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1. 发明申请

US20060084282A1 Porous organosilicates with improved mechanical properties 有权
标题翻译：具有改善机械性能的多孔有机硅酸盐
公开(公告)号：US20060084282A1
公开(公告)日：2006-04-20
申请号：US11031418
申请日：2005-01-07
申请人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
发明人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
IPC分类号： H01L21/31
CPC分类号： H01L21/7682 , H01L21/02126 , H01L21/02203 , H01L21/02214 , H01L21/02282 , H01L21/02343 , H01L21/31633 , H01L21/31695 , H01L2221/1047
摘要： Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators (porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3-6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims.
摘要翻译：氧碳硅烷材料制成优良的基质材料，用于形成使用并入的孔隙发生器（致孔剂）的多孔低k材料。以这种方式制备的多孔样品测量的弹性模量数是使用牺牲致孔剂途径制备的多孔有机硅酸盐的3-6倍。氧碳硅烷材料用于生产用于电子设备的集成电路。要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。

2. 发明授权

US07229934B2 Porous organosilicates with improved mechanical properties 有权
标题翻译：具有改善机械性能的多孔有机硅酸盐
公开(公告)号：US07229934B2
公开(公告)日：2007-06-12
申请号：US11031418
申请日：2005-01-07
申请人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
发明人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/7682 , H01L21/02126 , H01L21/02203 , H01L21/02214 , H01L21/02282 , H01L21/02343 , H01L21/31633 , H01L21/31695 , H01L2221/1047
摘要： Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators(porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3–6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices.
摘要翻译：氧碳硅烷材料制成优良的基质材料，用于形成使用并入的孔隙发生器（致孔剂）的多孔低k材料。以这种方式制备的多孔样品测量的弹性模量数是使用牺牲致孔剂途径制备的多孔有机硅酸盐的3-6倍。氧碳硅烷材料用于生产用于电子设备的集成电路。

3. 发明申请

US20070023870A1 Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures 失效
标题翻译：低K层间电介质材料和低K层间介电层和结构的形成方法
公开(公告)号：US20070023870A1
公开(公告)日：2007-02-01
申请号：US11190644
申请日：2005-07-27
申请人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Muthumanickam Sankarapandian , Linda Sundberg , Willi Volksen
发明人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Muthumanickam Sankarapandian , Linda Sundberg , Willi Volksen
IPC分类号： H01L23/58 , H01L21/4763
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
摘要翻译：使用该组合物制造的物质组成和结构。所述组合物包含：树脂; 分散在树脂中的聚合物纳米颗粒，每个聚合纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物的悬置聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物与树脂; 和溶剂，所述溶剂在第一温度下挥发，所述树脂在第二温度下可交联，所述聚合物纳米颗粒在第三温度下可分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度，其中在从第二温度到第三温度的层之间加热组合物的层的厚度收缩小于约3.5％。

4. 发明申请

US20060240240A1 Nanoporous media with lamellar structures 失效
公开(公告)号：US20060240240A1
公开(公告)日：2006-10-26
申请号：US11111055
申请日：2005-04-20
申请人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
发明人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
IPC分类号： B32B3/26
CPC分类号： H01L21/3121 , G03F7/0002 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/31695 , Y10T428/249953 , Y10T428/31663
摘要： A nanoporous material exhibiting a lamellar structure is disclosed. The material comprises three or more substantially parallel sheets of an organosilicate material, separated by highly porous spacer regions. The distance between the centers of the sheets lies between 1 nm and 50 nm. The highly porous spacer regions may be substantially free of condensed material. For the manufacture of such materials, a process is disclosed in which matrix non-amphiphilic polymeric material and templating polymeric material are dispersed in a solvent, where the templating polymeric material includes a polymeric amphiphilic material. The solvent with the polymeric materials is distributed onto a substrate. Organization is induced in the templating polymeric material. The solvent is removed, leaving the polymeric materials in place. The matrix polymeric material is cured, forming a lamellar structure.

