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    • 1. 发明授权
    • RF plasma reactor with hybrid conductor and multi-radius dome ceiling
    • 射频等离子体反应器与混合导体和多半圆顶天花板
    • US06270617B1
    • 2001-08-07
    • US08778051
    • 1997-01-02
    • Gerald YinDiana Xiabing MaPeter LoewenhardtPhilip SalzmanAllen ZhaoHiroji Hanawa
    • Gerald YinDiana Xiabing MaPeter LoewenhardtPhilip SalzmanAllen ZhaoHiroji Hanawa
    • H05H100
    • H01J37/321
    • An RF plasma reactor for processing a semiconductor wafer in a reactor chamber with a multi-radius dome-shaped ceiling and a gas inlet for supplying a process gas into the chamber includes an overhead RF signal applicator near the ceiling for applying an RF signal into the chamber through the ceiling to maintain a plasma of the process gas in the chamber, the plasma having a radial ion density distribution near the plane of the pedestal which is center-high for a greater height of the ceiling above the pedestal and is center-low for a lesser height, the height of the ceiling being intermediate the greater and lesser heights such that the radial ion density distribution is neither center-high nor center-low. In another aspect of the invention, the RF signal applicator has an annular distribution characterized by an effective mean radius, the plasma having a radial ion density distribution with respect to an axis of symmetry of the ceiling which is center-high for a lesser mean radius of the signal applicator and center-low for a greater mean radius of the signal applicator, the mean radius of the signal applicator being intermediate the greater and lesser mean radii such that the radial ion density distribution is neither center-high nor center-low.
    • 用于在具有多半圆顶形天花板的反应室中处理半导体晶片的RF等离子体反应器和用于将工艺气体供应到室中的气体入口包括在天花板附近的顶置RF信号施加器,用于将RF信号施加到 通过天花板保持腔室中的处理气体的等离子体,等离子体在基座的平面附近具有径向离子密度分布,该基座的平面是中心高的,用于在基座上方的天花板的更高的高度,并且是中心的 对于较小的高度,天花板的高度在较大和较小的高度之间,使得径向离子密度分布既不是中心高也不是中心低。 在本发明的另一方面,RF信号施加器具有由有效平均半径表征的环形分布,等离子体相对于天花板的对称轴线具有径向离子密度分布,其对于较小的平均半径为中心高 并且信号施加器的平均半径更大,信号施加器的平均半径在较大和较小的平均半径之间,使得径向离子密度分布既不是中心高也不是中心低。
    • 2. 发明授权
    • RF plasma reactor with hybrid conductor and multi-radius dome ceiling
    • 射频等离子体反应器与混合导体和多半圆顶天花板
    • US06475335B1
    • 2002-11-05
    • US09658572
    • 2000-09-08
    • Gerald YinDiana Xiabing MaPeter LoewenhardtPhilip SalzmanAllen ZhaoHiroji Hanawa
    • Gerald YinDiana Xiabing MaPeter LoewenhardtPhilip SalzmanAllen ZhaoHiroji Hanawa
    • H05H100
    • H01J37/321
    • An RF plasma reactor for processing a semiconductor wafer in a reactor chamber with a multi-radius dome-shaped ceiling and a gas inlet for supplying a process gas into the chamber includes an overhead RF signal applicator near the ceiling for applying an RF signal into the chamber through the ceiling to maintain a plasma of the process gas in the chamber, the plasma having a radial ion density distribution near the plane of the pedestal which is center-high for a greater height of the ceiling above the pedestal and is center-low for a lesser height, the height of the ceiling being intermediate the greater and lesser heights such that the radial ion density distribution is neither center-high nor center-low. In another aspect of the invention, the RF signal applicator has an annular distribution characterized by an effective mean radius, the plasma having a radial ion density distribution with respect to an axis of symmetry of the ceiling which is center-high for a lesser mean radius of the signal applicator and center-low for a greater mean radius of the signal applicator, the mean radius of the signal applicator being intermediate the greater and lesser mean radii such that the radial ion density distribution is neither center-high nor center-low.
    • 用于在具有多半圆顶形天花板的反应室中处理半导体晶片的RF等离子体反应器和用于将工艺气体供应到室中的气体入口包括在天花板附近的顶置RF信号施加器,用于将RF信号施加到 通过天花板保持腔室中的处理气体的等离子体,等离子体在基座的平面附近具有径向离子密度分布,该基座的平面是中心高的,用于在基座上方的天花板的更高的高度,并且是中心的 对于较小的高度,天花板的高度在较大和较小的高度之间,使得径向离子密度分布既不是中心高也不是中心低。 在本发明的另一方面,RF信号施加器具有由有效平均半径表征的环形分布,等离子体相对于天花板的对称轴线具有径向离子密度分布,其对于较小的平均半径为中心高 并且信号施加器的平均半径更大,信号施加器的平均半径在较大和较小的平均半径之间,使得径向离子密度分布既不是中心高也不是中心低。
    • 4. 发明授权
    • RF plasma reactor with cleaning electrode for cleaning during processing
of semiconductor wafers
    • RF等离子体反应器,其具有用于在半导体晶片的处理期间进行清洁的清洁电极
    • US5817534A
    • 1998-10-06
    • US567376
    • 1995-12-04
    • Yan YeHiroji HanawaDiana Xiaobing MaGerald Zheyao YinPeter LoewenhardtDonald OlgadoJames PapanuSteven S.Y. Mak
    • Yan YeHiroji HanawaDiana Xiaobing MaGerald Zheyao YinPeter LoewenhardtDonald OlgadoJames PapanuSteven S.Y. Mak
    • H05H1/46H01J37/32H01L21/00H01L21/302H01L21/304H01L21/3065H05H1/00
    • H01L21/67028H01J37/32862Y10S438/905
    • The invention is carried out in a plasma reactor for processing a semiconductor wafer, the plasma reactor having a chamber for containing a processing gas and having a conductor connected to an RF power source for coupling RF power into the reactor chamber to generate from the processing gas a plasma inside the chamber, the chamber containing at least one surface exposed toward the plasma and susceptible to contamination by particles produced during processing of the wafer, the invention being carried out by promoting, during processing of the wafer, bombarding of particles from the plasma onto the one surface to remove therefrom contaminants deposited during processing of the wafer. Such promoting of bombarding is carried out by providing an RF power supply and coupling, during processing of the wafer, RF power from the supply to the one surface. The coupling may be performed by a capacitive cleaning electrode adjacent the one surface, the capacitive cleaning electrode connected to the RF power supply. The capacitive cleaning electrode preferably is disposed on a side of the one surface opposite the plasma so as to be protected from contact with the plasma. Alternatively, the coupling may be carried out by a direct electrical connection from the RF power supply to the one surface.
    • 本发明在用于处理半导体晶片的等离子体反应器中进行,等离子体反应器具有用于容纳处理气体的室,并具有连接到RF电源的导体,用于将RF功率耦合到反应器室中以从处理气体产生 腔室内的等离子体,该腔室包含至少一个暴露于等离子体的表面并容易受到在晶片加工期间产生的颗粒的污染,本发明通过在晶片加工期间促进从等离子体中轰击颗粒而进行 在一个表面上去除在晶片加工期间沉积的污染物。 通过在晶片的处理期间提供RF电源和耦合来进行轰击的这种促进是从电源到单个表面的RF功率。 耦合可以通过与一个表面相邻的电容清洁电极,电容清洁电极连接到RF电源来进行。 电容式清洁电极优选地设置在与等离子体相对的一个表面的一侧,以便被保护而不与等离子体接触。 或者,耦合可以通过从RF电源到一个表面的直接电连接来执行。