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    • 5. 发明申请
    • ELECTRODE ASSEMBLY AND PLASMA PROCESSING CHAMBER UTILIZING THERMALLY CONDUCTIVE GASKET
    • 电极组件和等离子体加热室,采用导热气体
    • US20090236040A1
    • 2009-09-24
    • US12050195
    • 2008-03-18
    • Roger PatrickRaj DhindsaGreg BettencourtAlexei Marakhtanov
    • Roger PatrickRaj DhindsaGreg BettencourtAlexei Marakhtanov
    • H01L21/3065C23C16/44C23C16/513
    • C23C16/45565H01J37/32541H01J37/32724
    • The present invention relates generally to plasma processing and, more particularly, to plasma processing chambers and electrode assemblies used therein. According to one embodiment of the present invention, an electrode assembly is provided comprising a thermal control plate, a silicon-based showerhead electrode, and a thermally conductive gasket, wherein respective profiles of a frontside of the thermal control plate and a backside of the showerhead electrode cooperate to define a disjointed thermal interface comprising portions proximal to showerhead passages of the showerhead electrode and portions displaced from the showerhead passages. The displaced portions are recessed relative to the proximal portions and are separated from the showerhead passages by the proximal portions of the thermal interface. The gasket is positioned along the displaced portions such that the gasket is isolated from the showerhead passages and may facilitate heat transfer across the thermal interface from the showerhead electrode to the thermal control plate.
    • 本发明一般涉及等离子体处理,更具体地,涉及其中使用的等离子体处理室和电极组件。 根据本发明的一个实施例,提供了一种电极组件,其包括热控制板,硅基喷头电极和导热衬垫,其中热控制板的前侧和喷头的背面的各自的轮廓 电极配合以限定不连接的热界面,其包括靠近喷头电极的喷头通道的部分和从喷头通道移位的部分。 移位部分相对于近端部分凹陷,并且通过热界面的近端部分与喷头通道分离。 垫圈沿着移位的部分定位,使得垫圈与喷头通道隔离,并且可以促进跨过从喷头电极到热控制板的热界面的热传递。
    • 6. 发明授权
    • Electrode assembly and plasma processing chamber utilizing thermally conductive gasket
    • 使用导热垫片的电极组件和等离子体处理室
    • US08187413B2
    • 2012-05-29
    • US12050195
    • 2008-03-18
    • Roger PatrickRaj DhindsaGreg BettencourtAlexei Marakhtanov
    • Roger PatrickRaj DhindsaGreg BettencourtAlexei Marakhtanov
    • C23F1/00H01L21/306C23C16/00
    • C23C16/45565H01J37/32541H01J37/32724
    • The present invention relates generally to plasma processing and, more particularly, to plasma processing chambers and electrode assemblies used therein. According to one embodiment of the present invention, an electrode assembly is provided comprising a thermal control plate, a silicon-based showerhead electrode, and a thermally conductive gasket, wherein respective profiles of a frontside of the thermal control plate and a backside of the showerhead electrode cooperate to define a disjointed thermal interface comprising portions proximal to showerhead passages of the showerhead electrode and portions displaced from the showerhead passages. The displaced portions are recessed relative to the proximal portions and are separated from the showerhead passages by the proximal portions of the thermal interface. The gasket is positioned along the displaced portions such that the gasket is isolated from the showerhead passages and may facilitate heat transfer across the thermal interface from the showerhead electrode to the thermal control plate.