5. 发明申请

US20060241194A1 Nanoporous media templated from unsymmetrical amphiphilic porogens 有权
公开(公告)号：US20060241194A1
公开(公告)日：2006-10-26
申请号：US11111343
申请日：2005-04-20
申请人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
发明人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
IPC分类号： C08J9/00
CPC分类号： C08G63/66 , C08J9/26 , C08K5/5419 , C08L67/00 , C08L83/04 , C08L83/00
摘要： Substantially or roughly spherical micellar structures useful in the formation of nanoporous materials by templating are disclosed. A roughly spherical micellar structure is formed by organization of one or more spatially unsymmetric organic amphiphilic molecules. Each of those molecules comprises a branched moiety and a second moiety. The branched moiety can form part of either the core or the surface of the spherical micellar structure, depending on the polarity of the environment. The roughly spherical micellar structures form in a thermosetting polymer matrix. They are employed in a templating process whereby the amphiphilic molecules are dispersed in the polymer matrix, the matrix is cured, and the porogens are then removed, leaving nanoscale pores.

6. 发明申请

US20060247383A1 Surface-decorated polymeric amphiphile porogens for the templation of nanoporous materials 有权
标题翻译：用于纳米多孔材料模板的表面改性聚合物两亲性致孔剂
公开(公告)号：US20060247383A1
公开(公告)日：2006-11-02
申请号：US11119306
申请日：2005-04-28
申请人： James Hedrick , Victor Lee , Teddie Magbitang , Robert Miller
发明人： James Hedrick , Victor Lee , Teddie Magbitang , Robert Miller
IPC分类号： C08F297/02
CPC分类号： C08G83/003
摘要： A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ε-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.
摘要翻译：制备了一种纳米颗粒，其包括附着在芯上的多核芯和表面装饰。通过多种可能途径中的任一种提供多核心核心，示例性的优选途径是由反应性官能化阴离子引发剂引发的活性阴离子聚合和双-MPA树枝状聚合物的ε-己内酯聚合。多臂核心优选在一些或所有臂上功能化。然后使用偶联反应将表面装饰粘合到多臂芯的一个或多个臂上。表面装饰是聚合度小于50的小分子或低聚物，优选的装饰是聚合度为2至24的PEG低聚物。纳米颗粒（粒径<= 10nm）用作牺牲模板致孔剂以形成多孔电介质。将致孔剂与基质前体（例如甲基倍半硅氧烷树脂）混合，基体玻璃化，并通过烧尽除去致孔剂。更大的孔隙度降低了所得电介质的介电常数k。将多孔电介质作为二氧化硅的较低k替代物并入集成电路中。

7. 发明申请

US20050070124A1 Direct photo-patterning of nanoporous organosilicates, and method of use 失效
标题翻译：纳米多孔有机硅酸盐的直接光刻图案及其使用方法
公开(公告)号：US20050070124A1
公开(公告)日：2005-03-31
申请号：US10676422
申请日：2003-09-30
申请人： Robert Miller , Ho-Cheol Kim , Eric Connor , Victor Lee , Gregory Wallraff , Willi Volksen
发明人： Robert Miller , Ho-Cheol Kim , Eric Connor , Victor Lee , Gregory Wallraff , Willi Volksen
IPC分类号： G03F7/075 , G03F7/40 , H01L21/312 , H01L21/316 , H01L21/31
CPC分类号： H01L21/02126 , G03F7/0757 , G03F7/40 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/02348 , H01L21/3122 , H01L21/31695
摘要： A low dielectric constant, patterned, nanoporous material and a method of forming the material. The material is formed by depositing a layer onto a substrate, said layer comprising a reactive organosilicate material, a porogen, an initiator, and a solvent; exposing portions of the layer to energy (e.g., thermal energy or electromagnetic radiation) to change the solubility of portions of the organosilicate material with respect to the solvent; selectively removing more soluble portions of the layer to generate a relief pattern; and decomposing the porogen to thereby generate a nanoporous organosilicate layer.
摘要翻译：低介电常数，图案化，纳米多孔材料和形成材料的方法。该材料通过在基底上沉积一层而形成，所述层包含反应性有机硅酸盐材料，致孔剂，引发剂和溶剂; 将层的部分暴露于能量（例如，热能或电磁辐射）以改变部分有机硅酸盐材料相对于溶剂的溶解度; 选择性地去除层的更多可溶部分以产生浮雕图案; 并分解致孔剂从而产生纳米多孔有机硅酸盐层。

