请人： Gregory Dunn , Remy Chelini , Robert Croswell , Philip Lessner , Michael Prevallet , John Prymak
发明人： Gregory Dunn , Remy Chelini , Robert Croswell , Philip Lessner , Michael Prevallet , John Prymak
IPC分类号： H01G9/00
CPC分类号： H01G9/045 , H01G9/0032 , H01G9/055 , H01G9/15 , H05K1/162 , H05K3/383 , H05K3/429 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718 , H05K2203/0315
摘要： Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
摘要翻译：嵌入式电容器包括在第一铜层上包括第一铜层（205）和铝层（210）的双金属箔（500）。铝层具有邻近第一铜层的平滑侧面和与第一铜层相对的高表面积纹理化侧面（215）。双金属箔还包括在铝层的高表面积纹理化侧的氧化铝层（305），氧化铝层上的导电聚合物层（420）和覆盖在氧化铝层上的第二铜层（535）。双金属箔可以嵌入在电路板（700）中以形成高价值的嵌入式电容器。

8. 发明申请

US20070209178A1 METHOD FOR FORMING EMBEDDED CAPACITORS ON A PRINTED CURCUIT BOARD AND RESULTANT PRINTED CIRCUIT BOARD 失效
标题翻译：在印刷电路板和印刷电路板上形成嵌入式电容器的方法
公开(公告)号：US20070209178A1
公开(公告)日：2007-09-13
申请号：US11276688
申请日：2006-03-10
申请人： Jovica Savic , Remy Chelini , Gregory Dunn
发明人： Jovica Savic , Remy Chelini , Gregory Dunn
IPC分类号： H01G7/00 , H01K3/10
CPC分类号： H01G4/33 , H01G4/12 , H05K1/162 , H05K3/0044 , H05K2201/0175 , H05K2201/0187 , H05K2201/0195 , H05K2201/0209 , H05K2201/09509 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more electrodes situated on the PCB. Another electrode is formed on top of the first dielectric layer and a second dielectric layer is deposited on top of that electrode. A third electrode is formed on top of the second dielectric layer. The two dielectric layers are abrasively delineated in a single step by a method such as sand blasting to define portions of the first and second dielectric layers to create a multilayer capacitive structure.
摘要翻译：公开了一种在印刷电路板上形成嵌入式电容器的方法。通过在位于PCB上的一个或多个电极上沉积第一介电层，在印刷电路板上形成电容器。另一电极形成在第一电介质层的顶部，并且第二电介质层沉积在该电极的顶部上。在第二电介质层的顶部形成第三电极。通过诸如喷砂的方法在单个步骤中擦拭两个电介质层，以限定第一和第二电介质层的部分以产生多层电容结构。

9. 发明申请

US20050133872A1 Two-layer patterned resistor 失效
标题翻译：双层图案电阻
公开(公告)号：US20050133872A1
公开(公告)日：2005-06-23
申请号：US10743589
申请日：2003-12-22
申请人： Gregory Dunn , Scott Carney , Jovica Savic
发明人： Gregory Dunn , Scott Carney , Jovica Savic
IPC分类号： H01C1/148 , H01C7/00 , H01C17/065 , H01L21/8222 , H01L23/498 , H01L23/62
CPC分类号： H01C7/006 , H01C1/148 , H01C17/065 , H01L23/49822 , H01L2924/0002 , H01L2924/00
摘要： A technique for fabricating a patterned resistor on a substrate produces a patterned resistor (101, 801, 1001, 1324, 1374) including two conductive end terminations (110, 810, 1010) on the substrate, a pattern of first resistive material (120, 815, 1015) having a first width (125) and a first sheet resistance, and a pattern of second resistive material (205, 820, 1020) having a second width (210) and a second sheet resistance that at least partially overlies the pattern of first resistive material. One of the first and second sheet resistances is a low sheet resistance and the other of the first and second resistances is a high sheet resistance. A ratio of the high sheet resistance to the low sheet resistance is at least ten to one. The pattern having the higher sheet resistance is substantially wider than the pattern having the low sheet resistance. The patterned resistor can be precision trimmed 1225.
摘要翻译：用于在衬底上制造图案化电阻器的技术产生包括在衬底上的两个导电端接（110,810,1010）的图案化电阻器（101,801,1001,1324,1374），第一电阻材料（120，具有第一宽度（125）和第一薄层电阻的第二电阻材料（205,820,1020）的图案，以及具有至少部分地覆盖图案的第二宽度（210）和第二薄层电阻的图案的第一电阻材料。第一和第二薄层电阻之一是低的薄层电阻，第一和第二电阻中的另一个是高的薄层电阻。高薄层电阻与低薄层电阻的比例至少为10比1。具有较高薄层电阻的图案基本上比具有低薄层电阻的图案更宽。图案化电阻器可精密修整1225。

10. 发明申请

US20080216296A1 THIN SOLID ELECTROLYTIC CAPACITOR EMBEDDABLE IN A SUBSTRATE 有权
标题翻译：薄固体电解电容器可嵌入基板
公开(公告)号：US20080216296A1
公开(公告)日：2008-09-11
申请号：US12031092
申请日：2008-02-14
申请人： John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
发明人： John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
IPC分类号： H01G4/002
CPC分类号： H01G9/0029 , H01G9/012 , H01G9/0425 , H01G9/055 , H01G9/15 , H05K1/185 , Y10T29/417
摘要： An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
摘要翻译：一种形成电容器的改进方法。该方法包括以下步骤：提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极，电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。

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