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    • 4. 发明授权
    • Semiconductor resistor using back-to-back zener diodes
    • 半导体电阻采用背对背齐纳二极管
    • US5760450A
    • 1998-06-02
    • US828238
    • 1997-03-31
    • Godefridus A. M. HurkxJan W. SlotboomAndreas H. Montree
    • Godefridus A. M. HurkxJan W. SlotboomAndreas H. Montree
    • H01L27/04H01L21/822H01L23/64H01L27/08H01L29/8605H01L29/866H01L29/78
    • H01L29/866H01L27/0814H01L29/8605
    • Very high resistance values may be necessary in integrated circuits, for example in the gigaohm range, for example for realizing RC times of 1 ms to 1 s. Such resistance values cannot or substantially not be realized by known methods in standard i.c. processes because of the too large space occupation. In addition, known embodiments are usually strongly dependent on the temperature. According to the invention, therefore, two zener diodes (10, 4; 11, 4) connected back-to-back are used as the resistor. The current through each zener diode is mainly determined by band--band tunneling when the voltage is not too high, for example up to approximately 0.2 V. This current has a value such that resistors in the giga range can be readily realized on a small surface area. Since the current is mainly determined by intrinsic material properties of silicon, the temperature dependence is very small. The resistor may furthermore be manufactured in any standard CMOS process or bipolar process.
    • 在集成电路中可能需要非常高的电阻值,例如在高戈范围内,例如用于实现1ms至1s的RC时间。 这种电阻值不能或基本上不能通过标准电流中的已知方法来实现。 因为占用空间太大。 此外,已知的实施方案通常强烈地依赖于温度。 因此,根据本发明,使用背对背连接的两个齐纳二极管(10,4; 11,4)作为电阻器。 通过每个齐纳二极管的电流主要由电压不太高(例如高达约0.2V)时的带带隧穿确定。该电流具有这样的值,使得可以在小的表面上容易地实现千兆范围内的电阻 区。 由于电流主要取决于硅的固有材料性质,因此温度依赖性非常小。 此外,电阻器可以以任何标准CMOS工艺或双极工艺制造。
    • 5. 发明授权
    • Charge carrier stream generating electronic device and method
    • 电荷载流子流生成电子器件及方法
    • US08362821B2
    • 2013-01-29
    • US12743400
    • 2008-11-12
    • Tony VanhouckeGodefridus A. M. HurkxJan W. Slotboom
    • Tony VanhouckeGodefridus A. M. HurkxJan W. Slotboom
    • H03K17/00H03K17/60
    • G11C13/0004
    • An electronic device comprising a generator for generating a stream of charge carriers. The generator comprises a bipolar transistor having an emitter region, a collector region and a base region oriented between the emitter region and the collector region, and a controller for controlling exposure of the bipolar transistor to a voltage in excess of its open base breakdown voltage (BVCEO) such that the emitter region generates the stream of charge carriers from a first area being smaller than the emitter region surface area. The electronic device may further comprise a material arranged to receive the stream of charge carriers for triggering a change in a property of said material, the emitter region being arranged between the base region and the material.
    • 一种电子设备,包括用于产生电荷载流子的发生器。 发生器包括双极晶体管,其具有发射极区域,集电极区域和定向在发射极区域和集电极区域之间的基极区域;以及控制器,用于控制双极晶体管的暴露于超过其开路基极击穿电压的电压( BVCEO),使得发射极区域从小于发射极区域表面积的第一区域产生电荷载流子。 电子设备还可以包括布置成接收电荷载流子的材料,用于触发所述材料的性质的变化,发射极区域布置在基底区域和材料之间。
    • 6. 发明授权
    • Semiconductor device with a tunnel diode and method of manufacturing same
    • US06242762B1
    • 2001-06-05
    • US09078231
    • 1998-05-13
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerJan W. Slotboom
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerJan W. Slotboom
    • H01L29861
    • H01L29/885Y10S438/979
    • A semiconductor device with a tunnel diode (23) is particularly suitable for various applications. Such a device comprises two mutually adjoining semiconductor regions (2, 3) of opposed conductivity types and having doping concentrations which are so high that breakdown between them leads to conduction by means of tunnelling. A disadvantage of the known device is that the current-voltage characteristic is not yet steep enough for some applications. In a device according to the invention, the portions (2A, 3A) of the semiconductor regions (2, 3) adjoining the junction (23) comprise a mixed crystal of silicon and germanium. It is surprisingly found that the doping concentration of both phosphorus and boron are substantially increased, given the same amount of dopants being offered as during the formation of the remainder of the regions (2, 3). The tunnelling efficiency is substantially improved as a result of this, and also because of the reduced bandgap of said portions (2A, 3A), and the device according to the invention has a much steeper current-voltage characteristic both in the forward and in the reverse direction. This opens perspectives for inter alia an attractive application where the tunnelling pn junction (23) is used as a transition between two conventional diodes, for example pn or pin diodes, which are used one stacked on the other and which can be formed in a single epitaxial growing process thanks to the invention. The portions (2A, 3A) adjoining the tunnelling junction (22) are preferably 5 to 30 nm thick and comprise between 10 and 50 at % germanium. The doping concentration may be 6×1019 or even more than 1020 at/cm3. The invention further relates to a simple method of manufacturing a device according to the invention. This is preferably done at a temperature of between 550° C. and 800° C.