8. 发明申请

US20070196645A1 Method for high density data storage and imaging 有权
标题翻译：高密度数据存储和成像方法
公开(公告)号：US20070196645A1
公开(公告)日：2007-08-23
申请号：US11358774
申请日：2006-02-21
申请人： Urs Duerig , Jane Frommer , Bernd Gotsmann , Erik Hagberg , James Hedrick , Armin Knoll , Victor Lee , Teddie Magbitang , Robert Miller , Russell Pratt , Charles Wade , Johannes Windeln
发明人： Urs Duerig , Jane Frommer , Bernd Gotsmann , Erik Hagberg , James Hedrick , Armin Knoll , Victor Lee , Teddie Magbitang , Robert Miller , Russell Pratt , Charles Wade , Johannes Windeln
IPC分类号： B32B27/00
CPC分类号： G11B9/149 , B82Y10/00 , G11B9/1454 , Y10T428/265 , Y10T428/31721
摘要： An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.
摘要翻译：提出了一种用于设计用于纳米级热机械存储装置的聚合物层的方法。交联聚酰亚胺低聚物用作原子力数据存储装置中的记录层，与先前报道的交联和线性聚合物相比，显着提高了性能。可以调整聚酰亚胺低聚物的交联以匹配读写擦除周期中所需的热和强度参数。另外，交联聚酰亚胺低聚物适用于纳米级成像。

9. 发明申请

US20050202338A1 PREPARATION OF CROSSLINKED PARTICLES FROM POLYMERS HAVING ACTIVATIBLE CROSSLINKING GROUPS 有权
标题翻译：来自具有可交换交联组的聚合物的交联颗粒的制备
公开(公告)号：US20050202338A1
公开(公告)日：2005-09-15
申请号：US10775713
申请日：2004-02-09
申请人： Craig Hawker , Robert Miller , James Hedrick , Victor Lee
发明人： Craig Hawker , Robert Miller , James Hedrick , Victor Lee
IPC分类号： C08J3/12 , C08J3/24 , C08J3/28 , C08J9/04 , H01L21/312 , H01L21/316 , H01L21/768 , H01L23/522 , G03F7/004
CPC分类号： H01L21/02118 , C08J3/24 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/02348 , H01L21/02351 , H01L21/312 , H01L21/316
摘要： Crosslinked particles are provided that are useful in the manufacture of dielectric materials for use in electronic devices such as integrated circuits. The crosslinked particles are prepared by activating crosslinkable groups on synthetic polymer molecules, where the crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles.
摘要翻译：提供交联颗粒，其可用于制造用于诸如集成电路的电子设备中的电介质材料。通过活化合成聚合物分子上的可交联基团来制备交联颗粒，其中可交联基团是惰性的直至活化，并且当活化时，经历不可逆的分子内交联反应以形成交联颗粒。

10. 发明申请

US20050050258A1 High density data storage medium 失效
标题翻译：高密度数据存储介质
公开(公告)号：US20050050258A1
公开(公告)日：2005-03-03
申请号：US10652543
申请日：2003-08-29
申请人： Jane Frommer , Robert Miller , Craig Hawker , Victor Lee
发明人： Jane Frommer , Robert Miller , Craig Hawker , Victor Lee
IPC分类号： G11C13/02 , G11C5/00
CPC分类号： G11C13/0014 , B82Y10/00 , G11B9/1472 , G11B9/149 , G11B11/007 , G11C13/0016 , G11C13/02
摘要： An approach is presented for designing the polymeric recording layer for nanometer scale thermomechanical storage devices. Cross linked polymers are used as the recording layers in atomic force microscopy data storage devices, giving significantly improved performance when compared to the previously reported linear polymers. This results in superior wear resistance and enhanced erasing, critical features for the long-term multiple read-write cycles of such thermomechanical storage devices. In addition, this ability to introduce a predetermined extent of cross linking allows fine tuning of the thermal and force parameters in the R/W/E (read-write-erase) cycles.
摘要翻译：提出了一种用于设计纳米级热机械储存装置的聚合物记录层的方法。交联聚合物用作原子力显微镜数据存储装置中的记录层，与先前报道的线性聚合物相比，显着提高了性能。这导致了这种热机械储存装置的长期多次读写周期的优异的耐磨性和增强的擦除，关键特征。此外，引入预定程度的交联的这种能力允许在R / W / E（读写擦除）周期中微调热和力参数。

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