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1. 发明授权

US06315857B1 Polishing pad shaping and patterning 失效
标题翻译：抛光垫成型和图案化
公开(公告)号：US06315857B1
公开(公告)日：2001-11-13
申请号：US09113714
申请日：1998-07-10
申请人： Tsungnan Cheng , Ethan C. Wilson , Shou-sung Chang , Gregory C. Lee , Huey M. Tzeng , David E. Weldon , Linh X. Can , Luis Lau , Siyuan Yang
发明人： Tsungnan Cheng , Ethan C. Wilson , Shou-sung Chang , Gregory C. Lee , Huey M. Tzeng , David E. Weldon , Linh X. Can , Luis Lau , Siyuan Yang
IPC分类号： B24B2100
CPC分类号： B24B37/26 , B24D11/00
摘要： Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.
摘要翻译：为制造集成电路中使用的线性化学机械抛光装置提供抛光垫。附着在抛光带上的抛光垫以图案开槽，以有利地将浆料从导入点输送到半导体晶片被抛光的点。这些图案包括延伸穿过抛光垫的至少一组多个平行凹槽。槽与带的行进方向形成不等于零的角度。

2. 发明授权

US6042457A Conditioner assembly for a chemical mechanical polishing apparatus 失效
标题翻译：用于化学机械抛光装置的调节器组件
公开(公告)号：US6042457A
公开(公告)日：2000-03-28
申请号：US113614
申请日：1998-07-10
申请人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
发明人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
IPC分类号： B24B53/007 , B24B53/017 , B24B1/00
CPC分类号： B24B53/017
摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The bearing housing rotatably supports the linear torque bearing assembly such that a motor assembly can operatively drive the linear torque bearing assembly, the shaft, and the conditioning head.The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect. The conditioner back support further includes a polymeric compound disposed on the front surface of the backing plate for reducing the frictional force between the backing plate and the polishing belt.
摘要翻译：调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。调节器组件另外包括固定在第一开口端上并接合到调节头的波纹管和设置在线性扭矩轴承组件的第二开口端上的轴承壳体。轴承座可旋转地支撑线性扭矩轴承组件，使得马达组件可操作地驱动线性扭矩轴承组件，轴和调节头。调理器背部支撑分别与调节器组件相对，使得支撑抛光垫的抛光带设置在调节器背部支撑件和调节器组件的中间。护发背部支撑件包括可调节地支撑背板的框架组件。框架组件包括允许使用者调整背板的位置的定位组件。可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。调理器背部支撑件还包括设置在背板的前表面上的聚合物，用于减小背板和抛光带之间的摩擦力。

3. 发明授权

US06322429B1 Conditioner assembly and a conditioner back support for a chemical mechanical polishing apparatus 有权
标题翻译：用于化学机械抛光装置的调节器组件和调节器背部支撑件
公开(公告)号：US06322429B1
公开(公告)日：2001-11-27
申请号：US09491405
申请日：2000-01-26
申请人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
发明人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect.
摘要翻译：调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。调节器组件还包括固定在第一开口端上并接合到调节头的波纹管和布置在线性扭矩轴承组件的第二开口端上的轴承壳体。调节器背部支撑件分别与调节器组件相对地使得抛光带支撑抛光垫设置在调节器背部支撑件和调节器组件的中间。护发背部支撑件包括可调节地支撑背板的框架组件。框架组件包括允许使用者调整背板的位置的定位组件。可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。

4. 发明授权

US6000997A Temperature regulation in a CMP process 失效
标题翻译： CMP工艺中的温度调节
公开(公告)号：US6000997A
公开(公告)日：1999-12-14
申请号：US113450
申请日：1998-07-10
申请人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
发明人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14
CPC分类号： B24B37/015 , B24B21/04
摘要： Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.
摘要翻译：热量在线性CMP带和相邻的传热源之间传递，从而提供穿过带的预定横向温度分布。温度传感器产生反馈信号来控制传热源。或者，过程监控传感器提供反馈信号。传热源可以包括具有不同温度的多个选择性可控的单个热传递源，其可以高于或低于环境温度。传热的机理可以包括一个或多个对流，传导和辐射。该配置提供了大量灵活性，以建立和保持穿过抛光带的选择性不均匀的温度分布。这又允许精确的控制和抛光过程的稳定性。传热源可以包括滑轮，浆液分配器，抛光垫调节器或调节器背部支撑件，流体喷嘴和密封的流体腔体带支撑件。

5. 发明授权

US6159083A Polishing head for a chemical mechanical polishing apparatus 失效
标题翻译：抛光头用于化学机械抛光装置
公开(公告)号：US6159083A
公开(公告)日：2000-12-12
申请号：US116160
申请日：1998-07-15
申请人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
发明人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
IPC分类号： B24B37/30 , B24B7/22
CPC分类号： B24B37/30 , Y10S977/775 , Y10S977/888
摘要： A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
摘要翻译：用于化学机械抛光（CMP）装置的抛光头。抛光头包括背板，由背板支撑的保持环和由保持环包围的气囊构件。抛光头的背板包括通过波纹管偏压耦合到副载波的驱动板。抛光头还可以包括设置在副载架上并在气囊构件下方的提升板。抛光衬底的方法包括将衬底放置在气囊构件上并将衬底定位在抛光垫上，使得气囊构件在衬底上施加选定的压力分布。