    • 本发明一般涉及等离子体处理,更具体地,涉及其中使用的等离子体处理室和电极组件。 根据本发明的一个实施例,提供一种电极组件,其包括热控制板,硅基喷头电极和导热衬垫,其中热控制板的前侧和喷头的背面的各自的轮廓 电极配合以限定不连接的热界面,其包括靠近喷头电极的喷头通道的部分和从喷头通道移位的部分。 移位部分相对于近端部分凹陷,并且通过热界面的近端部分与喷头通道分离。 垫圈沿着移位的部分定位,使得垫圈与喷头通道隔离,并且可以促进跨过从喷头电极到热控制板的热界面的热传递。
    • 9. 发明授权
    • Plasma processor with electrode responsive to multiple RF frequencies
    • 等离子体处理器,电极响应多个RF频率
    • US07169256B2
    • 2007-01-30
    • US10855706
    • 2004-05-28
    • Raj DhindsaFelix KozakevichDavid Douglas Trussell
    • Raj DhindsaFelix KozakevichDavid Douglas Trussell
    • H01L21/306
    • H01J37/32174H01J37/32082H01J37/32165H01J37/3299
    • A plasma processor processing a workpiece includes sources having frequencies 2 MHz, 27 MHz, and 60 MHz, applied by three matching networks to an electrode in a vacuum chamber including the workpiece. Alternatively 60 MHz is applied to a second electrode by a fourth matching network. The matching networks, substantially tuned to the frequencies of the sources driving them, include series inductances so the 2 MHz inductance exceeds the 27 MHz network inductance, and the 27 MHz network inductance exceeds the inductances of the 60 MHz networks. The matching networks attenuate by at least 26 DB the frequencies of the sources that do not drive them. Shunt inductors between the 27 and 60 MHz sources decouple 2 MHz from the 27 and 60 MHz sources. A series resonant circuit (resonant to about 5 MHz) shunts the 2 MHz network and the electrode to help match the 2 MHz source to the electrode.
    • 处理工件的等离子体处理器包括频率为2MHz,27MHz和60MHz的源,由三个匹配网络施加到包括工件的真空室中的电极。 或者通过第四匹配网络将60MHz施加到第二电极。 基本上调谐到驱动它们的源的频率的匹配网络包括串联电感,因此2MHz电感超过27MHz网络电感,并且27MHz网络电感超过60MHz网络的电感。 匹配网络衰减至少26 DB的驱动它们的源的频率。 27和60 MHz信号源之间的并联电感将2 MHz与27 MHz和60 MHz源分离。 串联谐振电路(谐振到约5 MHz)分流2 MHz网络和电极,以帮助将2 MHz源极与电极相匹配。
    • 10. 发明授权
    • Apparatus and method for controlling etch uniformity
    • 用于控制蚀刻均匀性的装置和方法
    • US08674255B1
    • 2014-03-18
    • US11298804
    • 2005-12-08
    • Eric LenzRaj DhindsaDave TrussellLumin Li
    • Eric LenzRaj DhindsaDave TrussellLumin Li
    • H01J7/24B23K9/00
    • B23K10/003B23K10/006B23K2101/40H01J37/32091H01J37/32183H01J37/32642
    • A plasma processing system is provided. The plasma processing system includes a radio frequency (RF) power generator configured to have a tunable frequency power output, the frequency output being adjustable within a range. A processing chamber having a bottom electrode and a top electrode is included. A plasma region being defined between the bottom and top electrodes and the processing chamber receives RF power from the RF power generator. A match network is coupled between the RF power generator and the processing chamber. The match network has a first tunable element and a second tunable element. The first tunable element adjusts a split between a first grounding pathway defined within an inner region of the plasma region and a second grounding pathway defined within an outer region of the plasma region. The second tunable element adjusts a load delivered to the processing chamber from the power generator.
    • 提供等离子体处理系统。 等离子体处理系统包括被配置为具有可调频率功率输出的射频(RF)功率发生器,该频率输出可在一个范围内调节。 包括具有底部电极和顶部电极的处理室。 定义在底部和顶部电极之间的等离子体区域,并且处理室从RF发生器接收RF功率。 匹配网络耦合在RF发电机和处理室之间。 匹配网络具有第一可调元素和第二可调元素。 第一可调谐元件调节限定在等离子体区域的内部区域内的第一接地路径和限定在等离子体区域的外部区域内的第二接地路径之间的分裂。 第二可调元件调节从发电机输送到处理室的负载。