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1. 发明授权

US07104312B2 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 有权
标题翻译：用于在发热装置中实现温度均匀性和热点冷却的方法和装置
公开(公告)号：US07104312B2
公开(公告)日：2006-09-12
申请号：US10698304
申请日：2003-10-30
申请人： Kenneth Goodson , Thomas Kenny , Peng Zhou , Girish Upadhya , Mark Munch , Mark McMaster , James Horn
发明人： Kenneth Goodson , Thomas Kenny , Peng Zhou , Girish Upadhya , Mark Munch , Mark McMaster , James Horn
IPC分类号： F28F7/00
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。通过优化和控制热交换器中的流体和热电阻来最小化温差。对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

2. 发明申请

US20050211418A1 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 审中-公开
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US20050211418A1
公开(公告)日：2005-09-29
申请号：US10882132
申请日：2004-06-29
申请人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/00 , H01L23/473 , H04L29/06 , F28F7/00
CPC分类号： H01L23/4735 , F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F7/02 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2260/02 , G06F1/20 , G06Q20/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

3. 发明授权

US07000684B2 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US07000684B2
公开(公告)日：2006-02-21
申请号：US10680584
申请日：2003-10-06
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

4. 发明申请

US20070034356A1 Cooling systems incorporating heat exchangers and thermoelectric layers 有权
标题翻译：包括热交换器和热电层的冷却系统
公开(公告)号：US20070034356A1
公开(公告)日：2007-02-15
申请号：US11582657
申请日：2006-10-17
申请人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： H05K7/20
CPC分类号： F04B17/00 , F04B19/006 , F25B21/02 , F25B2321/0252 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/02 , F28F2260/02 , G06F1/20 , G06F2200/201 , G06Q20/20 , H01L23/38 , H01L23/473 , H01L23/4735 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling a heat source are presented. The system includes a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat rejector configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in a cooling system to enhance the cooling efficiency of the system.
摘要翻译：提出了一种用于冷却热源的方法和系统。该系统包括流体热交换器，泵，具有冷却部分和加热部分的热电装置，以及配置为与热电装置的加热部分的至少一部分热接触的散热器。泵与流体热交换器联接并且构造成使流体通过其中。热电装置与冷却系统中的热交换器一起配置，以提高系统的冷却效率。

5. 发明授权

US08464781B2 Cooling systems incorporating heat exchangers and thermoelectric layers 有权
标题翻译：包括热交换器和热电层的冷却系统
公开(公告)号：US08464781B2
公开(公告)日：2013-06-18
申请号：US11582657
申请日：2006-10-17
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20 , F25B21/02
CPC分类号： F04B17/00 , F04B19/006 , F25B21/02 , F25B2321/0252 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/02 , F28F2260/02 , G06F1/20 , G06F2200/201 , G06Q20/20 , H01L23/38 , H01L23/473 , H01L23/4735 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.
摘要翻译：用于冷却热源的系统包括流体热交换器，泵，热电装置和散热器。热电装置包括冷却部和加热部。散热器构造成与热电装置的加热部分的至少一部分热接触。泵与流体热交换器联接并且构造成使流体通过其中。热电装置与冷却系统中的热交换器一起构成。

6. 发明申请

US20070201204A1 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US20070201204A1
公开(公告)日：2007-08-30
申请号：US11707350
申请日：2007-02-16
申请人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

7. 发明授权

US07599184B2 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US07599184B2
公开(公告)日：2009-10-06
申请号：US11707350
申请日：2007-02-16
申请人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

8. 发明授权

US07188662B2 Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效流体输送的装置和方法
公开(公告)号：US07188662B2
公开(公告)日：2007-03-13
申请号：US11049313
申请日：2005-02-01
申请人： Richard Grant Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
发明人： Richard Grant Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
IPC分类号： F28D7/02
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
摘要翻译：热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。热交换器包括热量从热源传递到流体的界面层。歧管层耦合到界面层。歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。上层可以包括多个突出特征和多孔结构中的至少一个。优选地，多孔结构沿着界面层设置。

9. 发明申请

US20050269061A1 Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效流体输送的装置和方法
公开(公告)号：US20050269061A1
公开(公告)日：2005-12-08
申请号：US11049313
申请日：2005-02-01
申请人： Richard Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
发明人： Richard Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
摘要翻译：热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。热交换器包括热量从热源传递到流体的界面层。歧管层耦合到界面层。歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。上层可以包括多个突出特征和多孔结构中的至少一个。优选地，多孔结构沿着界面层设置。

10. 发明申请

US20080210405A1 Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems 有权
标题翻译：制造高表面与体积比的结构及其集成在液体冷却系统的微型换热器中
公开(公告)号：US20080210405A1
公开(公告)日：2008-09-04
申请号：US11326690
申请日：2006-01-06
申请人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
发明人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
IPC分类号： F28F27/02 , B21D53/02
CPC分类号： F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2245/04 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49366 , Y10T29/49369 , H01L2924/00
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

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