    • 9. 发明授权
    • Trench semiconductor devices
    • 沟槽半导体器件
    • US06605862B2
    • 2003-08-12
    • US10068921
    • 2002-02-07
    • Rob Van DalenChristelle RochefortGodefridus A. M. Hurkx
    • Rob Van DalenChristelle RochefortGodefridus A. M. Hurkx
    • H01L29414
    • H01L29/405H01L29/408H01L29/41766H01L29/7802H01L29/7813H01L29/861
    • A semiconductor device, such as a MOSFET or PN diode rectifier, has a p-n junction (24) between a first device region (23) and an underlying voltage-sustaining zone (20). Trenched field-shaping regions (40) extend through the voltage-sustaining zone (20) to improve the voltage-blocking and on-resistance characteristics of the device. The trenched field-shaping region (40) comprises a resistive path (42) accommodated in a trench (41) that has an insulating layer (44) at its side-walls. The insulating layer (44) dielectrically couples potential from the resistive path (42) to the voltage-sustaining zone (20) that is depleted in a voltage-blocking mode of operation of the device. The insulating layer (44) extends at the side-walls of the trench (41) to an upper level (81) that is higher than a lower level (82) at which the resistive path (42) starts in the trench (41). This lower level (82) is more closely aligned to the p-n junction (24) and is protected by the insulating layer (44) extending to the higher level (81). This construction enables the electric field distribution in the voltage-sustaining zone (20) to be improved by aligning very closely the start of the potential drop along the resistive path (42) with the p-n junction depth (d).
    • 诸如MOSFET或PN二极管整流器的半导体器件在第一器件区域(23)和下伏电压维持区(20)之间具有p-n结(24)。 倾斜的场成形区域(40)延伸通过电压维持区域(20),以改善装置的压阻和导通电阻特性。 沟槽场整形区域(40)包括容纳在其侧壁上具有绝缘层(44)的沟槽(41)中的电阻路径(42)。 绝缘层(44)将电阻从电阻路径(42)介电地耦合到耗尽该器件的电压阻断模式的电压维持区(20)。 绝缘层(44)在沟槽(41)的侧壁处延伸到高于电阻路径(42)在沟槽(41)中开始的较低电平(82)的上电平(81) 。 该较低电平(82)与p-n结(24)更紧密地对准,并被延伸到较高电平(81)的绝缘层(44)保护。 这种结构使得能够通过非常接近地沿着电阻路径(42)与p-n结深度(d)非常接近的电位降的起始来提高电压维持区(20)中的电场分布。
    • 10. 发明授权
    • Enhanced flux semiconductor device with mesa and method of manufacturing same
    • 具有台面的增强型通量半导体器件及其制造方法
    • US06459133B1
    • 2002-10-01
    • US09545782
    • 2000-04-07
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerHendrik G. A. HuizingEddie Huang
    • Adam R. BrownGodefridus A. M. HurkxWiebe B. De BoerHendrik G. A. HuizingEddie Huang
    • H01L2358
    • H01L29/8618
    • The invention relates to a so-called punch-through diode with a mesa (12) comprising, in succession, a first (1), a second (2) and a third (3) semiconductor region (1) of, respectively, a first, a second and the first conductivity type, which punch-through diode is provided with two connection conductors (5, 6). During operation of said diode, a voltage is applied such that the second semiconductor region (2) is fully depleted. A drawback of the known punch-through diode resides in that the current flow is too large at lower voltages. In a punch-through diode according to the invention, a part (2A, 2B) of the second semiconductor region (2), which, viewed in projection, borders on the edge of the mesa (12), is provided with a larger flux of doping atoms of the second conductivity type than the remainder (2A) of the second semiconductor region (2). It has been found that the high current at a low voltage of the known diode is caused by the fact that the second semiconductor region (2) at the edge of the mesa (12) is depleted before the remainder of the second semiconductor region (2). By locally increasing the flux of doping atoms, the depletion at the edge is delayed as compared to the remainder of the second semiconductor region. Preferably, this result is obtained by locally increasing the thickness of the second semiconductor region (2). In this manner, a substantial current reduction at lower voltages is obtained in the diode in accordance with the invention.
    • 本发明涉及一种所谓的穿通二极管,其具有台面(12),它们分别包括第一(1),第二(2)和第三(3)半导体区域(1) 第一和第二导电类型,该穿通二极管设置有两个连接导体(5,6)。 在所述二极管的操作期间,施加电压使得第二半导体区域(2)完全耗尽。 已知的穿通二极管的缺点在于电流在较低的电压下太大。 在根据本发明的穿通二极管中,第二半导体区域(2)的一部分(2A,2B)在投影面上与台面(12)的边缘相邻地设置有较大的通量 的第二导电类型的掺杂原子比第二半导体区域(2)的其余部分(2A)。 已经发现,已知二极管的低电压下的高电流是由于在第二半导体区域(2)的剩余部分之前在台面(12)的边缘处的第二半导体区域(2)被耗尽的事实引起的, )。 通过局部增加掺杂原子的通量,与第二半导体区域的剩余部分相比,边缘处的耗尽被延迟。 优选地,通过局部增加第二半导体区域(2)的厚度来获得该​​结果。 以这种方式,在根据本发明的二极管中获得在较低电压下的实质电流降低。