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    • 3. 发明授权
    • Orientation of electronic devices on mis-cut substrates
    • 电子设备在误切基板上的方向
    • US08378463B2
    • 2013-02-19
    • US12974332
    • 2010-12-21
    • George R. BrandesRobert P. VaudoXueping Xu
    • George R. BrandesRobert P. VaudoXueping Xu
    • H01L29/04
    • H01S5/32341Y10S438/973
    • A microelectronic assembly in which a semiconductor device structure is directionally positioned on an off-axis substrate. In an illustrative implementation, a laser diode is oriented on a GaN substrate wherein the GaN substrate includes a GaN (0001) surface off-cut from the direction predominantly towards either the or the family of directions. For a off-cut substrate, a laser diode cavity may be oriented along the direction parallel to lattice surface steps of the substrate in order to have a cleaved laser facet that is orthogonal to the surface lattice steps. For a off-cut substrate, the laser diode cavity may be oriented along the direction orthogonal to lattice surface steps of the substrate in order to provide a cleaved laser facet that is aligned with the surface lattice steps.
    • 一种微电子组件,其中半导体器件结构定向地定位在离轴衬底上。 在说明性实施方案中,激光二极管定向在GaN衬底上,其中GaN衬底包括从(0001)方向偏离的GaN(0001)表面,主要朝向<11 20>或<1100> 方向。 对于<11 20>截割衬底,激光二极管空腔可以沿着平行于衬底的晶格表面台阶的<100°方向取向,以便具有与表面晶格步骤正交的切割的激光刻面。 对于<100>切割衬底,激光二极管空腔可以沿着与衬底的晶格表面台阶正交的<100°方向取向,以便提供与表面晶格步骤对准的切割的激光刻面。
    • 4. 发明授权
    • Optoelectronic device with upconverting luminophoric medium
    • 具有上转换发光介质的光电器件
    • US08297061B2
    • 2012-10-30
    • US11832785
    • 2007-08-02
    • George R. Brandes
    • George R. Brandes
    • F25B21/00
    • H01L33/644C09K11/7771H01L33/44H01L33/502H01L33/507H01L33/60H01L2224/48091Y10T29/4935H01L2924/00014
    • A microelectronic device that in operation generates or includes component(s) that generate heat, in which the device comprises a heat conversion medium that converts such heat into a light emission having a shorter wavelength than such heat, to thereby cool the device and dissipate the unwanted heat by such light output. The heat conversion medium can include an upconverting luminophoric material, e.g., an anti-Stokes phosphor or phosphor composition. The provision of such heat conversion medium enables thermal management of microelectronic devices, e.g., optoelectronic devices, to be achieved in an efficient manner, to prolong the operational service life of devices such as LEDs, laser diodes, etc. that are degraded in performance by excessive heat generation in their operation.
    • 在运行中产生或包括产生热量的组件的微电子器件,其中该器件包括将这种热转换成具有比该热量更短的波长的光发射的热转换介质,从而冷却该器件并消散 不必要的热量通过这种光输出。 热转换介质可以包括上转换发光体材料,例如反斯托克斯荧光体或磷光体组合物。 提供这样的热转换介质使得能够以有效的方式实现微电子器件(例如光电器件)的热管理,以延长由性能下降的器件(例如LED,激光二极管等)的器件的使用寿命 其运行过热发热。
    • 6. 发明申请
    • PENDEO EPITAXIAL STRUCTURES AND DEVICES
    • PENDEO外形结构和设备
    • US20090152565A1
    • 2009-06-18
    • US11957154
    • 2007-12-14
    • George R. BrandesArpan ChakrabortyShuji NakamuraMonica HansenSteven Denbaars
    • George R. BrandesArpan ChakrabortyShuji NakamuraMonica HansenSteven Denbaars
    • H01L29/20H01L21/76
    • H01L21/02639H01L21/0237H01L21/0254H01L21/0265H01L29/2003H01L29/66462
    • A substrate comprising a trench lateral epitaxial overgrowth structure including a trench cavity, wherein the trench cavity includes a growth-blocking layer or patterned material supportive of a coalescent Pendeo layer thereon, on at least a portion of an inside surface of the trench. Such substrate is suitable for carrying out lateral epitaxial overgrowth to form a bridged lateral overgrowth formation overlying the trench cavity. The bridged lateral overgrowth formation provides a substrate surface on which epitaxial layers can be grown in the fabrication of microelectronic devices such as laser diodes, high electron mobility transistors, ultraviolet light emitting diodes, and other devices in which low dislocation density is critical. The epitaxial substrate structures of the invention can be formed without the necessity for deep trenches, such as are required in conventional Pendeo epitaxial overgrowth structures.
    • 一种衬底,包括包括沟槽腔的沟槽横向外延生长结构,其中所述沟槽腔在所述沟槽的内表面的至少一部分上包括支撑其上的聚结Pendeo层的生长阻挡层或图案化材料。 这种衬底适用于进行横向外延过度生长以形成覆盖在沟槽腔上的桥接横向过度生长层。 桥接的横向过生长形成提供衬底表面,在衬底表面上,可以在其中制造微电子器件(例如激光二极管,高电子迁移率晶体管,紫外发光二极管以及低位错密度至关重要的其它器件)中生长外延层。 可以形成本发明的外延衬底结构,而不需要诸如常规Pendeo外延过度生长结构中所需的深沟槽。