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1. 发明授权

US6159083A Polishing head for a chemical mechanical polishing apparatus 失效
标题翻译：抛光头用于化学机械抛光装置
公开(公告)号：US6159083A
公开(公告)日：2000-12-12
申请号：US116160
申请日：1998-07-15
申请人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
发明人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
IPC分类号： B24B37/30 , B24B7/22
CPC分类号： B24B37/30 , Y10S977/775 , Y10S977/888
摘要： A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
摘要翻译：用于化学机械抛光（CMP）装置的抛光头。抛光头包括背板，由背板支撑的保持环和由保持环包围的气囊构件。抛光头的背板包括通过波纹管偏压耦合到副载波的驱动板。抛光头还可以包括设置在副载架上并在气囊构件下方的提升板。抛光衬底的方法包括将衬底放置在气囊构件上并将衬底定位在抛光垫上，使得气囊构件在衬底上施加选定的压力分布。

2. 发明授权

US6000997A Temperature regulation in a CMP process 失效
标题翻译： CMP工艺中的温度调节
公开(公告)号：US6000997A
公开(公告)日：1999-12-14
申请号：US113450
申请日：1998-07-10
申请人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
发明人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14
CPC分类号： B24B37/015 , B24B21/04
摘要： Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.
摘要翻译：热量在线性CMP带和相邻的传热源之间传递，从而提供穿过带的预定横向温度分布。温度传感器产生反馈信号来控制传热源。或者，过程监控传感器提供反馈信号。传热源可以包括具有不同温度的多个选择性可控的单个热传递源，其可以高于或低于环境温度。传热的机理可以包括一个或多个对流，传导和辐射。该配置提供了大量灵活性，以建立和保持穿过抛光带的选择性不均匀的温度分布。这又允许精确的控制和抛光过程的稳定性。传热源可以包括滑轮，浆液分配器，抛光垫调节器或调节器背部支撑件，流体喷嘴和密封的流体腔体带支撑件。

3. 发明授权

US06315857B1 Polishing pad shaping and patterning 失效
标题翻译：抛光垫成型和图案化
公开(公告)号：US06315857B1
公开(公告)日：2001-11-13
申请号：US09113714
申请日：1998-07-10
申请人： Tsungnan Cheng , Ethan C. Wilson , Shou-sung Chang , Gregory C. Lee , Huey M. Tzeng , David E. Weldon , Linh X. Can , Luis Lau , Siyuan Yang
发明人： Tsungnan Cheng , Ethan C. Wilson , Shou-sung Chang , Gregory C. Lee , Huey M. Tzeng , David E. Weldon , Linh X. Can , Luis Lau , Siyuan Yang
IPC分类号： B24B2100
CPC分类号： B24B37/26 , B24D11/00
摘要： Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.
摘要翻译：为制造集成电路中使用的线性化学机械抛光装置提供抛光垫。附着在抛光带上的抛光垫以图案开槽，以有利地将浆料从导入点输送到半导体晶片被抛光的点。这些图案包括延伸穿过抛光垫的至少一组多个平行凹槽。槽与带的行进方向形成不等于零的角度。

4. 发明授权

US6042457A Conditioner assembly for a chemical mechanical polishing apparatus 失效
标题翻译：用于化学机械抛光装置的调节器组件
公开(公告)号：US6042457A
公开(公告)日：2000-03-28
申请号：US113614
申请日：1998-07-10
申请人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
发明人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
IPC分类号： B24B53/007 , B24B53/017 , B24B1/00
CPC分类号： B24B53/017
摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The bearing housing rotatably supports the linear torque bearing assembly such that a motor assembly can operatively drive the linear torque bearing assembly, the shaft, and the conditioning head.The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect. The conditioner back support further includes a polymeric compound disposed on the front surface of the backing plate for reducing the frictional force between the backing plate and the polishing belt.
摘要翻译：调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。调节器组件另外包括固定在第一开口端上并接合到调节头的波纹管和设置在线性扭矩轴承组件的第二开口端上的轴承壳体。轴承座可旋转地支撑线性扭矩轴承组件，使得马达组件可操作地驱动线性扭矩轴承组件，轴和调节头。调理器背部支撑分别与调节器组件相对，使得支撑抛光垫的抛光带设置在调节器背部支撑件和调节器组件的中间。护发背部支撑件包括可调节地支撑背板的框架组件。框架组件包括允许使用者调整背板的位置的定位组件。可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。调理器背部支撑件还包括设置在背板的前表面上的聚合物，用于减小背板和抛光带之间的摩擦力。