6. 发明授权

US6080040A Wafer carrier head with inflatable bladder and attack angle control for polishing 失效
标题翻译：晶圆承载头带充气气囊和攻角控制抛光
公开(公告)号：US6080040A
公开(公告)日：2000-06-27
申请号：US965033
申请日：1997-11-05
申请人： Gregory A. Appel , Ethan C. Wilson , Shou-sung Chang
发明人： Gregory A. Appel , Ethan C. Wilson , Shou-sung Chang
IPC分类号： B24B21/04 , B24B37/04 , B24B49/00 , H01L21/304
CPC分类号： B24B49/00 , B24B21/04 , B24B37/04
摘要： A carrier head that holds an object such as a wafer for a polishing system can be rotated during polishing. One such carrier head includes a sensor that determines the relative orientation of (or the angle between) a movable chuck and a fixed drive structure. A control system uses these measurements to select the edge pressure applied to the wafer or the chuck to control the attack angle of the wafer against polishing pads. By actively adjusting the attack angle, a carrier head can accommodate torques about an axis not in the plane of contact between the wafer and the polishing pad even when the wafer is otherwise free to rotate about the axis. One carrier head includes a drive plate with projections ending with balls that are disposed in matching openings in a carrier plate. Radial elongation of openings and curvature of the balls permit rotation of the carrier plate about an axis in plane passing between the carrier and drive plates. Another aspect of the invention provides a flexible bladder connected to a conduit formed in a drive shaft of the carrier head. A wafer is mounted adjacent the bladder so that pressure from the conduit causes the bladder to expand and apply a uniform pressure to the wafer for polishing.
摘要翻译：保持诸如用于抛光系统的晶片的物体的载体头可以在抛光期间旋转。一个这样的载体头包括确定可移动卡盘和固定驱动结构之间的（或其角度）的相对取向的传感器。控制系统使用这些测量来选择施加到晶片或卡盘的边缘压力，以控制晶片对抛光垫的攻角。通过主动地调整攻角，载体头可以适应不是在晶片和抛光垫之间的接触平面中的轴的扭矩，即使当晶片绕其轴线自由旋转时也是如此。一个承载头包括具有以滚珠结束的突起的驱动板，其布置在承载板中的匹配开口中。开口的径向伸长率和滚珠的曲率允许承载板围绕载体和驱动板之间的平面轴线旋转。本发明的另一方面提供一种连接到形成在承载头的驱动轴中的导管的柔性囊。晶片邻近气囊安装，使得来自导管的压力导致气囊膨胀，并向晶片施加均匀的压力用于抛光。

7. 发明授权

US5980368A Polishing tool having a sealed fluid chamber for support of polishing pad 失效
标题翻译：抛光工具具有用于支撑抛光垫的密封流体室
公开(公告)号：US5980368A
公开(公告)日：1999-11-09
申请号：US964774
申请日：1997-11-05
申请人： Shou-sung Chang , Shu-Hsin Kao , David E. Weldon
发明人： Shou-sung Chang , Shu-Hsin Kao , David E. Weldon
IPC分类号： B24B21/04 , B24B37/16 , B24B49/16 , B24B57/02 , H01L21/306 , B24B21/00
CPC分类号： B24B57/02 , B24B21/04 , B24B37/16 , B24B49/16
摘要： A polishing tool uses a seal cavity containing a fluid that supports polishing pads against an object being polished. In one embodiment, the boundaries of the cavity include a support structure, a portion of a polishing material, and a seal between the support structure and the polishing material. The polishing material moves relative to the support structure and seal. A variety of seal configuration can maintain the fluid within the cavity. One seal includes an o-ring that the force of a spring, a magnet, or air pressure presses against the polishing material. A gas flow from outside the cavity or from an inlet inside the cavity can form a gas pocket in the cavity, adjacent the o-ring, to prevent leakage of the fluid past the o-ring. Another seal is formed by an aerostatic bearing. The fluid pressure in the cavity can be varied temporally to create vibrations in the polishing material to enhance polishing performance or can be varied spatially to change the pressure profile. One embodiment of the invention includes one or more fluid inlet/outlets to the cavity, one or more pressure regulators, and a controller that operates the pressure regulators to control the pressure in the cavity. In polishers with or without a sealed fluid cavity, the support structure can include actuators that control the orientation of the support structure relative to polishing material. Sensors and a feedback control system positions the support structure for polishing.
摘要翻译：抛光工具使用包含支撑抛光垫的流体的密封腔，该抛光垫抵靠被抛光的物体。在一个实施例中，空腔的边界包括支撑结构，抛光材料的一部分以及支撑结构和抛光材料之间的密封。抛光材料相对于支撑结构移动并进行密封。各种密封配置可以保持腔内的流体。一个密封件包括一个O形环，弹簧的力，磁体或空气压力压在抛光材料上。从空腔外部或从空腔内的入口流出的气流可以在空腔中形成邻近O形环的气穴，以防止流体经过O形环的泄漏。另一个密封由空气静力轴承形成。空腔中的流体压力可以在时间上变化以在抛光材料中产生振动以增强抛光性能，或者可以在空间上改变以改变压力分布。本发明的一个实施例包括到空腔的一个或多个流体入口/出口，一个或多个压力调节器以及操作压力调节器以控制空腔中的压力的控制器。在具有或不具有密封流体腔的抛光机中，支撑结构可以包括控制支撑结构相对于抛光材料的取向的致动器。传感器和反馈控制系统定位用于抛光的支撑结构。

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