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    • 10. 发明授权
    • End effector for substrate handling and method for making the same
    • 用于底物处理的末端执行器及其制造方法
    • US6073828A
    • 2000-06-13
    • US107917
    • 1998-06-30
    • Edmund L. MaChristopher O. LadaDonald H. Langhans
    • Edmund L. MaChristopher O. LadaDonald H. Langhans
    • H01L21/687B23K31/00
    • H01L21/68707
    • An end effector has a tower with non-stacked spatulas. Tolerance stacking is avoided by making grooves in the tower relative to a common reference surface, and mounting the spatulas in such grooves. The grooves are provided in separate planar walls of the tower. The walls intersect to enhance the structural properties of the tower. The tower has a dual-purpose clamp formed integrally with one wall for use in assembling the tower and the spatulas, and for mounting the completed end effector in a load lock. The spatula may carry a wafer during various operations, e.g., semiconductor processing, material deposition and etching systems, or in flat panel display processing systems. The carrying of the wafers is notwithstanding vibration of equipment for performing the manufacturing operations, which vibration is primarily in a range of frequencies. Each spatula is formed with a planar platform having an aperture formed therein such that the platform carrying the wafer has a resonant frequency dimensioned so that the resonant frequency while carrying the wafer is outside of the range of frequencies of the equipment vibration. Holes are provided around the aperture, and the spatula is provided with a pad for assembly with each of the holes. Each of the pads has a wafer support surface and a plurality of legs depending from the support surface. The legs are flexed to permit reception of the pad in one of the holes. Methods are disclosed for making the tower, the spatulas, and the end effector with these features.
    • 末端执行器具有具有非堆叠刮刀的塔。 通过在塔中相对于公共参考表面形成凹槽并将刮刀安装在这种凹槽中来避免公差堆叠。 凹槽设置在塔的分开的平面壁中。 墙壁相交以增强塔的结构性能。 该塔具有与一个壁一体形成的双重用途的夹具,用于组装塔和刮铲,并将完整的末端执行器安装在装载锁中。 刮刀可以在各种操作(例如半导体处理,材料沉积和蚀刻系统)或平板显示处理系统中承载晶片。 尽管用于执行制造操作的设备的振动,晶片的携带也是如此,该振动主要在一定频率范围内。 每个刮刀形成有平面平台,其具有形成在其中的孔,使得承载晶片的平台具有谐振频率的尺寸,使得承载晶片的谐振频率在设备振动的频率范围之外。 孔设置在孔的周围,并且刮刀设置有用于与每个孔组装的垫。 每个焊盘具有晶片支撑表面和从支撑表面悬垂的多个支脚。 腿弯曲以允许在其中一个孔中接收垫。 公开了用于制造具有这些特征的塔,刮铲和末端执行器的方法。