5. 发明授权

US06322429B1 Conditioner assembly and a conditioner back support for a chemical mechanical polishing apparatus 有权
标题翻译：用于化学机械抛光装置的调节器组件和调节器背部支撑件
公开(公告)号：US06322429B1
公开(公告)日：2001-11-27
申请号：US09491405
申请日：2000-01-26
申请人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
发明人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect.
摘要翻译：调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。调节器组件还包括固定在第一开口端上并接合到调节头的波纹管和布置在线性扭矩轴承组件的第二开口端上的轴承壳体。调节器背部支撑件分别与调节器组件相对地使得抛光带支撑抛光垫设置在调节器背部支撑件和调节器组件的中间。护发背部支撑件包括可调节地支撑背板的框架组件。框架组件包括允许使用者调整背板的位置的定位组件。可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。

6. 发明授权

US06988934B1 Method and apparatus of a variable height and controlled fluid flow platen in a chemical mechanical polishing system 失效
标题翻译：化学机械抛光系统中可变高度和受控流体流动压板的方法和装置
公开(公告)号：US06988934B1
公开(公告)日：2006-01-24
申请号：US10674319
申请日：2003-09-29
申请人： Gregory C. Lee , Simon McClatchie , John M. Boyd
发明人： Gregory C. Lee , Simon McClatchie , John M. Boyd
IPC分类号： B24B1/00
CPC分类号： B24B37/32 , B24B21/04
摘要： An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first level and the platen support cover is disposed at a second level, the first level being lower relative to the second level. Both the platen and the platen support cover are configured to be disposed below the polishing pad such that the polishing pad is closer to the second level than the first level. The platen support cover has a width at the second level that is substantially equal around the platen. An apparatus and method for controlling pressure beneath a polishing pad is also provided.
摘要翻译：提供了一种用于化学机械平面化（CMP）系统的设备。该装置包括能够在抛光垫下方引入流体的压板和构造成围绕压板的压板支撑盖。压板设置在第一水平面上，并且压板支撑盖设置在第二水平面上，第一水平相对于第二水平低。压板和压板支撑盖都被配置为设置在抛光垫的下方，使得抛光垫比第一水平更靠近第二水平。压板支撑盖具有在压板周围基本相等的第二水平的宽度。还提供了一种用于控制抛光垫下方的压力的装置和方法。

7. 发明授权

US06517426B2 Composite polishing pad for chemical-mechanical polishing 失效
公开(公告)号：US06517426B2
公开(公告)日：2003-02-11
申请号：US09828626
申请日：2001-04-05
申请人： Gregory C. Lee
发明人： Gregory C. Lee
IPC分类号： B24D1100
CPC分类号： B24B37/22 , B24B37/24 , B24B37/26
摘要： A composite polishing pad for use in a linear chemical-mechanical polishing apparatus is provided. The pad comprises a hard polishing pad having a polishing surface and an attachment surface opposite the polishing surface, the attachment surface comprising a border comprising an adhesive, the border surrounding a cavity, the cavity being sized and shaped to receive a soft polishing pad. The soft polishing pad is disposed completely in the cavity and completely fills the cavity, and the soft polishing pad has a first side adhered in the cavity of the hard polishing pad, and a second side comprising an adhesive, whereby the attachment surface of the hard polishing pad and the second side of the soft polishing pad are substantially in a common plane. Other composite polishing pads are also provided, as are methods for making composite pads and methods for preventing composite pads from splitting apart into their component pads.

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